From WikiChip
Difference between revisions of "800 nm lithography process"
(→Industry) |
(→Industry) |
||
Line 6: | Line 6: | ||
|Process Name | |Process Name | ||
|1st Production | |1st Production | ||
+ | |Metal Layers | ||
+ | | | ||
|Contacted Gate Pitch | |Contacted Gate Pitch | ||
|Interconnect Pitch (M1P) | |Interconnect Pitch (M1P) | ||
Line 12: | Line 14: | ||
{{scrolling table/mid}} | {{scrolling table/mid}} | ||
|- | |- | ||
− | ! [[Intel]] (BICMOS) !! [[Intel]] (CHMOS V) !! colspan="2" | [[Intel]] (CMOS) !! [[TI]] (CMOS) !! [[TI]] (BiCMOS) !! [[Cypress]] !! [[AMD]] !! [[Motorola]] !! [[NEC]] !! [[HP]] !! [[HP]] !! [[National Semiconductor|National]] (BiCMOS) | + | ! [[Intel]] (BICMOS) !! [[Intel]] (CHMOS V) !! colspan="2" | [[Intel]] (CMOS) !! [[TI]] (CMOS) !! [[TI]] (BiCMOS) !! [[Cypress]] !! [[AMD]] !! [[Motorola]] !! [[NEC]] !! [[HP]] !! [[HP]] !! [[National Semiconductor|National]] (ASIC BiCMOS) !! [[National Semiconductor|National]] (Memory BiCMOS) |
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | | || || colspan="2" | P650 || || || || || || || CMOS26B || CMOS26G || ABiC IV | + | | || || colspan="2" | P650 || || || || || || || CMOS26B || CMOS26G || ABiC IV || BiCMOS III |
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | | 1991 || 1990 || colspan="2" | 1989 || 1991 || 1991 || 1989 || 1991 || 1991 || 1991 || 1991 || || | + | | 1991 || 1990 || colspan="2" | 1989 || 1991 || 1991 || 1989 || 1991 || 1991 || 1991 || 1991 || || 1990 || 1990 |
+ | |- | ||
+ | | || 2 || colspan="2" | 3 || 2 || 2 || 2 || || 3 || 2 || 3 || || 4 || 2 | ||
|- | |- | ||
− | + | ! Value !! Value !! Value !! [[1 µm]] Δ !! Value !! Value !! Value !! Value !! Value !! Value !! Value !! Value !! Value !! Value | |
|- | |- | ||
− | | ? nm || ? nm || ? nm || ?x || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm | + | | ? nm || ? nm || ? nm || ?x || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm |
|- | |- | ||
− | | ? µm<sup>2</sup> || ? µm<sup>2</sup> || 111 µm<sup>2</sup> || 0.50x || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> | + | | ? nm || ? nm || ? nm || ?x || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || ? nm || 2.5 µm || 1.8 µm |
+ | |- | ||
+ | | ? µm<sup>2</sup> || ? µm<sup>2</sup> || 111 µm<sup>2</sup> || 0.50x || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || ? µm<sup>2</sup> || 100 µm<sup>2</sup> || ? µm<sup>2</sup> | ||
{{scrolling table/end}} | {{scrolling table/end}} | ||
Revision as of 06:29, 27 April 2016
The 800 nm lithography process was a semiconductor manufacturing process used by the leading integrated circuit manufacturers in early 1990s. This process was later replaced by 650 nm, 600 nm, and 500 nm processes.
Industry
Fab |
---|
Process Name |
1st Production |
Metal Layers |
|
Contacted Gate Pitch |
Interconnect Pitch (M1P) |
SRAM bit cell |
Intel (BICMOS) | Intel (CHMOS V) | Intel (CMOS) | TI (CMOS) | TI (BiCMOS) | Cypress | AMD | Motorola | NEC | HP | HP | National (ASIC BiCMOS) | National (Memory BiCMOS) | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
P650 | CMOS26B | CMOS26G | ABiC IV | BiCMOS III | |||||||||
1991 | 1990 | 1989 | 1991 | 1991 | 1989 | 1991 | 1991 | 1991 | 1991 | 1990 | 1990 | ||
2 | 3 | 2 | 2 | 2 | 3 | 2 | 3 | 4 | 2 | ||||
Value | Value | Value | 1 µm Δ | Value | Value | Value | Value | Value | Value | Value | Value | Value | Value |
? nm | ? nm | ? nm | ?x | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm |
? nm | ? nm | ? nm | ?x | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | 2.5 µm | 1.8 µm |
? µm2 | ? µm2 | 111 µm2 | 0.50x | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | 100 µm2 | ? µm2 |
800 nm Microprocessors
- Intel
- AMD
- Sun
- microSPARC I, 1992
- SuperSPARC II
- HP
- Motorola
- Cypress
- MIPS
This list is incomplete; you can help by expanding it.