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Difference between revisions of "350 nm lithography process"

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{{lithography processes}}
 
{{lithography processes}}
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The '''350 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[500 nm lithography process|500 nm process]] node. Commercial [[integrated circuit]] manufacturing using 350 nm process began in late 1995. 350 micron and was phased out and replaced by [[250 nm]] in 1998.
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The '''350 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[500 nm lithography process|500 nm process]] node. Commercial [[integrated circuit]] manufacturing using 350 nm process began in late 1995. 350 nm was phased out and replaced by [[250 nm]] in 1998.

Revision as of 06:46, 24 April 2016

basic wafer drawing.svg Semiconductor lithography processes technology
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The 350 nm lithography process is a full node semiconductor manufacturing process following the 500 nm process node. Commercial integrated circuit manufacturing using 350 nm process began in late 1995. 350 nm was phased out and replaced by 250 nm in 1998.

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