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Difference between revisions of "1 µm lithography process"

(Industry)
(Industry)
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! [[Intel]] (CHMOS IV) !! [[HP]]
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! [[Intel]] (CHMOS IV) !! [[HP]] !! [[National Semiconductor|National]] (BiCMOS)
 
|- style="text-align: center;"
 
|- style="text-align: center;"
| P648  || CMOS26
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| P648  || CMOS26 || BiCMOS III
 
|- style="text-align: center;"
 
|- style="text-align: center;"
| 1987 || 1991
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| 1987 || 1991 || 1988
 
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|-
! Value !! Value
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! Value !! Value !! Value
 
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|-
| ? nm  || ? nm  
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| ? nm  || ? nm || ? nm  
 
|-
 
|-
| ? nm  || ? nm  
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| ? nm  || ? nm || ? nm  
 
|-
 
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| 220 µm<sup>2</sup> ||  ? µm<sup>2</sup>  
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| 220 µm<sup>2</sup> ||  ? µm<sup>2</sup>  ||  ? µm<sup>2</sup>  
 
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Revision as of 06:31, 27 April 2016

The 1 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990s and was replaced by 800 nm, 650 nm, and 600 nm processes.

Industry

Fab
Process Name​
1st Production​
 ​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Intel (CHMOS IV) HP National (BiCMOS)
P648 CMOS26 BiCMOS III
1987 1991 1988
Value Value Value
 ? nm  ? nm  ? nm
 ? nm  ? nm  ? nm
220 µm2  ? µm2  ? µm2

1 µm Microprocessors

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1 µm Microcontrollers

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