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Difference between revisions of "16 nm lithography process"
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== Industry == | == Industry == | ||
− | + | {{scrolling table/top|style=text-align: right; | first=Fab | |
− | + | | | |
− | { | + | |Fin Pitch |
+ | |Fin Width | ||
+ | |Fin Height | ||
+ | |Contacted Gate Pitch | ||
+ | |Interconnect Pitch (M1P) | ||
+ | |SRAM bit cell | ||
+ | }} | ||
+ | {{scrolling table/mid}} | ||
|- | |- | ||
− | | | + | ! colspan="2" | [[TSMC]] |
|- | |- | ||
− | + | ! Value !! [[20 nm]] Δ | |
|- | |- | ||
− | | | + | | 48 nm || rowspan="3" | N/A |
|- | |- | ||
− | | | + | | ? nm |
|- | |- | ||
− | | | + | | ? nm |
− | + | |- | |
+ | | 90 nm || 1.03x | ||
+ | |- | ||
+ | | 64 nm || 1.00x | ||
+ | |- | ||
+ | | 0.07 µm<sup>2</sup> || 0.55x | ||
+ | {{scrolling table/end}} | ||
== 16 nm Microprocessors== | == 16 nm Microprocessors== |
Revision as of 04:53, 24 April 2016
The 16 nm lithography process is a full node semiconductor manufacturing process following the 20 nm process stopgap. Commercial integrated circuit manufacturing using 16 nm process began in 2014. This technology is set to replaced by 14 nm process (HN) (2014) and 10 nm process (FN) in 2017.
Industry
Fab |
---|
|
Fin Pitch |
Fin Width |
Fin Height |
Contacted Gate Pitch |
Interconnect Pitch (M1P) |
SRAM bit cell |
16 nm Microprocessors
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16 nm System on Chips
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16 nm Microarchitectures
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