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Difference between revisions of "1.5 µm lithography process"

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{{Lithography processes}}
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{{lithography processes}}
The '''1.5μm lithography process''' was the semiconductor process technology used by some semiconductor companies between 1982 to 1985.
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The '''1.5 µm lithography process''' was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. By the late 80s this process was replaced by [[1.3 µm]], [[1.2 µm]], and [[1 µm]] processes.
  
== Microprocessors ==
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== Industry ==
* [[Intel 80286]]
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Intel's 1.5 µm (''P646'') was done wit 125 mm wafers. A second enhanced version in 1985 was increased to a 150 mm wafer size.
* [[Intel 80386]]
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{{scrolling table/top|style=text-align: right; | first=Fab
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|Process Name
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|1st Production
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| 
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|Contacted Gate Pitch
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|Interconnect Pitch (M1P)
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|SRAM bit cell
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}}
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{{scrolling table/mid}}
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|-
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! [[Intel]] (CHMOS III) || [[Intel]]
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|- style="text-align: center;"
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| P646  || P646
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|- style="text-align: center;"
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| 1982 || 1985
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|-
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! Value !! Value
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|-
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| ? nm  || ? nm
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|-
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| ? nm  || ? nm
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|-
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| ? µm<sup>2</sup> ||  ? µm<sup>2</sup>
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{{scrolling table/end}}
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== 1.5 µm Microprocessors ==
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* Intel
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** {{intel|80286}}
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** {{intel|80386 DX}}
  
{{stub}}
 
 
[[Category:Lithography]]
 
[[Category:Lithography]]

Revision as of 22:19, 24 April 2016

The 1.5 µm lithography process was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. By the late 80s this process was replaced by 1.3 µm, 1.2 µm, and 1 µm processes.

Industry

Intel's 1.5 µm (P646) was done wit 125 mm wafers. A second enhanced version in 1985 was increased to a 150 mm wafer size.

Fab
Process Name​
1st Production​
 ​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Intel (CHMOS III) Intel
P646 P646
1982 1985
Value Value
 ? nm  ? nm
 ? nm  ? nm
 ? µm2  ? µm2

1.5 µm Microprocessors