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Difference between revisions of "1.5 µm lithography process"
m (Inject moved page 1.5μm lithography process to 1.5 µm lithography process) |
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− | {{ | + | {{lithography processes}} |
− | The '''1. | + | The '''1.5 µm lithography process''' was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. By the late 80s this process was replaced by [[1.3 µm]], [[1.2 µm]], and [[1 µm]] processes. |
− | == | + | == Industry == |
− | + | Intel's 1.5 µm (''P646'') was done wit 125 mm wafers. A second enhanced version in 1985 was increased to a 150 mm wafer size. | |
− | + | {{scrolling table/top|style=text-align: right; | first=Fab | |
+ | |Process Name | ||
+ | |1st Production | ||
+ | | | ||
+ | |Contacted Gate Pitch | ||
+ | |Interconnect Pitch (M1P) | ||
+ | |SRAM bit cell | ||
+ | }} | ||
+ | {{scrolling table/mid}} | ||
+ | |- | ||
+ | ! [[Intel]] (CHMOS III) || [[Intel]] | ||
+ | |- style="text-align: center;" | ||
+ | | P646 || P646 | ||
+ | |- style="text-align: center;" | ||
+ | | 1982 || 1985 | ||
+ | |- | ||
+ | ! Value !! Value | ||
+ | |- | ||
+ | | ? nm || ? nm | ||
+ | |- | ||
+ | | ? nm || ? nm | ||
+ | |- | ||
+ | | ? µm<sup>2</sup> || ? µm<sup>2</sup> | ||
+ | {{scrolling table/end}} | ||
+ | |||
+ | == 1.5 µm Microprocessors == | ||
+ | * Intel | ||
+ | ** {{intel|80286}} | ||
+ | ** {{intel|80386 DX}} | ||
− | |||
[[Category:Lithography]] | [[Category:Lithography]] |
Revision as of 22:19, 24 April 2016
The 1.5 µm lithography process was the semiconductor process technology used by the major semiconductor companies in the mid 1980s. By the late 80s this process was replaced by 1.3 µm, 1.2 µm, and 1 µm processes.
Industry
Intel's 1.5 µm (P646) was done wit 125 mm wafers. A second enhanced version in 1985 was increased to a 150 mm wafer size.
Fab |
---|
Process Name |
1st Production |
|
Contacted Gate Pitch |
Interconnect Pitch (M1P) |
SRAM bit cell |