Latest revision as of 22:04, 20 May 2018

Semiconductor lithography processes technology

1 nm 2 nm 3 nm 5 nm 7 nm 10 nm 14 nm 16 nm 20 nm 22 nm 28 nm 32 nm 40 nm 45 nm 55 nm 65 nm 80 nm 90 nm 110 nm 130 nm 150 nm 180 nm 220 nm 240 nm 250 nm 280 nm 350 nm 500 nm 600 nm 650 nm 700 nm 750 nm 800 nm 1 µm 1.2 µm 1.3 µm 1.5 µm 2 µm 2.5 µm 3 µm 3.5 µm 5 µm 6 µm 7 µm 8 µm 10 µm 16 µm 20 µm 50 µm

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The 3 μm lithography process was the semiconductor process technology used by some semiconductor companies during the mid 1970s to the mid 1980s.

Industry[edit]

3 μm Microprocessors[edit]

• Intel
  • 8085
  • 8086
  • 8088
  • 80186
• Novix NC4016
• Dec
  • MicroVAX 78032
• Siemens
  • SAB 80199
• Fairchild
  • 6800
• Toshiba
  • 8085
• National
  • COPS II
• ARM
  • ARM1

This list is incomplete; you can help by expanding it.

3 μm Microcontrollers[edit]

• Intel
  • MCS-41
  • MCS-48
  • MCS-51

3 μm Chips[edit]

• Intel
  • 8087
  • 8089
  • 8220
• National
  • 32081
• AMD
  • 2901

References[edit]

• Hitachi
  • Sakai, Yoshio, et al. "High packing density, high speed CMOS (Hi-CMOS) device technology." Japanese Journal of Applied Physics 18.S1 (1979): 73.
  • Minato, O., et al. "A Hi-CMOSII 8Kx8 bit static RAM." IEEE Journal of Solid-State Circuits 17.5 (1982): 793-798.
  • Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.