Semiconductor & Computer Engineering
From WikiChip
Difference between revisions of "2 µm lithography process"
(→Industry) |
|||
| Line 26: | Line 26: | ||
| ? µm || ? µm || ? µm || ? µm || ? µm || ? µm || ? µm || 2 µm || 0.67x | | ? µm || ? µm || ? µm || ? µm || ? µm || ? µm || ? µm || 2 µm || 0.67x | ||
|- | |- | ||
| − | | ? µm || ? µm || ? µm || ? µm || ? µm || ? µm || ? µm || 3 µm || | + | | ? µm || ? µm || ? µm || ? µm || ? µm || ? µm || ? µm || 3 µm || 1.00x |
|- | |- | ||
| ? µm² || ? µm² || ? µm² || ? µm² || ? µm² || ? µm² || ? µm² || 303.8 µm² || 0.34x | | ? µm² || ? µm² || ? µm² || ? µm² || ? µm² || ? µm² || ? µm² || 303.8 µm² || 0.34x | ||
Revision as of 05:47, 4 April 2017
Semiconductor lithography processes technology
The 2 µm lithography process was the semiconductor process technology used by the some semiconductor companies in the mid to late 1980s. By the mid 80s this process was replaced by 1.5 µm, 1.3 µm, and 1.2 µm processes.
Industry
| Fab |
|---|
| Process Name |
| 1st Production |
| Voltage |
| |
| Gate Length |
| Interconnect Pitch (M1P) |
| SRAM bit cell |
| Intel | Intel | Toshiba | STMicro | Motorola | TI | AMD | Hitachi | |
|---|---|---|---|---|---|---|---|---|
| P414.1 (HMOS-II) | P421.X (HMOS-E) | BCD-Offline | Hi-CMOS II | |||||
| 1980 | 1980 | 1986 | 1992 | 1982 | ||||
| 5 V | ||||||||
| Value | Value | Value | Value | Value | Value | Value | Value | 65 nm Δ |
| ? µm | ? µm | ? µm | ? µm | ? µm | ? µm | ? µm | 2 µm | 0.67x |
| ? µm | ? µm | ? µm | ? µm | ? µm | ? µm | ? µm | 3 µm | 1.00x |
| ? µm² | ? µm² | ? µm² | ? µm² | ? µm² | ? µm² | ? µm² | 303.8 µm² | 0.34x |
Microprocessors
This list is incomplete; you can help by expanding it.
References
- Minato, O., et al. "A Hi-CMOSII 8Kx8 bit static RAM." IEEE Journal of Solid-State Circuits 17.5 (1982): 793-798.
- Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.