Semiconductor & Computer Engineering
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Difference between revisions of "800 nm lithography process"
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* AMD | * AMD | ||
** {{amd|80386}} | ** {{amd|80386}} | ||
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** {{sun|microSPARC I}}, 1992 | ** {{sun|microSPARC I}}, 1992 | ||
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** {{mips|R4000}} | ** {{mips|R4000}} | ||
{{expand list}} | {{expand list}} | ||
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| + | == 800 nm System on chips == | ||
| + | * AMD | ||
| + | ** {{amd|Am286ZX/LX}} | ||
[[Category:Lithography]] | [[Category:Lithography]] | ||
Revision as of 05:38, 24 May 2016
Semiconductor lithography processes technology
The 800 nanometer (800 nm) lithography process was a semiconductor manufacturing process used by a variety of integrated circuit manufacturers in early 1990s. This process was later replaced by 650 nm, 600 nm, and 500 nm processes.
Industry
| Fab |
|---|
| Process Name |
| 1st Production |
| Metal Layers |
| |
| Contacted Gate Pitch |
| Interconnect Pitch (M1P) |
| SRAM bit cell |
| Intel (BICMOS) | Intel (CHMOS V) | TI (CMOS) | TI (BiCMOS) | Cypress | AMD | Motorola | NEC | HP | HP | National (ASIC BiCMOS) | National (Memory BiCMOS) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| P650 | CMOS26B | CMOS26G | ABiC IV | BiCMOS III | ||||||||
| 1991 | 1989 | 1991 | 1991 | 1989 | 1989 | 1991 | 1991 | 1991 | 1990 | 1990 | ||
| 3 | 2 | 2 | 2 | 3 | 2 | 3 | 4 | 2 | ||||
| Value | Value | 1 µm Δ | Value | Value | Value | Value | Value | Value | Value | Value | Value | Value |
| ? nm | ? nm | ?x | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm |
| ? nm | ? nm | ?x | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | ? nm | 2.5 µm | 1.8 µm |
| ? µm2 | 111 µm2 | 0.50x | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | ? µm2 | 100 µm2 | ? µm2 |
800 nm Microprocessors
- Intel
- AMD
- Sun
- microSPARC I, 1992
- SuperSPARC II
- HP
- Motorola
- Cypress
- MIPS
This list is incomplete; you can help by expanding it.
800 nm System on chips
- AMD