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Difference between revisions of "350 nm lithography process"

(Industry)
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Revision as of 15:35, 24 April 2016

The 350 nm lithography process is a full node semiconductor manufacturing process following the 500 nm process node. Commercial integrated circuit manufacturing using 350 nm process began in late 1995. 350 nm was phased out and replaced by 250 nm in 1999.

Industry

Fab
Type​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Intel
Value
550 nm
880 nm
18.1 µm2

Design Rules

350 nm Microprocessors

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350 nm Microarchitectures

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