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Difference between revisions of "20 nm lithography process"
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| 64 nm || 0.67x || 67 nm || 0.70x | | 64 nm || 0.67x || 67 nm || 0.70x | ||
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− | | ? µm<sup>2</sup> || ?x || 0.07 µm<sup>2</sup> || 0. | + | | ? µm<sup>2</sup> || ?x || 0.07 µm<sup>2</sup> || 0.55x |
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Revision as of 04:31, 24 April 2016
The 20 nm lithography process is a half-node semiconductor manufacturing process used as a stopgap between the 22 nm and 16 nm processes. Commercial integrated circuit manufacturing using 20 nm process began in 2014. This technology superseded by commercial 16 nm process.
Industry
Fab |
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Contacted Gate Pitch |
Interconnect Pitch (M1P) |
SRAM bit cell |
Samsung | TSMC | ||
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Value | 28 nm Δ | Value | 28 nm Δ |
64 nm | 0.71x | 87 nm | 0.71x |
64 nm | 0.67x | 67 nm | 0.70x |
? µm2 | ?x | 0.07 µm2 | 0.55x |
20 nm Microprocessors
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20 nm System on Chips
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20 nm Microarchitectures
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