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Difference between revisions of "32 nm lithography process"

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{{lithography processes}}
 
The '''32 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[40 nm lithography process|40 nm process]] stopgap. Commercial [[integrated circuit]] manufacturing using 32 nm process began in 2010. This technology was superseded by the [[28 nm lithography process|28 nm process]] (HN) / [[22 nm lithography process|22 nm process]] (FN) in 2012.
 
The '''32 nm lithography process''' is a [[technology node|full node]] semiconductor manufacturing process following the [[40 nm lithography process|40 nm process]] stopgap. Commercial [[integrated circuit]] manufacturing using 32 nm process began in 2010. This technology was superseded by the [[28 nm lithography process|28 nm process]] (HN) / [[22 nm lithography process|22 nm process]] (FN) in 2012.
  

Revision as of 20:25, 13 April 2016

The 32 nm lithography process is a full node semiconductor manufacturing process following the 40 nm process stopgap. Commercial integrated circuit manufacturing using 32 nm process began in 2010. This technology was superseded by the 28 nm process (HN) / 22 nm process (FN) in 2012.

32 nm Microprocessors

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32 nm System on Chips

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