Latest revision as of 02:09, 17 August 2023

Semiconductor lithography processes technology

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The 90 nanometer (90 nm) lithography process is a full node semiconductor manufacturing process following the 110 nm process stopgap. Commercial integrated circuit manufacturing using 90 nm process began in 2003. This technology was superseded by the 80 nm process (HN) / 65 nm process (FN) in 2006.

Industry[edit]

Introduced in late 2002, Intel's 90 nm process became the first volume production to introduce strained silicon transistors.

90 nm Microprocessors[edit]

• AMD
  • Athlon 64
  • Athlon 64 X2
  • FX
  • Opteron
  • Turion 64
  • Turion 64 X2
• Cavium
  • OCTEON Plus
• HAL (Fujitsu)
  • SPARC64 V
• IBM
  • PowerPC 970
• Loongson
  • Godson 2
• Qualcomm
  • MSM6xxx
• Sun
  • UltraSPARC T1
• Intel
  • Pentium 4 Extreme Edition
  • Pentium M
  • Pentium D
  • EP80579
• STMicroelectronics
  • STM32 F4
  • STM32 F7
  • STM32 G0
  • STM32 G4

This list is incomplete; you can help by expanding it.

90 nm Microarchitectures[edit]

• AMD
  • K8
• ARM
  • ARM7
• IBM
  • z9
• Intel
  • Pentium M
• VIA Technologies
  • Esther

This list is incomplete; you can help by expanding it.

Documents[edit]

• Samsung foundry - 45 nm, 65 nm, 90 nm guide (August, 2007)