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  • 39 bytes (6 words) - 02:29, 17 December 2013
  • {{title|BGA-1288}}[[File:BGA-1288.svg|300px|right]] '''BGA-1288''' is a microprocessor package designed by [[Intel]] for their {{intel
    2 KB (274 words) - 18:31, 1 December 2016
  • 38 bytes (4 words) - 02:35, 17 May 2023

Page text matches

  • | socket = BGA
    4 KB (434 words) - 03:31, 15 February 2016
  • ...obile models use {{intel|BGA-1356}} socket for U-series models and {{intel|BGA-1440}} socket for H-series, are [[dual-core]] with {{intel|Hyper-Threading} ...price as previous generation. All mobile models still use soldered {{intel|BGA-1356}} socket and as with previous generation, those new mobile Core i7 chi
    43 KB (5,739 words) - 21:30, 22 April 2024
  • ...ing is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can b ...BGA Package (Cross-Sectional View).png|thumb|350px|right|Typical Flip Chip BGA Package (Cross-Sectional View)]]
    2 KB (239 words) - 07:17, 17 December 2013
  • | socket 0 = BGA-1168 | socket 0 type = BGA
    5 KB (469 words) - 16:22, 13 December 2017
  • | socket 0 = BGA-576 | socket 0 type = BGA
    3 KB (323 words) - 16:10, 13 December 2017
  • | socket = BGA
    17 KB (2,292 words) - 09:32, 16 July 2019
  • ..." | {{intel|Mobile Pentium III}} || style="background-color: #b3ffb3;" | [[BGA]]<br>[[Socket 495]] || style="background-color: #ebebe0;" | [[180 nm]] ...-color: #ffe6ff;" | {{intel|P6}} || style="background-color: #b3ffb3;" | [[BGA]]<br>[[Socket 479]] || style="background-color: #ebebe0;" | [[130 nm]] || s
    10 KB (1,057 words) - 19:30, 1 November 2021
  • | socket type = BGA
    4 KB (462 words) - 16:15, 13 December 2017
  • | socket type = BGA
    4 KB (472 words) - 16:15, 13 December 2017
  • |socket=BGA-1170 |socket type=BGA
    4 KB (475 words) - 17:42, 27 March 2018
  • | socket type = BGA
    5 KB (573 words) - 16:15, 13 December 2017
  • | socket type = BGA
    5 KB (572 words) - 16:15, 13 December 2017
  • | socket type = BGA
    6 KB (744 words) - 18:35, 14 January 2019
  • |socket type=BGA
    5 KB (736 words) - 03:44, 19 August 2023
  • | socket type = BGA
    5 KB (558 words) - 16:15, 13 December 2017
  • | socket = BGA-592 | socket 2 = BGA-1380
    3 KB (342 words) - 17:29, 3 December 2016
  • |socket=BGA-1170
    4 KB (488 words) - 19:42, 5 October 2020
  • ...duced in early [[2017]]. Those models use standard {{intel|BGA-1356|Socket BGA-1356}}. While no major new features were introduced, those Kaby Lake Celero
    25 KB (3,201 words) - 03:13, 22 September 2018
  • |socket type=BGA
    4 KB (529 words) - 17:41, 27 March 2018
  • |socket type=BGA
    5 KB (701 words) - 17:40, 27 March 2018
  • |socket type=BGA
    4 KB (540 words) - 17:40, 27 March 2018
  • |socket type=BGA
    4 KB (544 words) - 17:43, 27 March 2018
  • |socket type=BGA
    4 KB (580 words) - 09:40, 8 July 2022
  • |socket type=BGA
    5 KB (724 words) - 06:10, 2 December 2018
  • |socket type=BGA
    4 KB (539 words) - 17:39, 27 March 2018
  • |socket type=BGA
    4 KB (535 words) - 17:39, 27 March 2018
  • |socket type=BGA
    5 KB (722 words) - 01:50, 24 November 2018
  • |socket type=BGA
    4 KB (533 words) - 17:41, 27 March 2018
  • |socket type=BGA
    4 KB (539 words) - 17:39, 27 March 2018
  • | socket = BGA-1667
    13 KB (1,784 words) - 08:04, 6 April 2019
  • ...packages: [[PGA]] for mobile computers, [[LGA]] for desktop systems and [[BGA]] for small form factor systems. For each of the three different dies (see
    84 KB (13,075 words) - 00:54, 29 December 2020
  • * 540-pin BGA (Ball Grid Array)
    3 KB (325 words) - 21:34, 22 February 2020
  • ...00px|link=intel/cores/skylake_y]] || {{intel|Skylake Y|l=core}} || {{intel|BGA-1515}} || Yes || 1-chip || rowspan="2" | N/A || rowspan="2" | OPI ...00px|link=intel/cores/skylake_u]] || {{intel|Skylake U|l=core}} || {{intel|BGA-1356}} || Yes || 1-chip
    79 KB (11,922 words) - 06:46, 11 November 2022
  • ...|link=intel/cores/kaby_lake_y]] || {{intel|Kaby Lake Y|l=core}} || {{intel|BGA-1515}} || Yes || 1-chip || rowspan="3" | N/A || rowspan="3" | OPI ...res/kaby_lake_u]] || {{intel|Kaby Lake U|l=core}} || rowspan="2" | {{intel|BGA-1356}} || rowspan="2" | Yes || rowspan="2" | 1-chip
    38 KB (5,431 words) - 10:41, 8 April 2024
  • ...MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ.pdf|MOBILE PENTIUM II PROCESSOR IN BGA PACKAGE AT 366 MHZ, 333 MHZ, 300PE MHZ, AND 266PE MHZ]] ...Guide (April 1998).pdf|Mobile Pentium II Processor Mini-Cartridge 240-Pin BGA Connector Assembly Development Guide (April 1998)]]
    5 KB (635 words) - 09:54, 11 November 2017
  • | socket type 2 = BGA
    3 KB (366 words) - 16:25, 13 December 2017
  • | socket type 2 = BGA
    3 KB (360 words) - 16:25, 13 December 2017
  • | socket type 2 = BGA
    3 KB (320 words) - 16:25, 13 December 2017
  • | socket type 2 = BGA
    3 KB (309 words) - 16:25, 13 December 2017
  • | socket type 2 = BGA
    3 KB (345 words) - 16:25, 13 December 2017
  • | socket = BGA-1234
    7 KB (949 words) - 20:01, 8 August 2018
  • | socket = BGA-1234 | socket type = BGA
    6 KB (626 words) - 19:52, 6 October 2020
  • | socket = BGA-1234 | socket type = BGA
    6 KB (603 words) - 16:24, 13 December 2017
  • | socket = BGA-1234 | socket type = BGA
    6 KB (601 words) - 16:24, 13 December 2017
  • | socket = BGA-1234 | socket type = BGA
    6 KB (603 words) - 16:24, 13 December 2017
  • | socket = BGA-1234 | socket type = BGA
    6 KB (623 words) - 16:24, 13 December 2017
  • | socket = BGA-1234 | socket type = BGA
    6 KB (623 words) - 16:24, 13 December 2017
  • | socket = BGA-1234 | socket type = BGA
    6 KB (627 words) - 16:24, 13 December 2017
  • ...obile models use {{intel|BGA-1356}} socket for U-series models and {{intel|BGA-1440}} socket for H-series with the following common features:
    25 KB (3,397 words) - 03:12, 3 October 2022
  • ...obile models use {{intel|BGA-1356}} socket for U-series models and {{intel|BGA-1440}} socket for H-series, are [[dual-core]] with {{intel|Hyper-Threading} ...price as previous generation. All mobile models still use soldered {{intel|BGA-1356}} socket and as with previous generation, those new mobile Core i5 chi
    34 KB (4,663 words) - 20:38, 20 February 2023
  • | socket 0 = BGA-676 | socket 0 type = BGA
    8 KB (1,031 words) - 14:09, 10 May 2019
  • | socket 0 = BGA-868 | socket 0 type = BGA
    3 KB (367 words) - 15:16, 13 December 2017
  • | socket 0 = BGA-896 | socket 0 type = BGA
    3 KB (344 words) - 15:16, 13 December 2017
  • | socket 0 = BGA-359 | socket 0 type = BGA
    3 KB (359 words) - 16:13, 13 December 2017
  • | socket 0 = BGA-359 | socket 0 type = BGA
    3 KB (337 words) - 16:13, 13 December 2017
  • | socket 0 = BGA-359 | socket 0 type = BGA
    3 KB (331 words) - 16:13, 13 December 2017
  • | socket 0 = BGA-359 | socket 0 type = BGA
    3 KB (331 words) - 16:13, 13 December 2017
  • | socket 3 = BGA-360
    13 KB (1,969 words) - 18:07, 2 October 2019
  • | socket 0 = BGA-360 | socket 0 type = BGA
    3 KB (335 words) - 16:08, 13 December 2017
  • | socket 0 = BGA-360 | socket 0 type = BGA
    3 KB (335 words) - 16:08, 13 December 2017
  • | socket 0 = BGA-360 | socket 0 type = BGA
    3 KB (336 words) - 16:08, 13 December 2017
  • | socket 0 = BGA-360 | socket 0 type = BGA
    3 KB (335 words) - 16:08, 13 December 2017
  • | socket 0 = BGA-360 | socket 0 type = BGA
    3 KB (336 words) - 16:08, 13 December 2017
  • |socket 0=BGA-1150 |socket 0 type=BGA
    2 KB (286 words) - 14:52, 26 March 2019
  • |socket 0=BGA-1944 |socket 0 type=BGA
    2 KB (293 words) - 14:42, 26 March 2019
  • |socket=BGA-1296
    3 KB (461 words) - 18:51, 10 September 2018
  • | socket 0 = BGA-1296 | socket 0 type = BGA
    6 KB (633 words) - 16:25, 13 December 2017
  • |socket 0=BGA-1296 |socket 0 type=BGA
    5 KB (584 words) - 18:02, 9 February 2019
  • | socket 0 = BGA-1296 | socket 0 type = BGA
    6 KB (639 words) - 12:32, 9 May 2018
  • | socket 0 = BGA-1296 | socket 0 type = BGA
    6 KB (642 words) - 16:25, 13 December 2017
  • | socket 0 = BGA-1296 | socket 0 type = BGA
    7 KB (847 words) - 20:58, 21 October 2023
  • | socket 0 = BGA-1296 | socket 0 type = BGA
    7 KB (837 words) - 23:15, 25 August 2019
  • |socket 0=BGA-1517 |socket 0 type=BGA
    2 KB (343 words) - 03:48, 20 October 2018
  • |socket 0=BGA-2397 |socket 0 type=BGA
    3 KB (403 words) - 11:15, 22 September 2018
  • | socket 3 = BGA-349
    5 KB (730 words) - 19:14, 27 October 2018
  • | socket 0 = BGA-1296 | socket 0 type = BGA
    6 KB (619 words) - 16:15, 13 December 2017
  • | socket 0 = BGA-1296 | socket 0 type = BGA
    6 KB (623 words) - 05:09, 24 October 2019
  • | socket 0 = BGA-1296 | socket 0 type = BGA
    6 KB (619 words) - 16:15, 13 December 2017
  • | socket 0 = BGA-1168 | socket 0 type = BGA
    5 KB (531 words) - 16:15, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (563 words) - 16:22, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (558 words) - 16:22, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    5 KB (580 words) - 12:03, 26 March 2020
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (571 words) - 16:22, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (560 words) - 16:22, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    5 KB (573 words) - 16:22, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (571 words) - 16:22, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (567 words) - 16:22, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (569 words) - 16:23, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (558 words) - 16:22, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (572 words) - 16:22, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    5 KB (575 words) - 16:19, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (558 words) - 16:19, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    5 KB (575 words) - 07:19, 5 August 2019
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (556 words) - 16:19, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    5 KB (581 words) - 04:07, 31 March 2020
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (561 words) - 16:19, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    5 KB (584 words) - 10:47, 24 March 2019
  • | package module 2 = {{packages/intel/bga-1288}}
    5 KB (568 words) - 03:00, 15 September 2019
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (556 words) - 16:19, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    5 KB (568 words) - 16:19, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    5 KB (568 words) - 17:18, 26 November 2018
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (556 words) - 16:19, 13 December 2017
  • {{title|BGA-1288}}[[File:BGA-1288.svg|300px|right]] '''BGA-1288''' is a microprocessor package designed by [[Intel]] for their {{intel
    2 KB (274 words) - 18:31, 1 December 2016
  • | package module 2 = {{packages/intel/bga-1288}}
    4 KB (548 words) - 16:17, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (537 words) - 16:17, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    4 KB (555 words) - 16:17, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (536 words) - 16:17, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    4 KB (553 words) - 10:07, 16 September 2021
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (546 words) - 16:17, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    4 KB (533 words) - 16:25, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    4 KB (533 words) - 23:15, 12 November 2020
  • | package module 2 = {{packages/intel/bga-1288}}
    4 KB (533 words) - 16:25, 13 December 2017
  • | package module 2 = {{packages/intel/bga-1288}}
    4 KB (533 words) - 16:25, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (527 words) - 16:25, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (527 words) - 16:25, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (532 words) - 16:16, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (527 words) - 16:16, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (532 words) - 16:16, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (527 words) - 16:16, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (570 words) - 16:22, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    4 KB (559 words) - 16:19, 13 December 2017
  • | package module 1 = {{packages/intel/bga-1288}}
    5 KB (570 words) - 16:22, 13 December 2017
  • | socket = BGA-1521 | socket 2 = BGA-868
    11 KB (1,489 words) - 09:25, 30 December 2020
  • | package 0 = BGA-350 | package 0 type = BGA
    4 KB (438 words) - 16:10, 13 December 2017
  • | package 0 = BGA-350 | package 0 type = BGA
    4 KB (438 words) - 16:10, 13 December 2017
  • | package 0 = BGA-350 | package 0 type = BGA
    4 KB (438 words) - 16:10, 13 December 2017
  • | package 0 = BGA-350 | package 0 type = BGA
    4 KB (422 words) - 16:10, 13 December 2017
  • | package 0 = BGA-350 | package 0 type = BGA
    4 KB (422 words) - 16:10, 13 December 2017
  • | package 0 = BGA-350 | package 0 type = BGA
    4 KB (422 words) - 16:10, 13 December 2017
  • | package 0 = BGA-525 | package 0 type = BGA
    4 KB (465 words) - 16:10, 13 December 2017
  • | package 0 = BGA-525 | package 0 type = BGA
    4 KB (465 words) - 16:10, 13 December 2017
  • | package 0 = BGA-525 | package 0 type = BGA
    4 KB (465 words) - 16:10, 13 December 2017
  • | package 0 = BGA-525 | package 0 type = BGA
    4 KB (449 words) - 16:10, 13 December 2017
  • | package 0 = BGA-525 | package 0 type = BGA
    4 KB (449 words) - 16:10, 13 December 2017
  • | package 0 = BGA-525 | package 0 type = BGA
    4 KB (449 words) - 16:10, 13 December 2017
  • | socket = BGA-1521
    6 KB (827 words) - 15:41, 29 December 2016
  • |socket=BGA-1515 ...allowing for 4 GT/s transfer rate. KBL-Y chips use {{intel|BGA-1515|Socket BGA-1515}}.
    4 KB (594 words) - 06:30, 6 April 2019
  • ...GT/s transfer rate. All Kaby Lake U processors use {{intel|BGA-1356|Socket BGA-1356}} and all Iris models include 64 MiB of side cache.
    6 KB (820 words) - 14:10, 29 February 2020
  • |socket=BGA-1440 ...roprocessor]] and the [[chipset]]. Kaby Lake H are {{intel|BGA-1440|Socket BGA-1440}} and use {{intel|Union Point}} chipset ({{intel|Platform Controller H
    5 KB (699 words) - 13:43, 8 April 2018
  • | socket 0 = BGA-452 | socket 0 type = BGA
    4 KB (461 words) - 16:31, 13 December 2017
  • | socket 0 = BGA-741 | socket 0 type = BGA
    4 KB (455 words) - 16:31, 13 December 2017
  • | socket 0 = BGA-741 | socket 0 type = BGA
    5 KB (591 words) - 16:31, 13 December 2017
  • | socket = BGA-437 | socket 2 = BGA-441
    4 KB (503 words) - 05:54, 15 April 2017
  • | socket = BGA-1088
    1 KB (118 words) - 05:10, 3 April 2017
  • | socket = BGA-1088
    1 KB (122 words) - 01:04, 3 April 2017
  • .../s transfer rate. All Coffee Lake U processors use {{intel|BGA-1356|Socket BGA-1528}} and incorporate 128 MiB of side cache.
    4 KB (553 words) - 23:05, 12 May 2020
  • |socket=BGA-1515 ...lowing for a 4 GT/s transfer rate. SKL-Y chips use {{intel|BGA-1515|Socket BGA-1515}}.
    4 KB (571 words) - 06:30, 6 April 2019
  • | socket = BGA-1440 ...icroprocessor]] and the [[chipset]]. Skylake H are {{intel|BGA-1440|Socket BGA-1440}} and use {{intel|Sunrise Point}} chipset ({{intel|Platform Controller
    5 KB (630 words) - 02:08, 16 January 2019
  • |socket=BGA-1356 ...4 GT/s transfer rate. All Skylake U processors use {{intel|BGA-1356|Socket BGA-1356}} and all Iris models include 64 MiB of side cache.
    5 KB (743 words) - 08:07, 21 August 2017
  • ...microprocessor]] and the [[chipset]]. Coffee Lake H are {{intel|FCBGA-1440|BGA-1440}} and use 300-series chipset ({{intel|Platform Controller Hub|HUB}}).
    5 KB (648 words) - 17:43, 6 December 2018
  • ...GT/s transfer rate. All Kaby Lake R processors use {{intel|BGA-1356|Socket BGA-1356}}.
    5 KB (751 words) - 09:52, 11 February 2019
  • |package name=amd/packages/bga-2409 [[Category:all ic packages]]{{#set:package=BGA-2409|package type=FC-OBGA}}
    15 KB (2,390 words) - 02:54, 17 May 2023
  • |package module 1={{packages/sun microsystems/bga-521}}
    1 KB (171 words) - 16:32, 13 December 2017
  • |package module 1={{packages/sun microsystems/bga-521}}
    1 KB (193 words) - 16:32, 13 December 2017
  • |package module 1={{packages/sun microsystems/bga-521}}
    1 KB (167 words) - 16:32, 13 December 2017
  • |package module 1={{packages/sun microsystems/bga-521}}
    1 KB (179 words) - 16:32, 13 December 2017
  • ...ging two extreme core count (XCC) dies together on the same substrate in a BGA package. The two dies are interconnected through 1 {{intel|UPI}} link which Cascade Lake AP uses a high-density high-performance ball grid array (BGA) package. It has 5,903 balls at a 0.99 mm pitch. There are two separate pow
    32 KB (4,535 words) - 05:44, 9 October 2022
  • ** BGA with 3,325 pins
    11 KB (1,646 words) - 13:35, 26 April 2020
  • ...p solution - the [[microprocessor]] and the [[chipset]]. Those parts are [[BGA]] and are soldered onto the motherboard. The microprocessor is connected to * BGA package
    5 KB (728 words) - 18:07, 12 July 2018
  • All processors are a single-socket {{intel|BGA-2518}} package, manufacturing on Intel's [[14 nm process|14nm+ process]] ba
    6 KB (774 words) - 01:49, 25 February 2019
  • [[File:myriad 1 bga.png|right|200px]] Movidius packaged those chips in an 8x8 mm [[BGA]] package with 225 [[solder ball|balls]]. The die is then bumped on top of
    12 KB (1,749 words) - 19:05, 20 January 2021
  • ...d|Enhanced Jaguar|l=arch}} || 0x7 || 0xF || ? || ? || ?, 8C, 16&nbsp;nm || BGA-2409<ref name="isscc-xboxsx">Paternoster, Paul; Maki, Andy; Hernandez, Andr
    21 KB (3,215 words) - 13:50, 24 July 2023
  • * 20mm x 20mm (4 cm²) BGA package
    2 KB (269 words) - 04:18, 26 August 2018
  • ...allowing for 4 GT/s transfer rate. AML-Y chips use {{intel|BGA-1515|Socket BGA-1515}}.
    4 KB (538 words) - 09:43, 27 July 2020
  • ...prise of two {{intel|Cascade Lake|l=arch}} dies packaged together a single BGA-5903 substrate. Those processors support up to 56 cores, 112 threads, and u
    4 KB (612 words) - 18:46, 1 February 2020
  • ...small market segment. AMD actually designed a more compact dual-die {{abbr|BGA}} package {{\\|SP4}} for {{amd|epyc embedded#3000 Series (Zen)|EPYC 3000}}
    86 KB (17,313 words) - 02:48, 13 March 2023
  • Contemporary mobile and embedded processors use the {{abbr|BGA}}
    110 KB (21,122 words) - 02:46, 13 March 2023
  • ...microprocessor]] and the [[chipset]]. Coffee Lake H are {{intel|FCBGA-1440|BGA-1440}} and use 300-series chipset ({{intel|Platform Controller Hub|HUB}}).
    4 KB (507 words) - 07:45, 5 May 2019
  • | package = 1676 BGA
    4 KB (483 words) - 18:35, 1 February 2019
  • All processors are a single-socket {{intel|BGA-1667}} package, manufacturing on Intel's [[14 nm process]] based on the {{i
    6 KB (792 words) - 07:02, 6 April 2019
  • All processors are a single-socket {{intel|BGA-1667}} package, manufacturing on Intel's [[14 nm process]] based on the {{i
    6 KB (784 words) - 08:28, 10 January 2022
  • * BGA-1517
    12 KB (1,895 words) - 10:17, 27 March 2020
  • ...e slightly thinner (0.25") and are designed for QFPs, TQFPs, QFN, CSP, and BGA kind of packages while tall profile trays (0.40") are designed for PGA and
    1 KB (186 words) - 20:52, 17 May 2020
  • '''ASB1''' was a BGA-812 package for low power [[AMD]] mobile microprocessors with an :[[File:BGA-812 ASB1 diag.svg]]
    3 KB (481 words) - 16:24, 16 March 2023
  • '''ASB2''' was a BGA-812 package for low power [[AMD]] mobile microprocessors with an :[[File:BGA-812 ASB2 30532 diag.svg]]
    4 KB (527 words) - 16:25, 16 March 2023
  • :[[File:BGA-413 diag.svg|800px]] :[[File:BGA-413 pn.svg|800px]]
    14 KB (2,611 words) - 00:31, 4 April 2022
  • |package name=BGA-769 '''FT3''' is a '''BGA-769''' package for low power [[AMD]] mobile and embedded microprocessors wi
    5 KB (645 words) - 16:31, 16 March 2023
  • |package name=BGA-769 '''FT3b''' is a '''BGA-769''' package for low power [[AMD]] microprocessors with an integrated nor
    4 KB (610 words) - 16:33, 16 March 2023
  • |package name=BGA-769 '''FT4''' is a '''BGA-769''' package for low power [[AMD]] mobile microprocessors with an integra
    4 KB (543 words) - 16:33, 16 March 2023
  • ...for mobile platforms, newer AMD mobile processors are only available in a BGA package.
    5 KB (755 words) - 13:50, 7 September 2020
  • |package name 2=BGA-827 ...[[AMD]] mobile and embedded microprocessors with integrated graphics, the BGA counterpart to the PGA-722 package for {{\\|Socket FS1r2}}. For desktop pro
    4 KB (641 words) - 23:21, 25 March 2023
  • |package name 2=BGA-854 '''FP3''' is a BGA-854 package for [[AMD]] mobile and embedded microprocessors with integrated
    5 KB (630 words) - 23:22, 25 March 2023
  • |package name=BGA-1021 '''SP1''' was a '''BGA-1021''' package for [[AMD]] server microprocessors codenamed {{amd|Seattle|
    3 KB (404 words) - 16:38, 16 March 2023
  • |package name 2=BGA-968 ...of these SOCs are also available in the smaller {{\\|FT3b}} and {{\\|FT4}} BGA packages and in PGA packages for {{\\|Socket FM2+}} and {{\\|Socket AM4}}.
    5 KB (679 words) - 23:22, 25 March 2023
  • '''FP5''' is a BGA-1140 package for [[AMD]] mobile and embedded microprocessors with an integr :[[File:BGA-1140 RR diag.svg]]
    5 KB (642 words) - 23:22, 25 March 2023
  • ! Type<ref>PGA = Pin Grid Array, BGA = Ball Grid Array (CPU package soldered directly to the motherboard), LGA = ...}||2009||BGA||812||NPT 0Fh||144 bit DDR2||16 HT1||{{tchk|no}}||-||||[[File:BGA-812.svg|x50px]]
    17 KB (2,543 words) - 03:01, 17 May 2023
  • :[[File:BGA-1140 FP6 Renoir diag.svg]] [[:File:BGA-1140 FP6 pn.svg|FP6 package ball numbers]]
    20 KB (3,273 words) - 17:47, 10 May 2023
  • ...Like its predecessor "Renoir" it is available in the {{amd|FP6|l=package}} BGA package.
    4 KB (518 words) - 14:33, 17 March 2023
  • {{amd|Socket AM4|l=package}} and the {{amd|FP6|l=package}} BGA package.
    7 KB (1,000 words) - 14:34, 17 March 2023