From WikiChip
1.2 µm lithography process
Revision as of 04:38, 4 April 2017 by Inject (talk | contribs)

The 1.2 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990s and was replaced by 1 µm, 800 nm, and 650 nm processes.


Process Name​
1st Production​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell
Intel NEC
1987 1988
Value Value
 ? nm  ? nm
 ? nm  ? nm
 ? µm2  ? µm2

1.2 µm Microprocessors

This list is incomplete; you can help by expanding it.


  • Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.