The 1.2 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990s and was replaced by 1 µm, 800 nm, and 650 nm processes.
|Contacted Gate Pitch|
|Interconnect Pitch (M1P)|
|SRAM bit cell|
1.2 µm Microprocessors
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- Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.