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From WikiChip
1.2 µm lithography process
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The 1.2 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990s and was replaced by 1 µm, 800 nm, and 650 nm processes.
Industry
| Fab |
|---|
| Process Name |
| 1st Production |
| Voltage |
| |
| Contacted Gate Pitch |
| Interconnect Pitch (M1P) |
| SRAM bit cell |
| Intel | NEC | Hitachi |
|---|---|---|
| Hi-CMOS III | ||
| 1987 | 1988 | |
| 5 V | ||
| Value | Value | Value |
| ? µm | ? µm | 1.2 µm |
| ? µm | ? µm | 1.3 µm |
| ? µm² | ? µm² | ? µm² |
1.2 µm Microprocessors
This list is incomplete; you can help by expanding it.
References
- Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.