The 90 nm lithography process is a full node semiconductor manufacturing process following the 110 nm process stopgap. Commercial integrated circuit manufacturing using 90 nm process began in 2003. This technology was superseded by the 80 nm process (HN) / 65 nm process (FN) in 2006.

Industry

Fab
Process Name​
1st Production​
Type​
​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
SRAM bit cell​
DRAM bit cell

Intel		TSMC		Samsung		Fujitsu		IBM / Toshiba / Sony / AMD / Chartered
P1262						CS-100 / CS-101
2002		2003		2003		2004		2003
Bulk								PDSOI
Value	130 nm Δ	Value	130 nm Δ	Value	130 nm Δ	Value	130 nm Δ	Value	130 nm Δ
260 nm	0.82x	240 nm	0.77x	245 nm	0.70x	? nm	?x	? nm	?x
220 nm	0.63x	240 nm	0.71x	245 nm	0.70x	? nm	?x	? nm	?x
1.0 µm2	0.50x	0.999 µm2	0.47x	0.999 µm2	?x	1.07 µm2	0.54x	0.999 µm2	?x
								0.19 µm2	?x

90 nm Microprocessors

This list is incomplete; you can help by expanding it.

90 nm System on Chips

• Intel
  • Pentium 4 Extreme Edition
  • Pentium M
  • Pentium D

This list is incomplete; you can help by expanding it.

90 nm Microarchitectures

This list is incomplete; you can help by expanding it.