The 1.3 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1.3 µm was phased out in the early 1990s and was replaced by 1 µm, 800 nm, and 650 nm processes.

Industry

Fab
Process Name​
1st Production​
Voltage​
​
Gate Length​
Interconnect Pitch (M1P)​
SRAM bit cell

Motorola	Hitachi		Fujitsu
	Hi-CMOS III
1987	1987
	5 V
Value	Value	2 µm Δ	Value
? nm	1.2 µm	0.60x	? nm
? nm	1.3 µm	0.43x	nm
? µm²	? µm²		? µm²

1.3 µm Microprocessors

• Motorola
  • 68030, "Micro 32"
• Sun
  • MB86900

This list is incomplete; you can help by expanding it.

References

• Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.