The 240 nm lithography process is was semiconductor manufacturing process following the 350 nm process. Commercial integrated circuit manufacturing using 240 process began in late 1990s. 240 nm and was phased out and later replaced by 220 nm and 180 nm processes.

Industry

Fab
Process Name​
1st Production​
Contacted Gate Pitch​
Interconnect Pitch (M1P)​
Metal Layers​
SRAM bit cell

Fujitsu
CS-70
1997
? nm
? nm
5
? µm2

240 nm Microprocessors

• HAL (Fujitsu)
  • SPARC64 GP

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