From WikiChip
10 µm lithography process
Revision as of 03:04, 26 April 2016 by Inject (talk | contribs)

The 10 µm lithography process was the semiconductor process technology used by the major semiconductor companies during the years of 1967 and 1973. The typical wafer size for this process at companies such as Fairchild and TI were 1.5 inch (38 mm).

Industry

Fab
Process Name​
1st Production​
Contacted Gate Pitch​
Interconnect Pitch​
Metal Layers​
Technology
Intel TI RCA Fairchild
 
1970 1969 1969
 ? nm  ? nm  ? nm  ? nm
 ? nm  ? nm  ? nm  ? nm
2 2 2 2
PMOS PMOS PMOS PMOS

10 µm Microprocessors

Click to browse all 10 µm models

This list is incomplete; you can help by expanding it.


Text document with shapes.svg This article is still a stub and needs your attention. You can help improve this article by editing this page and adding the missing information.