Revision as of 02:53, 27 April 2016

Semiconductor lithography processes technology

1 nm • 18A 2 nm • 3 nm 5 nm • 7 nm 10 nm • 12 nm 14 nm • 16 nm 20 nm • 22 nm 28 nm • 32 nm 40 nm • 45 nm 55 nm • 65 nm 80 nm • 90 nm 110 nm • 130 nm 150 nm • 180 nm 220 nm • 240 nm 250 nm • 280 nm 350 nm • 500 nm 600 nm • 650 nm 700 nm • 750 nm 800 nm 1 µm • 1.2 µm 1.3 µm • 1.5 µm 2 µm • 2.5 µm 3 µm • 3.5 µm 5 µm • 6 µm 7 µm • 8 µm 10 µm • 16 µm 20 µm • 50 µm

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The 65 nm lithography process is a full node semiconductor manufacturing process following the 80 nm process stopgap. Commercial integrated circuit manufacturing using 65 nm process began in 2005. This technology was superseded by the 55 nm process (HN) / 45 nm process (FN) in 2007.

Industry

Design Rules

65 nm Microprocessors

• AMD
  • Athlon 64 X2
  • Athlon X2
  • Opteron
  • Phenom
  • Turion 64 X2
• Fujitsu
  • SPARC64 VII
• IBM
  • Power6
• Intel
  • Celeron
  • Core 2 Duo
  • Core 2 Extreme
  • Core 2 Quad
  • Core 2 Quad Extreme
  • Core Duo
  • Pentium 4
  • Pentium D
  • Pentium Extreme Edition
  • Pentium Dual-Core
  • Xeon
• Sun
  • UltraSPARC T2

This list is incomplete; you can help by expanding it.

65 nm System on Chips

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65 nm Microarchitectures

• Intel
  • Core

This list is incomplete; you can help by expanding it.