Semiconductor & Computer Engineering
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Difference between revisions of "150 nm lithography process"
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|Process Name | |Process Name | ||
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| + | |Metal Layers | ||
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|Contacted Gate Pitch | |Contacted Gate Pitch | ||
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| colspan="2" | 2000 || colspan="2" | 2002 | | colspan="2" | 2000 || colspan="2" | 2002 | ||
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| + | | colspan="2" | || colspan="2" | 6 | ||
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! Value !! [[180 nm]] Δ !! Value !! [[180 nm]] Δ | ! Value !! [[180 nm]] Δ !! Value !! [[180 nm]] Δ | ||
Revision as of 00:54, 27 April 2016
Semiconductor lithography processes technology
The 150 nm lithography process is a half-node semiconductor manufacturing process used as a stopgap between the 180 nm and 130 nm processes. Commercial integrated circuit manufacturing using 55 nm process began in early 2000s. This technology superseded by commercial 130 nm process by 2001.
Industry
| Fab |
|---|
| Process Name |
| 1st Production |
| Metal Layers |
| |
| Contacted Gate Pitch |
| Interconnect Pitch (M1P) |
| SRAM bit cell |
| TSMC | Fujitsu | ||
|---|---|---|---|
| CS-85 | |||
| 2000 | 2002 | ||
| 6 | |||
| Value | 180 nm Δ | Value | 180 nm Δ |
| ? nm | ?x | ? nm | ?x |
| ? nm | ?x | ? nm | ?x |
| 3.42 µm2 | 0.74x | ? µm2 | ?x |
150 nm Microprocessors
- Cyrix
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