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Difference between revisions of "3 µm lithography process"

(Industry)
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  | process 1 layers      = 1
 
  | process 1 layers      = 1
 
  | process 1 delta from  = N/A
 
  | process 1 delta from  = N/A
  | process 1 gate len    = 3 µm²
+
  | process 1 gate len    = 3 µm
 
  | process 1 gate len Δ  = -
 
  | process 1 gate len Δ  = -
 
  | process 1 cpp          =  
 
  | process 1 cpp          =  

Revision as of 01:02, 6 May 2017

The 3 μm lithography process was the semiconductor process technology used by some semiconductor companies during the mid 1970s to the mid 1980s.

Industry

 
Process Name
1st Production
Lithography Lithography
Immersion
Exposure
Wafer Type
Size
Transistor Type
Voltage
Metal Layers
 
Gate Length (Lg)
Contacted Gate Pitch (CPP)
Minimum Metal Pitch (MMP)
SRAM bitcell High-Perf (HP)
High-Density (HD)
Low-Voltage (LV)
DRAM bitcell eDRAM
Hitachi
Hi-CMOS I
1978
 
 
 
Bulk
 
Planar
5 V
1
Value N/A
3 µm N/A
 
 
 
896 µm²
 
 

3 μm Microprocessors

This list is incomplete; you can help by expanding it.

3 μm Microcontrollers

3 μm Chips

References

  • Hitachi
    • Sakai, Yoshio, et al. "High packing density, high speed CMOS (Hi-CMOS) device technology." Japanese Journal of Applied Physics 18.S1 (1979): 73.
    • Minato, O., et al. "A Hi-CMOSII 8Kx8 bit static RAM." IEEE Journal of Solid-State Circuits 17.5 (1982): 793-798.
    • Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.