Revision as of 19:22, 30 March 2017

Semiconductor lithography processes technology

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The 280 nanometer (280 nm) lithography process is was semiconductor manufacturing process following the 350 nm process. Commercial integrated circuit manufacturing using 280 nm process began in late 1990s. 280 nm and was phased out and later replaced by 250 nm, 220 nm, and 180 nm processes.

Industry

Around 1996 Intel introduced a stopgap shrink between 0.35 µm and 0.25 µm, the process was used in Intel's Klamath P6 core.

280 nm Microprocessors

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280 nm Microarchitectures

• Intel P6

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