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Difference between revisions of "7 nm lithography process"
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Revision as of 06:51, 15 November 2016
The 7 nanometer (7 nm) lithography process is a full node semiconductor manufacturing process following the 10 nm process node. Commercial integrated circuit manufacturing using 7 nm process is set to begin sometimes in 2019 or 2020. This technology will be replaced by 5 nm process around 2022.
Industry
Fab |
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Process Name |
1st Production |
|
Fin Pitch |
Fin Width |
Fin Height |
Contacted Gate Pitch |
Interconnect Pitch (M1P) |
SRAM bit cell (HP) |
SRAM bit cell (HD) |
Intel | Samsung | TSMC | |||
---|---|---|---|---|---|
P1276 | |||||
Value | 10 nm Δ | Value | 10 nm Δ | Value | 10 nm Δ |
? nm | ?x | ? nm | ?x | ? nm | ?x |
? nm | ?x | ? nm | ?x | ? nm | ?x |
? nm | ?x | ? nm | ?x | ? nm | ?x |
? nm | ?x | 48 nm[1] | ?x | ? nm | ?x |
? nm | ?x | 36 nm[2] | ?x | ? nm | ?x |
? µm2 | ?x | ? µm2 | ?x | ? µm2 | ?x |
? µm2 | ?x | ? µm2 | ?x | 0.027 µm2[3] | ?x |
7 nm Microprocessors
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7 nm System on Chips
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