Semiconductor & Computer Engineering
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Difference between revisions of "1.3 µm lithography process"
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(MB86900 was on 1.3μm, earliest I've seen pics of was October) |
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| − | The '''1. | + | The '''1.3 µm lithography process''' was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1.3 µm was phased out from the late 1980s to the early 1990s and replaced by [[1 µm]], [[800 nm]], and [[650 nm]] processes. |
== Industry == | == Industry == | ||
| Line 18: | Line 18: | ||
| || colspan="2" | Hi-CMOS III || | | || colspan="2" | Hi-CMOS III || | ||
|- style="text-align: center;" | |- style="text-align: center;" | ||
| − | | 1987 || colspan="2" | 1987 || | + | | 1987 || colspan="2" | 1987 || 1986? |
|- | |- | ||
| || colspan="2" | 5 V || | | || colspan="2" | 5 V || | ||
Latest revision as of 11:57, 23 October 2022
Semiconductor lithography processes technology
The 1.3 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1.3 µm was phased out from the late 1980s to the early 1990s and replaced by 1 µm, 800 nm, and 650 nm processes.
Industry[edit]
| Fab |
|---|
| Process Name |
| 1st Production |
| Voltage |
| |
| Gate Length |
| Interconnect Pitch (M1P) |
| SRAM bit cell |
| Motorola | Hitachi | Fujitsu | |
|---|---|---|---|
| Hi-CMOS III | |||
| 1987 | 1987 | 1986? | |
| 5 V | |||
| Value | Value | 2 µm Δ | Value |
| ? nm | 1.2 µm | 0.60x | ? nm |
| ? nm | 1.3 µm | 0.43x | nm |
| ? µm² | ? µm² | ? µm² | |
1.3 µm Microprocessors[edit]
This list is incomplete; you can help by expanding it.
References[edit]
- Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.