From WikiChip
Difference between revisions of "1.2 µm lithography process"
m (Bot: Automated text replacement (-Category:Lithography +category:lithography)) |
|||
(7 intermediate revisions by 2 users not shown) | |||
Line 6: | Line 6: | ||
|Process Name | |Process Name | ||
|1st Production | |1st Production | ||
+ | |Voltage | ||
| | | | ||
− | | | + | |Gate Length |
|Interconnect Pitch (M1P) | |Interconnect Pitch (M1P) | ||
|SRAM bit cell | |SRAM bit cell | ||
Line 13: | Line 14: | ||
{{scrolling table/mid}} | {{scrolling table/mid}} | ||
|- | |- | ||
− | ! [[Intel]] !! [[NEC]] | + | ! [[Intel]] !! [[NEC]] |
|- style="text-align: center;" | |- style="text-align: center;" | ||
− | | || | + | | || |
|- style="text-align: center;" | |- style="text-align: center;" | ||
| 1987 || 1988 | | 1987 || 1988 | ||
+ | |- style="text-align: center;" | ||
+ | | || | ||
|- | |- | ||
! Value !! Value | ! Value !! Value | ||
|- | |- | ||
− | | ? | + | | ? µm || ? µm |
|- | |- | ||
− | | ? | + | | ? µm || ? µm |
|- | |- | ||
− | | ? | + | | ? µm² || ? µm² |
{{scrolling table/end}} | {{scrolling table/end}} | ||
Line 33: | Line 36: | ||
* MIPS (Fab'ed by [[NEC]]) | * MIPS (Fab'ed by [[NEC]]) | ||
** {{mips|R3000}} | ** {{mips|R3000}} | ||
+ | * Qualcomm | ||
+ | ** {{qualcomm|MSM}} (prototype) | ||
{{expand list}} | {{expand list}} | ||
− | [[ | + | [[category:lithography]] |
Latest revision as of 22:04, 20 May 2018
The 1.2 µm lithography process was the semiconductor process technology used by the major semiconductor companies between in the late 1980s. 1 µm was phased out in the early 1990s and was replaced by 1 µm, 800 nm, and 650 nm processes.
Industry[edit]
Fab |
---|
Process Name |
1st Production |
Voltage |
|
Gate Length |
Interconnect Pitch (M1P) |
SRAM bit cell |
1.2 µm Microprocessors[edit]
This list is incomplete; you can help by expanding it.