(Added new information about TSMC's N3 and N3E nodes) |
(Updates to Intel 3 production date and Transistor based on 4/11/22 annoucements.) |
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| Line 12: | Line 12: | ||
| process 1 fab = [[Intel]] | | process 1 fab = [[Intel]] | ||
| process 1 name = P1280? (CPU), P1281? (SoC) | | process 1 name = P1280? (CPU), P1281? (SoC) | ||
| − | | process 1 date = | + | | process 1 date = 2H 2023 |
| process 1 lith = EUV | | process 1 lith = EUV | ||
| process 1 immersion = | | process 1 immersion = | ||
| Line 18: | Line 18: | ||
| process 1 wafer type = Bulk | | process 1 wafer type = Bulk | ||
| process 1 wafer size = 300 mm | | process 1 wafer size = 300 mm | ||
| − | | process 1 transistor = | + | | process 1 transistor = FinFET |
| process 1 volt = | | process 1 volt = | ||
| process 1 delta from = [[5 nm]] Δ | | process 1 delta from = [[5 nm]] Δ | ||
Revision as of 13:41, 11 April 2022
The 3 nanometer (3 nm or 30 Å) lithography process is a technology node semiconductor manufacturing process following the 5 nm process node. Commercial integrated circuit manufacturing using 3 nm process is set to begin some time around 2023.
The term "3 nm" is simply a commercial name for a generation of a certain size and its technology, and does not represent any geometry of the transistor.
Industry
| Process Name | |
|---|---|
| 1st Production | |
| Litho- graphy |
Lithography |
| Immersion | |
| Exposure | |
| Wafer | Type |
| Size | |
| Tran- sistor |
Type |
| Voltage | |
| Fin | Pitch |
| Width | |
| Height | |
| Gate Length (Lg) | |
| Contacted Gate Pitch (CPP) | |
| Minimum Metal Pitch (MMP) | |
| SRAM bitcell |
High-Perf (HP) |
| High-Density (HD) | |
| Low-Voltage (LV) | |
| DRAM bitcell |
eDRAM |
| Intel | TSMC | Samsung | |||
|---|---|---|---|---|---|
| P1280? (CPU), P1281? (SoC) | N3, N3E N3 Enhanced |
3GAE 3nm Gate All Around Early , 3GAP3nm Gate All Around Plus
| |||
| 2H 2023 | 2H 2022 | ||||
| EUV | EUV | EUV | |||
| SE | SE | SE | |||
| Bulk | Bulk | Bulk | |||
| 300 mm | 300 mm | 300 mm | |||
| FinFET | FinFET | GAA | |||
| Value | 5 nm Δ | Value | 5 nm Δ | Value | 5 nm Δ |
| N/A | |||||
Samsung
On May 24 2017 Samsung announced they will be switching to a transistor they call Multi-Bridge-Channel FET (MBCFET), an extension of a Gate-all-around (GAA) FET. This is planned for somewhere after the 5nm node but the exact timeline or specification is currently unknown.
3 nm Microprocessors
This list is incomplete; you can help by expanding it.
3 nm Microarchitectures
This list is incomplete; you can help by expanding it.
References
- Kinam Kim, President of Semiconductor Business, announced MBCFET for the node after 5 nm, May 24, 2017