From WikiChip
Difference between revisions of "3 µm lithography process"

Line 28: Line 28:
 
| 3 µm
 
| 3 µm
 
|-
 
|-
| ? µm²
+
| 896 µm²
 
{{scrolling table/end}}
 
{{scrolling table/end}}
  
Line 69: Line 69:
  
 
== References ==
 
== References ==
 +
* Minato, O., et al. "A Hi-CMOSII 8Kx8 bit static RAM." IEEE Journal of Solid-State Circuits 17.5 (1982): 793-798.
 
* Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.
 
* Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.
  
 
[[Category:Lithography]]
 
[[Category:Lithography]]

Revision as of 06:40, 4 April 2017

The 3 μm lithography process was the semiconductor process technology used by some semiconductor companies during the mid 1970s to the mid 1980s.

Industry

Fab
Process Name​
1st Production​
Voltage​
 ​
Gate Length​
Interconnect Pitch (M1P)​
SRAM bit cell
Hitachi
Hi-CMOS I
 ?
5 V
Value
3 µm
3 µm
896 µm²

3 μm Microprocessors

This list is incomplete; you can help by expanding it.

3 μm Microcontrollers

3 μm Chips

References

  • Minato, O., et al. "A Hi-CMOSII 8Kx8 bit static RAM." IEEE Journal of Solid-State Circuits 17.5 (1982): 793-798.
  • Meguro, S., et al. "Hi-CMOS III technology." Electron Devices Meeting, 1984 International. IEEE, 1984.