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{{amd title|Zen 3|arch}} | {{amd title|Zen 3|arch}} | ||
{{microarchitecture | {{microarchitecture | ||
− | | atype | + | |atype=CPU |
− | | name | + | |name=Zen 3 |
− | | designer | + | |designer=AMD |
− | | manufacturer | + | |manufacturer=TSMC |
− | | manufacturer 2 | + | |manufacturer 2=GlobalFoundries |
− | | introduction | + | |introduction=October 8, 2020 |
− | | | + | |process=7nm, 12nm |
− | | | + | |cores=64 |
− | + | |cores 2=56 | |
− | | | + | |cores 3=48 |
− | | predecessor | + | |cores 4=32 |
− | | predecessor link = amd/microarchitectures/zen 2 | + | |cores 5=28 |
− | | successor | + | |cores 6=24 |
− | | successor link | + | |cores 7=16 |
+ | |cores 8=12 | ||
+ | |cores 9=8 | ||
+ | |cores 10=6 | ||
+ | |type=Superscalar | ||
+ | |oooe=Yes | ||
+ | |speculative=Yes | ||
+ | |renaming=Yes | ||
+ | |stages=19 | ||
+ | |decode=4-way | ||
+ | |isa=x86-64 | ||
+ | |extension=MOVBE | ||
+ | |extension 2=MMX | ||
+ | |extension 3=SSE | ||
+ | |extension 4=SSE2 | ||
+ | |extension 5=SSE3 | ||
+ | |extension 6=SSSE3 | ||
+ | |extension 7=SSE4A | ||
+ | |extension 8=SSE4.1 | ||
+ | |extension 9=SSE4.2 | ||
+ | |extension 10=POPCNT | ||
+ | |extension 11=AVX | ||
+ | |extension 12=AVX2 | ||
+ | |extension 13=AES | ||
+ | |extension 14=PCLMUL | ||
+ | |extension 15=FSGSBASE | ||
+ | |extension 16=RDRND | ||
+ | |extension 17=FMA3 | ||
+ | |extension 18=F16C | ||
+ | |extension 19=BMI | ||
+ | |extension 20=BMI2 | ||
+ | |extension 21=RDSEED | ||
+ | |extension 22=ADCX | ||
+ | |extension 23=PREFETCHW | ||
+ | |extension 24=CLFLUSHOPT | ||
+ | |extension 25=XSAVE | ||
+ | |extension 26=SHA | ||
+ | |extension 27=UMIP | ||
+ | |extension 28=CLZERO | ||
+ | |extension 29=VAES | ||
+ | |extension 30=VPCLMUL | ||
+ | |predecessor=Zen 2 | ||
+ | |predecessor link=amd/microarchitectures/zen 2 | ||
+ | |successor=Zen 4 | ||
+ | |successor link=amd/microarchitectures/zen 4 | ||
}} | }} | ||
− | '''Zen 3''' is a | + | '''Zen 3''' is a [[microarchitecture]] developed by [[AMD]] as a successor to {{\\|Zen 2}}. It was publicly released on October 8, 2020. Mainstream Desktop processors hit shelves on November 5, 2020. |
== History == | == History == | ||
[[File:amd zen future roadmap.jpg|400px|right]] | [[File:amd zen future roadmap.jpg|400px|right]] | ||
− | Zen 3 was formally disclosed in a roadmap by Lisa Su, AMD's CEO, during AMD's Tech Day in February of 2017. Zen 3 will be the 3rd iteration of the {{\\|Zen}} microarchitecture. On Investor's Day May 2017 Jim Anderson, AMD Senior Vice President, confirmed that Zen 3 is set to utilize | + | Zen 3 was formally disclosed in a roadmap by Lisa Su, AMD's CEO, during AMD's Tech Day in February of 2017. Zen 3 will be the 3rd iteration of the {{\\|Zen}} microarchitecture. On Investor's Day in May 2017 Jim Anderson, AMD Senior Vice President, confirmed that Zen 3 is set to utilize [[7nm+ process]]. |
== Codenames == | == Codenames == | ||
− | [[File:amd zen2-3 roadmap.png| | + | [[File:amd zen2-3 roadmap.png|thumb|right|Zen 3 on the roadmap]] |
+ | |||
+ | '''Product Codenames:''' | ||
+ | {| class="wikitable" | ||
+ | |- | ||
+ | ! Core !! C/T !! Target | ||
+ | |- | ||
+ | | {{amd|Milan|l=core}} || Up to 64/128 || High-end server [[multiprocessors]] | ||
+ | |- | ||
+ | | {{amd|Chagall|l=core}} || Up to 64/128 || Workstation & enthusiasts market processors | ||
+ | |- | ||
+ | | {{amd|Vermeer|l=core}} || Up to 16/32 || Mainstream to high-end desktops & enthusiasts market processors | ||
+ | |- | ||
+ | | {{amd|Cezanne|l=core}} || Up to 8/16 || Mainstream APUs with GPUs | ||
+ | |} | ||
+ | |||
+ | '''Architectural Codenames:''' | ||
+ | {| class="wikitable" | ||
+ | |- | ||
+ | ! Arch !! Codename | ||
+ | |- | ||
+ | | Core || Cerebrus | ||
+ | |- | ||
+ | | CCD || Breckenridge | ||
+ | |} | ||
+ | |||
+ | == Products == | ||
{{future information}} | {{future information}} | ||
{| class="wikitable" | {| class="wikitable" | ||
|- | |- | ||
− | ! | + | ! Processor Series !! Cores/Threads !! Market |
+ | |- | ||
+ | | EPYC 7003 "{{amd|Milan|l=core}}" || Up to 64/128 || High-end server [[multiprocessors]] | ||
+ | |- | ||
+ | | {{amd|Trento|l=core}}<!--s/a Milan page--> || ?/? || High-performance computing | ||
+ | |- | ||
+ | | Ryzen Threadripper 5900 "{{amd|Chagall|l=core}}" || Up to 64/128 || Workstation processors | ||
+ | |- | ||
+ | | Ryzen 5000 "{{amd|Vermeer|l=core}}" || Up to 16/32 || Mainstream to high-end desktops & enthusiasts market processors | ||
+ | |- | ||
+ | | Ryzen 5000 APU "{{amd|Cezanne|l=core}}" || Up to 8/16 || Mainstream desktop & mobile processors with integrated GPU | ||
+ | |} | ||
+ | |||
+ | == Process technology == | ||
+ | Zen 3 is fabricated on [[TSMC]]'s [[7 nm process|7nm+ process]] for the Core Compute Die (CCD), the same process used in Zen 2 Refresh processors, as well as [[GlobalFoundries]] [[14 nm process|12nm process]] for the Input/Output Die (IOD). | ||
+ | |||
+ | Note: Only the APU series of microprocessors retains the monolithic design, so they are fabricated solely on [[TSMC]]'s [[7 nm process|7nm+ process]]. | ||
+ | |||
+ | == Compiler support == | ||
+ | {| class="wikitable" | ||
|- | |- | ||
− | + | ! Compiler !! Arch-Specific || Arch-Favorable | |
|- | |- | ||
− | | | + | | [[GCC]] || <code>-march=znver3</code> || <code>-mtune=znver3</code> |
|- | |- | ||
− | | | + | | [[LLVM]] || <code>-march=znver3</code> || <code>-mtune=znver3</code> |
|} | |} | ||
+ | * '''Note:''' Initial support in GCC 10.3 and LLVM 12.0. | ||
== Architecture == | == Architecture == | ||
− | |||
=== Key changes from {{\\|Zen 2}} === | === Key changes from {{\\|Zen 2}} === | ||
− | {{ | + | * CCD |
+ | ** Unified 8-core CCX (from 2x 4-Core CCX per CCD) | ||
+ | ** 32 MiB L3$ available equally to all cores in CCD. | ||
+ | *** Increased L3 latency (~46 cycles, up from ~40 cycles) | ||
+ | * Core | ||
+ | ** Higher [[IPC]] (AMD self-reported +19% IPC) | ||
+ | ** Front-end | ||
+ | *** Increased branch prediction bandwidth | ||
+ | *** "zero-bubble" branch prediction | ||
+ | *** L1 BTB doubled from 512 to 1024 entries | ||
+ | *** Improved prefetching | ||
+ | *** Improved µop cache | ||
+ | ** Back-end | ||
+ | *** Floating point unit: | ||
+ | **** FMA latency reduced by 1 cycle from 5 to 4. | ||
+ | **** Fifth and sixth dedicated execution ports added for floating point store and FP-to-int transfer, no longer sharing 2nd FADD port. | ||
+ | **** Unified scheduler split into 1 scheduler per FMA/FADD/transfer port set. | ||
+ | **** 256b VAES and VPCLMULDQ support for doubled AES and AES-GCM cryptographic throughput. | ||
+ | **** Hardware implementation of BMI2 PDEP/PEXT bit scatter/gather operations, compared to prior microcode emulation. | ||
+ | *** Integer unit: | ||
+ | **** Integer physical register file increased from 180 to 192 entries | ||
+ | **** Issue increased from 7 (existing 4 ALU and 3 AGU) to 10 with 1 new dedicated branch execution port and 2 separated store data pathways. | ||
+ | **** Schedulers shared between pairs of ALU + AGU/branch ports instead of dedicated for each. | ||
+ | **** Instruction redundancy increased between ports for reduced bottlenecking on a wider variety of instruction streams. | ||
+ | **** 8/16/32/64 bit signed integer division/modulo latency improved from 17/22/30/46 cycles to 10/12/14/20. (Unsigned operations are ~1 cycle faster for some of both old/new cases.) Throughput improves proportionately. | ||
+ | *** Load/store: | ||
+ | **** Load throughput increased from 2 to 3, if not 256b. | ||
+ | **** Store throughput increased from 1 to 2, if not 256b. | ||
+ | **** Store queue increase from 48 to 64 slots. | ||
+ | **** Page table walkers tripled from 2 to 6 for TLB miss handling. | ||
+ | {{expand list}} | ||
+ | |||
+ | === New Instructions === | ||
+ | Zen 3 introduced the following ISA enhancements: | ||
+ | |||
+ | * {{x86|VAES}} - 256-bit Vector AES instructions | ||
+ | ** <code>VAESDEC</code> - AES Decryption Round | ||
+ | ** <code>VAESDECLAST</code> - AES Last Decryption Round | ||
+ | ** <code>VAESENC</code> - AES Encryption Round | ||
+ | ** <code>VAESENCLAST</code> - AES Last Encryption Round | ||
+ | * <code>{{x86|VPCLMULQDQ}}</code> - 256-bit Vector Carry-Less Multiplication of Quadwords | ||
+ | * {{x86|PCID}} - Process Context Identifiers | ||
+ | ** <code>{{x86|INVPCID}}</code> - Invalidate TLB entry(s) in a specified PCID | ||
+ | * {{x86|INVLPGB}} - Broadcast TLB flushing | ||
+ | ** <code>INVLPGB</code> - Invalidate TLB entry(s) with broadcast to all processors | ||
+ | ** <code>TLBSYNC</code> - Synchronize TLB invalidations | ||
+ | * {{x86|PKU}} - Memory Protection Keys for Users | ||
+ | ** <code>RDPKRU</code> - Read Protection Key Rights | ||
+ | ** <code>WRPKRU</code> - Write Protection Key Rights | ||
+ | * {{x86|CET|CET_SS}} - Control-flow Enforcement Technology / Shadow Stack | ||
+ | ** <code>CLRSSBSY</code>, <code>INCSSP</code>, <code>RDSSP</code>, <code>RSTORSSP</code>, <code>SAVEPREVSSP</code>, <code>SETSSBSY</code>, <code>WRSS</code>, <code>WRUSS</code> | ||
+ | * {{x86|SME|SEV-SNP}} - 3rd generation Secure Encrypted Virtualization - Secure Nested Paging | ||
+ | ** <code>PSMASH</code>, <code>PVALIDATE</code>, <code>RMPADJUST</code>, <code>RMPUPDATE</code> | ||
+ | * {{x86|PSFD}} - Predictive Store Forwarding Disable (Speculation Control MSR)<ref name="amd-psf"/> | ||
+ | |||
+ | Sources: <ref name="amd-24593-apm2"/><ref name="amd-24594-apm3"/><ref name="amd-26568-apm4"/> | ||
+ | |||
+ | === Memory Hierarchy === | ||
+ | ==== Data and Instruction Caches ==== | ||
+ | * L0 Op Cache: | ||
+ | ** 4,096 Ops per core, 8-way set associative | ||
+ | ** 8 Op line size | ||
+ | ** Parity protected | ||
+ | * L1I Cache: | ||
+ | ** 32 KiB per core, 8-way set associative | ||
+ | ** 64 B line size | ||
+ | ** Parity protected | ||
+ | * L1D Cache: | ||
+ | ** 32 KiB per core, 8-way set associative | ||
+ | ** 64 B line size | ||
+ | ** Write-back policy | ||
+ | ** 4-5 cycles latency for Int | ||
+ | ** 7-8 cycles latency for FP | ||
+ | ** ECC | ||
+ | * L2 Cache: | ||
+ | ** 512 KiB per core, 8-way set associative | ||
+ | ** 64 B line size | ||
+ | ** Write-back policy | ||
+ | ** Inclusive of L1 | ||
+ | ** ≥ 12 cycles latency | ||
+ | ** {{abbr|DEC-TED}} ECC, tag & state arrays {{abbr|SEC-DED}}<!--7 check bits for 42 tag bits; AMD-55898-0.50 Sec 3.5--> | ||
+ | * L3 Cache: | ||
+ | ** "{{amd|Milan|l=core}}" & "{{amd|Chagall|l=core}}": 32 MiB/CCX, up to 256 MiB total | ||
+ | ** "{{amd|Vermeer|l=core}}": 32 MiB/CCX, up to 64 MiB total | ||
+ | ** "{{amd|Cezanne|l=core}}": 16 MiB, 8 MiB usable on some SKUs | ||
+ | ** Shared by all cores in the {{abbr|CCX}}, configurable<ref name="amd-56375-qos"/> | ||
+ | ** 16-way set associative | ||
+ | ** 64 B line size | ||
+ | ** L2 [[victim cache]] | ||
+ | ** Write-back policy | ||
+ | ** 46 cycles average load-to-use latency | ||
+ | ** DEC-TED ECC, tag array & shadow tags SEC-DED<!--AMD-55898-0.50 Sec 3.5--> | ||
+ | ** QoS Monitoring and Enforcement V2.0 | ||
+ | |||
+ | ==== Translation Lookaside Buffers ==== | ||
+ | * ITLB | ||
+ | ** 64 entry L1 TLB, fully associative, all page sizes | ||
+ | ** 512 entry L2 TLB, 8-way set associative | ||
+ | *** 4-Kbyte and 2-Mbyte pages | ||
+ | ** Parity protected | ||
+ | * DTLB | ||
+ | ** 64 entry L1 TLB, fully associative, all page sizes | ||
+ | ** 2,048 entry L2 TLB, 16-way set associative | ||
+ | *** 4-Kbyte and 2-Mbyte pages, PDEs to speed up table walks | ||
+ | ** Parity protected | ||
+ | |||
+ | All caches and TLBs are competitively shared in multi-threaded mode. | ||
+ | |||
+ | ==== System DRAM ==== | ||
+ | * EPYC 7003 "{{amd|Milan|l=core}}": | ||
+ | ** 8 channels per socket, up to 16 DIMMs, max. 4 TiB | ||
+ | ** Up to PC4-25600L (DDR4-3200) | ||
+ | ** {{abbr|SR}}/{{abbr|DR}} {{abbr|RDIMM}}, {{abbr|4R}}/{{abbr|8R}} {{abbr|LRDIMM}}, {{abbr|3DS DIMM}}, {{abbr|NVDIMM-N}} | ||
+ | ** ECC supported (x4, x8, x16, chipkill)<!--AMD-55898-0.50 Sec 3.7--> | ||
+ | ** DRAM bus parity and write data CRC options<!--ibid--> | ||
+ | |||
+ | * Ryzen Threadripper 5900 "{{amd|Chagall|l=core}}": | ||
+ | ** 8 channels, up to 8 DIMMs, max. 2 TiB | ||
+ | ** Up to PC4-25600L (DDR4-3200) | ||
+ | ** SR/DR {{abbr|UDIMM}}, RDIMM, LRDIMM, 3DS DIMM | ||
+ | ** ECC supported | ||
+ | |||
+ | * Ryzen 5000 "{{amd|Vermeer|l=core}}": | ||
+ | ** 2 channels, up to 4 DIMMs, max. 128 GiB | ||
+ | ** Up to PC4-25600U (DDR4-3200 UDIMM), ECC supported | ||
+ | |||
+ | * Ryzen 5000 APU "{{amd|Cezanne|l=core}}": | ||
+ | ** {{amd|Socket AM4|l=pack}}: | ||
+ | *** 2 channels, up to 4 DIMMs, max. 128 GiB | ||
+ | *** Up to PC4-25600U (DDR4-3200 UDIMM), ECC supported ("PRO" models) | ||
+ | ** {{amd|FP6|FP6 package|l=pack}}, DDR4 mode: | ||
+ | *** 2 × 64-bit channels, up to 2 DIMMs, max. 64 GiB | ||
+ | *** Up to PC4-25600U (DDR4-3200 UDIMM), ECC supported(?) | ||
+ | ** FP6 package, LPDDR4 mode: | ||
+ | *** 4 × 32-bit channels, max. 32 GiB | ||
+ | *** Up to LPDDR4X-4266 | ||
+ | |||
+ | Sources: <ref name="amd-56375-qos"/><ref name="amd-56665-sog-19h"/><ref name="amd-55898-ppr-1901-0.35"/><ref name="amd-55898-ppr-1901-0.50"/><ref name="amd-56178-mdg-fp6"/> | ||
+ | |||
+ | == All Zen 3 Chips == | ||
+ | |||
+ | <!-- NOTE: | ||
+ | This table is generated automatically from the data in the actual articles. | ||
+ | If a microprocessor is missing from the list, an appropriate article for it needs to be | ||
+ | created and tagged accordingly. | ||
+ | |||
+ | Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips | ||
+ | --> | ||
+ | {{comp table start}} | ||
+ | <table class="comptable sortable tc13 tc14 tc15 tc16 tc17 tc18 tc19"> | ||
+ | {{comp table header|main|20:List of all Zen 3-based Processors}} | ||
+ | {{comp table header|main|12:Processor|4:Features}} | ||
+ | {{comp table header|cols|Price|Process|Launched|Family|Core|C|T|TDP|L3|Base|Turbo|Max Mem|SMT|SEV|SME|TSME}} | ||
+ | {{comp table header|lsep|25:[[Uniprocessors]]}} | ||
+ | {{#ask: [[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[microarchitecture::Zen 3]] [[max cpu count::1]] | ||
+ | |?full page name | ||
+ | |?model number | ||
+ | |?release price | ||
+ | |?process | ||
+ | |?first launched | ||
+ | |?microprocessor family | ||
+ | |?core name | ||
+ | |?core count | ||
+ | |?thread count | ||
+ | |?tdp | ||
+ | |?l3$ size | ||
+ | |?base frequency#GHz | ||
+ | |?turbo frequency#GHz | ||
+ | |?max memory#GiB | ||
+ | |?has simultaneous multithreading | ||
+ | |?has amd secure encrypted virtualization technology | ||
+ | |?has amd secure memory encryption technology | ||
+ | |?has amd transparent secure memory encryption technology | ||
+ | |format=template | ||
+ | |template=proc table 3 | ||
+ | |userparam=18:15 | ||
+ | |mainlabel=- | ||
+ | |valuesep=, | ||
+ | |limit=100 | ||
+ | }} | ||
+ | {{comp table header|lsep|25:[[Multiprocessors]] (dual-socket)}} | ||
+ | {{#ask: [[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[microarchitecture::Zen 3]] [[max cpu count::>>1]] | ||
+ | |?full page name | ||
+ | |?model number | ||
+ | |?release price | ||
+ | |?process | ||
+ | |?first launched | ||
+ | |?microprocessor family | ||
+ | |?core name | ||
+ | |?core count | ||
+ | |?thread count | ||
+ | |?tdp | ||
+ | |?l3$ size | ||
+ | |?base frequency#GHz | ||
+ | |?turbo frequency#GHz | ||
+ | |?max memory#GiB | ||
+ | |?has simultaneous multithreading | ||
+ | |?has amd secure encrypted virtualization technology | ||
+ | |?has amd secure memory encryption technology | ||
+ | |?has amd transparent secure memory encryption technology | ||
+ | |format=template | ||
+ | |template=proc table 3 | ||
+ | |userparam=18:15 | ||
+ | |mainlabel=- | ||
+ | |valuesep=, | ||
+ | |limit=100 | ||
+ | }} | ||
+ | {{comp table count|ask=[[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[microarchitecture::Zen 3]]}} | ||
+ | </table> | ||
+ | {{comp table end}} | ||
+ | |||
+ | == Designers == | ||
+ | * Mark Evers, Chief Architect | ||
− | == | + | == Bibliography == |
* AMD 'Tech Day', February 22, 2017 | * AMD 'Tech Day', February 22, 2017 | ||
* AMD 2017 Financial Analyst Day, May 16, 2017 | * AMD 2017 Financial Analyst Day, May 16, 2017 | ||
+ | |||
+ | == References == | ||
+ | <references> | ||
+ | <ref name="amd-psf">{{cite techdoc|title=White Paper: Security Analysis of AMD Predictive Store Forwarding|url=https://www.amd.com/system/files/documents/security-analysis-predictive-store-forwarding.pdf|publ=AMD|date=2021-03}}</ref> | ||
+ | <ref name="amd-24593-apm2">{{cite techdoc|title=AMD64 Architecture Programmer’s Manual Volume 2: System Programming|url=https://www.amd.com/system/files/TechDocs/24593.pdf|publ=AMD|pid=24593|rev=3.37|date=2021-03}}</ref> | ||
+ | <ref name="amd-24594-apm3">{{cite techdoc|title=AMD64 Architecture Programmer’s Manual Volume 3: General-Purpose and System Instructions|url=https://www.amd.com/system/files/TechDocs/24594.pdf|publ=AMD|pid=24594|rev=3.32|date=2021-03}}</ref> | ||
+ | <ref name="amd-26568-apm4">{{cite techdoc|title=AMD64 Architecture Programmer’s Manual Volume 4: 128-Bit and 256-Bit Media Instructions|url=https://www.amd.com/system/files/TechDocs/26568.pdf|publ=AMD|pid=26568|rev=3.24|date=2020-05}}</ref> | ||
+ | <ref name="amd-56375-qos">{{cite techdoc|title=AMD64 Technology Platform Quality of Service Extensions|url=https://developer.amd.com/wp-content/resources/56375.pdf|publ=AMD|pid=56375|rev=1.02|date=2020-10}}</ref> | ||
+ | <ref name="amd-56665-sog-19h">{{cite techdoc|title=Software Optimization Guide for AMD Family 19h Processors (PUB)|url=https://www.amd.com/system/files/TechDocs/56665.zip|publ=AMD|pid=56665|rev=3.00|date=2020-11}}</ref> | ||
+ | <ref name="amd-55898-ppr-1901-0.35">{{cite techdoc|title=Preliminary Processor Programming Reference (PPR) for AMD Family 19h Model 01h, Revision B1 Processors|url=https://www.amd.com/system/files/TechDocs/55898_pub.zip|publ=AMD|pid=55898|rev=0.35|date=2021-02-05}}</ref> | ||
+ | <ref name="amd-55898-ppr-1901-0.50">{{cite techdoc|title=Preliminary Processor Programming Reference (PPR) for AMD Family 19h Model 01h, Revision B1 Processors|publ=AMD|pid=55898|rev=0.50|date=2021-05-27}}</ref> | ||
+ | <ref name="amd-56178-mdg-fp6">{{cite techdoc|title=FP6 Processor Motherboard Design Guide|publ=AMD|pid=56178|rev=1.03|date=2020-01}}</ref> | ||
+ | </references> | ||
== See Also == | == See Also == | ||
− | * AMD {{\\|Zen}} | + | * AMD {{\\|Zen}}, {{\\|Zen 2}}, {{\\|Zen 4}} |
* Intel {{intel|Tigerlake|l=arch}} | * Intel {{intel|Tigerlake|l=arch}} | ||
+ | * Read also: [https://www.anandtech.com/print/16214/amd-zen-3-ryzen-deep-dive-review-5950x-5900x-5800x-and-5700x-tested AMD Zen 3 Ryzen Deep Dive Review] | ||
+ | * Read here: [https://techmotherboard.com/best-zen-3-cpu/ AMD Zen 3 Reviews] |
Latest revision as of 21:13, 6 April 2023
Edit Values | |
Zen 3 µarch | |
General Info | |
Arch Type | CPU |
Designer | AMD |
Manufacturer | TSMC, GlobalFoundries |
Introduction | October 8, 2020 |
Process | 7nm, 12nm |
Core Configs | 64, 56, 48, 32, 28, 24, 16, 12, 8, 6 |
Pipeline | |
Type | Superscalar |
OoOE | Yes |
Speculative | Yes |
Reg Renaming | Yes |
Stages | 19 |
Decode | 4-way |
Instructions | |
ISA | x86-64 |
Extensions | MOVBE, MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, POPCNT, AVX, AVX2, AES, PCLMUL, FSGSBASE, RDRND, FMA3, F16C, BMI, BMI2, RDSEED, ADCX, PREFETCHW, CLFLUSHOPT, XSAVE, SHA, UMIP, CLZERO, VAES, VPCLMUL |
Succession | |
Zen 3 is a microarchitecture developed by AMD as a successor to Zen 2. It was publicly released on October 8, 2020. Mainstream Desktop processors hit shelves on November 5, 2020.
Contents
History[edit]
Zen 3 was formally disclosed in a roadmap by Lisa Su, AMD's CEO, during AMD's Tech Day in February of 2017. Zen 3 will be the 3rd iteration of the Zen microarchitecture. On Investor's Day in May 2017 Jim Anderson, AMD Senior Vice President, confirmed that Zen 3 is set to utilize 7nm+ process.
Codenames[edit]
Product Codenames:
Core | C/T | Target |
---|---|---|
Milan | Up to 64/128 | High-end server multiprocessors |
Chagall | Up to 64/128 | Workstation & enthusiasts market processors |
Vermeer | Up to 16/32 | Mainstream to high-end desktops & enthusiasts market processors |
Cezanne | Up to 8/16 | Mainstream APUs with GPUs |
Architectural Codenames:
Arch | Codename |
---|---|
Core | Cerebrus |
CCD | Breckenridge |
Products[edit]
Processor Series | Cores/Threads | Market |
---|---|---|
EPYC 7003 "Milan" | Up to 64/128 | High-end server multiprocessors |
Trento | ?/? | High-performance computing |
Ryzen Threadripper 5900 "Chagall" | Up to 64/128 | Workstation processors |
Ryzen 5000 "Vermeer" | Up to 16/32 | Mainstream to high-end desktops & enthusiasts market processors |
Ryzen 5000 APU "Cezanne" | Up to 8/16 | Mainstream desktop & mobile processors with integrated GPU |
Process technology[edit]
Zen 3 is fabricated on TSMC's 7nm+ process for the Core Compute Die (CCD), the same process used in Zen 2 Refresh processors, as well as GlobalFoundries 12nm process for the Input/Output Die (IOD).
Note: Only the APU series of microprocessors retains the monolithic design, so they are fabricated solely on TSMC's 7nm+ process.
Compiler support[edit]
Compiler | Arch-Specific | Arch-Favorable |
---|---|---|
GCC | -march=znver3 |
-mtune=znver3
|
LLVM | -march=znver3 |
-mtune=znver3
|
- Note: Initial support in GCC 10.3 and LLVM 12.0.
Architecture[edit]
Key changes from Zen 2[edit]
- CCD
- Unified 8-core CCX (from 2x 4-Core CCX per CCD)
- 32 MiB L3$ available equally to all cores in CCD.
- Increased L3 latency (~46 cycles, up from ~40 cycles)
- Core
- Higher IPC (AMD self-reported +19% IPC)
- Front-end
- Increased branch prediction bandwidth
- "zero-bubble" branch prediction
- L1 BTB doubled from 512 to 1024 entries
- Improved prefetching
- Improved µop cache
- Back-end
- Floating point unit:
- FMA latency reduced by 1 cycle from 5 to 4.
- Fifth and sixth dedicated execution ports added for floating point store and FP-to-int transfer, no longer sharing 2nd FADD port.
- Unified scheduler split into 1 scheduler per FMA/FADD/transfer port set.
- 256b VAES and VPCLMULDQ support for doubled AES and AES-GCM cryptographic throughput.
- Hardware implementation of BMI2 PDEP/PEXT bit scatter/gather operations, compared to prior microcode emulation.
- Integer unit:
- Integer physical register file increased from 180 to 192 entries
- Issue increased from 7 (existing 4 ALU and 3 AGU) to 10 with 1 new dedicated branch execution port and 2 separated store data pathways.
- Schedulers shared between pairs of ALU + AGU/branch ports instead of dedicated for each.
- Instruction redundancy increased between ports for reduced bottlenecking on a wider variety of instruction streams.
- 8/16/32/64 bit signed integer division/modulo latency improved from 17/22/30/46 cycles to 10/12/14/20. (Unsigned operations are ~1 cycle faster for some of both old/new cases.) Throughput improves proportionately.
- Load/store:
- Load throughput increased from 2 to 3, if not 256b.
- Store throughput increased from 1 to 2, if not 256b.
- Store queue increase from 48 to 64 slots.
- Page table walkers tripled from 2 to 6 for TLB miss handling.
- Floating point unit:
This list is incomplete; you can help by expanding it.
New Instructions[edit]
Zen 3 introduced the following ISA enhancements:
- VAES - 256-bit Vector AES instructions
-
VAESDEC
- AES Decryption Round -
VAESDECLAST
- AES Last Decryption Round -
VAESENC
- AES Encryption Round -
VAESENCLAST
- AES Last Encryption Round
-
-
VPCLMULQDQ
- 256-bit Vector Carry-Less Multiplication of Quadwords - PCID - Process Context Identifiers
-
INVPCID
- Invalidate TLB entry(s) in a specified PCID
-
- INVLPGB - Broadcast TLB flushing
-
INVLPGB
- Invalidate TLB entry(s) with broadcast to all processors -
TLBSYNC
- Synchronize TLB invalidations
-
- PKU - Memory Protection Keys for Users
-
RDPKRU
- Read Protection Key Rights -
WRPKRU
- Write Protection Key Rights
-
- CET_SS - Control-flow Enforcement Technology / Shadow Stack
-
CLRSSBSY
,INCSSP
,RDSSP
,RSTORSSP
,SAVEPREVSSP
,SETSSBSY
,WRSS
,WRUSS
-
- SEV-SNP - 3rd generation Secure Encrypted Virtualization - Secure Nested Paging
-
PSMASH
,PVALIDATE
,RMPADJUST
,RMPUPDATE
-
- PSFD - Predictive Store Forwarding Disable (Speculation Control MSR)[1]
Memory Hierarchy[edit]
Data and Instruction Caches[edit]
- L0 Op Cache:
- 4,096 Ops per core, 8-way set associative
- 8 Op line size
- Parity protected
- L1I Cache:
- 32 KiB per core, 8-way set associative
- 64 B line size
- Parity protected
- L1D Cache:
- 32 KiB per core, 8-way set associative
- 64 B line size
- Write-back policy
- 4-5 cycles latency for Int
- 7-8 cycles latency for FP
- ECC
- L2 Cache:
- 512 KiB per core, 8-way set associative
- 64 B line size
- Write-back policy
- Inclusive of L1
- ≥ 12 cycles latency
- DEC-TED ECC, tag & state arrays SEC-DED
- L3 Cache:
- "Milan" & "Chagall": 32 MiB/CCX, up to 256 MiB total
- "Vermeer": 32 MiB/CCX, up to 64 MiB total
- "Cezanne": 16 MiB, 8 MiB usable on some SKUs
- Shared by all cores in the CCX, configurable[5]
- 16-way set associative
- 64 B line size
- L2 victim cache
- Write-back policy
- 46 cycles average load-to-use latency
- DEC-TED ECC, tag array & shadow tags SEC-DED
- QoS Monitoring and Enforcement V2.0
Translation Lookaside Buffers[edit]
- ITLB
- 64 entry L1 TLB, fully associative, all page sizes
- 512 entry L2 TLB, 8-way set associative
- 4-Kbyte and 2-Mbyte pages
- Parity protected
- DTLB
- 64 entry L1 TLB, fully associative, all page sizes
- 2,048 entry L2 TLB, 16-way set associative
- 4-Kbyte and 2-Mbyte pages, PDEs to speed up table walks
- Parity protected
All caches and TLBs are competitively shared in multi-threaded mode.
System DRAM[edit]
- EPYC 7003 "Milan":
- Ryzen Threadripper 5900 "Chagall":
- 8 channels, up to 8 DIMMs, max. 2 TiB
- Up to PC4-25600L (DDR4-3200)
- SR/DR UDIMM, RDIMM, LRDIMM, 3DS DIMM
- ECC supported
- Ryzen 5000 "Vermeer":
- 2 channels, up to 4 DIMMs, max. 128 GiB
- Up to PC4-25600U (DDR4-3200 UDIMM), ECC supported
- Ryzen 5000 APU "Cezanne":
- Socket AM4:
- 2 channels, up to 4 DIMMs, max. 128 GiB
- Up to PC4-25600U (DDR4-3200 UDIMM), ECC supported ("PRO" models)
- FP6 package, DDR4 mode:
- 2 × 64-bit channels, up to 2 DIMMs, max. 64 GiB
- Up to PC4-25600U (DDR4-3200 UDIMM), ECC supported(?)
- FP6 package, LPDDR4 mode:
- 4 × 32-bit channels, max. 32 GiB
- Up to LPDDR4X-4266
- Socket AM4:
All Zen 3 Chips[edit]
List of all Zen 3-based Processors | |||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Processor | Features | ||||||||||||||||||||||||
Model | Price | Process | Launched | Family | Core | C | T | TDP | L3 | Base | Turbo | Max Mem | SMT | SEV | SME | TSME | |||||||||
Uniprocessors | |||||||||||||||||||||||||
7313P | $ 913.00 € 821.70 £ 739.53 ¥ 94,340.29 | 15 March 2021 | EPYC | Milan | 16 | 32 | 155 W 155,000 mW 0.208 hp 0.155 kW | 128 MiB 131,072 KiB 134,217,728 B 0.125 GiB | 3 GHz 3,000 MHz 3,000,000 kHz | 3.7 GHz 3,700 MHz 3,700,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7443P | $ 1,337.00 € 1,203.30 £ 1,082.97 ¥ 138,152.21 | 15 March 2021 | EPYC | Milan | 24 | 48 | 200 W 200,000 mW 0.268 hp 0.2 kW | 128 MiB 131,072 KiB 134,217,728 B 0.125 GiB | 2.85 GHz 2,850 MHz 2,850,000 kHz | 4 GHz 4,000 MHz 4,000,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7543P | $ 2,730.00 € 2,457.00 £ 2,211.30 ¥ 282,090.90 | 15 March 2021 | EPYC | Milan | 32 | 64 | 225 W 225,000 mW 0.302 hp 0.225 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 2.8 GHz 2,800 MHz 2,800,000 kHz | 3.7 GHz 3,700 MHz 3,700,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7713P | $ 5,010.00 € 4,509.00 £ 4,058.10 ¥ 517,683.30 | 15 March 2021 | EPYC | Milan | 64 | 128 | 225 W 225,000 mW 0.302 hp 0.225 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 2 GHz 2,000 MHz 2,000,000 kHz | 3.675 GHz 3,675 MHz 3,675,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
5300G | 7 nm 0.007 μm 7.0e-6 mm | 13 April 2021 | Ryzen 3 | Cezanne | 4 | 8 | 65 W 65,000 mW 0.0872 hp 0.065 kW | 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB | 4 GHz 4,000 MHz 4,000,000 kHz | 4.2 GHz 4,200 MHz 4,200,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5300GE | 7 nm 0.007 μm 7.0e-6 mm | 13 April 2021 | Ryzen 3 | Cezanne | 4 | 8 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB | 3.6 GHz 3,600 MHz 3,600,000 kHz | 4.2 GHz 4,200 MHz 4,200,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5400U | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 3 | Cezanne | 4 | 8 | 15 W 15,000 mW 0.0201 hp 0.015 kW | 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB | 2.6 GHz 2,600 MHz 2,600,000 kHz | 4 GHz 4,000 MHz 4,000,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
PRO 5350G | 7 nm 0.007 μm 7.0e-6 mm | 1 June 2021 | Ryzen 3 | Cezanne | 4 | 8 | 65 W 65,000 mW 0.0872 hp 0.065 kW | 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB | 4 GHz 4,000 MHz 4,000,000 kHz | 4.2 GHz 4,200 MHz 4,200,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
PRO 5350GE | 7 nm 0.007 μm 7.0e-6 mm | 1 June 2021 | Ryzen 3 | Cezanne | 4 | 8 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB | 3.6 GHz 3,600 MHz 3,600,000 kHz | 4.2 GHz 4,200 MHz 4,200,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
PRO 5450U | 7 nm 0.007 μm 7.0e-6 mm | 16 March 2021 | Ryzen 3 | Cezanne | 4 | 8 | 15 W 15,000 mW 0.0201 hp 0.015 kW | 8 MiB 8,192 KiB 8,388,608 B 0.00781 GiB | 2.6 GHz 2,600 MHz 2,600,000 kHz | 4 GHz 4,000 MHz 4,000,000 kHz | ✔ | ✘ | ✘ | ✔ | |||||||||||
5600G | $ 259.00 € 233.10 £ 209.79 ¥ 26,762.47 | 7 nm 0.007 μm 7.0e-6 mm | 13 April 2021 | Ryzen 5 | Cezanne | 6 | 12 | 65 W 65,000 mW 0.0872 hp 0.065 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.9 GHz 3,900 MHz 3,900,000 kHz | 4.4 GHz 4,400 MHz 4,400,000 kHz | ✔ | ✘ | ✘ | ✘ | ||||||||||
5600GE | 7 nm 0.007 μm 7.0e-6 mm | 13 April 2021 | Ryzen 5 | Cezanne | 6 | 12 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.4 GHz 3,400 MHz 3,400,000 kHz | 4.4 GHz 4,400 MHz 4,400,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5600H | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 5 | Cezanne | 6 | 12 | 45 W 45,000 mW 0.0603 hp 0.045 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.3 GHz 3,300 MHz 3,300,000 kHz | 4.2 GHz 4,200 MHz 4,200,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5600HS | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 5 | Cezanne | 6 | 12 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3 GHz 3,000 MHz 3,000,000 kHz | 4.2 GHz 4,200 MHz 4,200,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5600U | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 5 | Cezanne | 6 | 12 | 15 W 15,000 mW 0.0201 hp 0.015 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 2.3 GHz 2,300 MHz 2,300,000 kHz | 4.2 GHz 4,200 MHz 4,200,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5600X | $ 299.00 € 269.10 £ 242.19 ¥ 30,895.67 | 7 nm 0.007 μm , 12 nm7.0e-6 mm 0.012 μm 1.2e-5 mm | 5 November 2020 | Ryzen 5 | Vermeer | 6 | 12 | 65 W 65,000 mW 0.0872 hp 0.065 kW | 32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB | 3.7 GHz 3,700 MHz 3,700,000 kHz | 4.6 GHz 4,600 MHz 4,600,000 kHz | 128 GiB 131,072 MiB 134,217,728 KiB 137,438,953,472 B 0.125 TiB | ✔ | ✘ | ✘ | ✘ | |||||||||
PRO 5650G | 7 nm 0.007 μm 7.0e-6 mm | 1 June 2021 | Ryzen 5 | Cezanne | 6 | 12 | 65 W 65,000 mW 0.0872 hp 0.065 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.9 GHz 3,900 MHz 3,900,000 kHz | 4.4 GHz 4,400 MHz 4,400,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
PRO 5650GE | 7 nm 0.007 μm 7.0e-6 mm | 1 June 2021 | Ryzen 5 | Cezanne | 6 | 12 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.4 GHz 3,400 MHz 3,400,000 kHz | 4.4 GHz 4,400 MHz 4,400,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
PRO 5650U | 7 nm 0.007 μm 7.0e-6 mm | 16 March 2021 | Ryzen 5 | Cezanne | 6 | 12 | 15 W 15,000 mW 0.0201 hp 0.015 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 2.3 GHz 2,300 MHz 2,300,000 kHz | 4.2 GHz 4,200 MHz 4,200,000 kHz | ✔ | ✘ | ✘ | ✔ | |||||||||||
5700G | $ 359.00 € 323.10 £ 290.79 ¥ 37,095.47 | 7 nm 0.007 μm 7.0e-6 mm | 13 April 2021 | Ryzen 7 | Cezanne | 8 | 16 | 65 W 65,000 mW 0.0872 hp 0.065 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.8 GHz 3,800 MHz 3,800,000 kHz | 4.6 GHz 4,600 MHz 4,600,000 kHz | ✔ | ✘ | ✘ | ✘ | ||||||||||
5700GE | 7 nm 0.007 μm 7.0e-6 mm | 13 April 2021 | Ryzen 7 | Cezanne | 8 | 16 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.2 GHz 3,200 MHz 3,200,000 kHz | 4.6 GHz 4,600 MHz 4,600,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5800 | 7 nm 0.007 μm , 12 nm7.0e-6 mm 0.012 μm 1.2e-5 mm | 12 January 2021 | Ryzen 7 | Vermeer | 8 | 16 | 65 W 65,000 mW 0.0872 hp 0.065 kW | 32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB | 3.4 GHz 3,400 MHz 3,400,000 kHz | 4.6 GHz 4,600 MHz 4,600,000 kHz | 128 GiB 131,072 MiB 134,217,728 KiB 137,438,953,472 B 0.125 TiB | ✔ | ✘ | ✘ | ✘ | ||||||||||
5800H | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 7 | Cezanne | 8 | 16 | 45 W 45,000 mW 0.0603 hp 0.045 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.2 GHz 3,200 MHz 3,200,000 kHz | 4.4 GHz 4,400 MHz 4,400,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5800HS | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 7 | Cezanne | 8 | 16 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 2.8 GHz 2,800 MHz 2,800,000 kHz | 4.4 GHz 4,400 MHz 4,400,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5800U | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 7 | Cezanne | 8 | 16 | 15 W 15,000 mW 0.0201 hp 0.015 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 1.9 GHz 1,900 MHz 1,900,000 kHz | 4.4 GHz 4,400 MHz 4,400,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5800X | $ 449.00 € 404.10 £ 363.69 ¥ 46,395.17 | 7 nm 0.007 μm , 12 nm7.0e-6 mm 0.012 μm 1.2e-5 mm | 5 November 2020 | Ryzen 7 | Vermeer | 8 | 16 | 105 W 105,000 mW 0.141 hp 0.105 kW | 32 MiB 32,768 KiB 33,554,432 B 0.0313 GiB | 3.8 GHz 3,800 MHz 3,800,000 kHz | 4.7 GHz 4,700 MHz 4,700,000 kHz | 128 GiB 131,072 MiB 134,217,728 KiB 137,438,953,472 B 0.125 TiB | ✔ | ✘ | ✘ | ✘ | |||||||||
5800X3D | $ 449.00 € 404.10 £ 363.69 ¥ 46,395.17 | 7 nm 0.007 μm , 12 nm7.0e-6 mm 0.012 μm 1.2e-5 mm | 20 April 2022 | Ryzen 7 | Vermeer | 8 | 16 | 105 W 105,000 mW 0.141 hp 0.105 kW | 96 MiB 98,304 KiB 100,663,296 B 0.0938 GiB | 3.4 GHz 3,400 MHz 3,400,000 kHz | 4.5 GHz 4,500 MHz 4,500,000 kHz | 128 GiB 131,072 MiB 134,217,728 KiB 137,438,953,472 B 0.125 TiB | ✘ | ✘ | ✘ | ✘ | |||||||||
PRO 5750G | 7 nm 0.007 μm 7.0e-6 mm | 1 June 2021 | Ryzen 7 | Cezanne | 8 | 16 | 65 W 65,000 mW 0.0872 hp 0.065 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.8 GHz 3,800 MHz 3,800,000 kHz | 4.6 GHz 4,600 MHz 4,600,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
PRO 5750GE | 7 nm 0.007 μm 7.0e-6 mm | 1 June 2021 | Ryzen 7 | Cezanne | 8 | 16 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.2 GHz 3,200 MHz 3,200,000 kHz | 4.6 GHz 4,600 MHz 4,600,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
PRO 5850U | 7 nm 0.007 μm 7.0e-6 mm | 16 March 2021 | Ryzen 7 | Cezanne | 8 | 16 | 15 W 15,000 mW 0.0201 hp 0.015 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 1.9 GHz 1,900 MHz 1,900,000 kHz | 4.4 GHz 4,400 MHz 4,400,000 kHz | ✔ | ✘ | ✘ | ✔ | |||||||||||
5900 | 7 nm 0.007 μm , 12 nm7.0e-6 mm 0.012 μm 1.2e-5 mm | 12 January 2021 | Ryzen 9 | Vermeer | 12 | 24 | 65 W 65,000 mW 0.0872 hp 0.065 kW | 64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB | 3 GHz 3,000 MHz 3,000,000 kHz | 4.7 GHz 4,700 MHz 4,700,000 kHz | 128 GiB 131,072 MiB 134,217,728 KiB 137,438,953,472 B 0.125 TiB | ✔ | ✘ | ✘ | ✘ | ||||||||||
5900HS | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 9 | Cezanne | 8 | 16 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3 GHz 3,000 MHz 3,000,000 kHz | 4.6 GHz 4,600 MHz 4,600,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5900HX | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 9 | Cezanne | 8 | 16 | 45 W 45,000 mW 0.0603 hp 0.045 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.3 GHz 3,300 MHz 3,300,000 kHz | 4.6 GHz 4,600 MHz 4,600,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5900X | $ 549.00 € 494.10 £ 444.69 ¥ 56,728.17 | 7 nm 0.007 μm , 12 nm7.0e-6 mm 0.012 μm 1.2e-5 mm | 5 November 2020 | Ryzen 9 | Vermeer | 12 | 24 | 105 W 105,000 mW 0.141 hp 0.105 kW | 64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB | 3.7 GHz 3,700 MHz 3,700,000 kHz | 4.8 GHz 4,800 MHz 4,800,000 kHz | 128 GiB 131,072 MiB 134,217,728 KiB 137,438,953,472 B 0.125 TiB | ✔ | ✘ | ✘ | ✘ | |||||||||
5950X | $ 799.00 € 719.10 £ 647.19 ¥ 82,560.67 | 7 nm 0.007 μm , 12 nm7.0e-6 mm 0.012 μm 1.2e-5 mm | 5 November 2020 | Ryzen 9 | Vermeer | 16 | 32 | 105 W 105,000 mW 0.141 hp 0.105 kW | 64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB | 3.4 GHz 3,400 MHz 3,400,000 kHz | 4.9 GHz 4,900 MHz 4,900,000 kHz | 128 GiB 131,072 MiB 134,217,728 KiB 137,438,953,472 B 0.125 TiB | ✔ | ✘ | ✘ | ✘ | |||||||||
5980HS | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 9 | Cezanne | 8 | 16 | 35 W 35,000 mW 0.0469 hp 0.035 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3 GHz 3,000 MHz 3,000,000 kHz | 4.8 GHz 4,800 MHz 4,800,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
5980HX | 7 nm 0.007 μm 7.0e-6 mm | 12 January 2021 | Ryzen 9 | Cezanne | 8 | 16 | 45 W 45,000 mW 0.0603 hp 0.045 kW | 16 MiB 16,384 KiB 16,777,216 B 0.0156 GiB | 3.3 GHz 3,300 MHz 3,300,000 kHz | 4.8 GHz 4,800 MHz 4,800,000 kHz | ✔ | ✘ | ✘ | ✘ | |||||||||||
PRO 5945WX | 7 nm 0.007 μm 7.0e-6 mm | 8 March 2022 | Ryzen Threadripper | Chagall | 12 | 24 | 280 W 280,000 mW 0.375 hp 0.28 kW | 64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB | 4.1 GHz 4,100 MHz 4,100,000 kHz | 4.5 GHz 4,500 MHz 4,500,000 kHz | 2,048 GiB 2,097,152 MiB 2,147,483,648 KiB 2,199,023,255,552 B 2 TiB | ✔ | ✘ | ✘ | ✔ | ||||||||||
PRO 5955WX | 7 nm 0.007 μm 7.0e-6 mm | 8 March 2022 | Ryzen Threadripper | Chagall | 16 | 32 | 280 W 280,000 mW 0.375 hp 0.28 kW | 64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB | 4 GHz 4,000 MHz 4,000,000 kHz | 4.5 GHz 4,500 MHz 4,500,000 kHz | 2,048 GiB 2,097,152 MiB 2,147,483,648 KiB 2,199,023,255,552 B 2 TiB | ✔ | ✘ | ✘ | ✔ | ||||||||||
PRO 5965WX | 7 nm 0.007 μm 7.0e-6 mm | 8 March 2022 | Ryzen Threadripper | Chagall | 24 | 48 | 280 W 280,000 mW 0.375 hp 0.28 kW | 128 MiB 131,072 KiB 134,217,728 B 0.125 GiB | 3.8 GHz 3,800 MHz 3,800,000 kHz | 4.5 GHz 4,500 MHz 4,500,000 kHz | 2,048 GiB 2,097,152 MiB 2,147,483,648 KiB 2,199,023,255,552 B 2 TiB | ✔ | ✘ | ✘ | ✔ | ||||||||||
PRO 5975WX | 7 nm 0.007 μm 7.0e-6 mm | 8 March 2022 | Ryzen Threadripper | Chagall | 32 | 64 | 280 W 280,000 mW 0.375 hp 0.28 kW | 128 MiB 131,072 KiB 134,217,728 B 0.125 GiB | 3.6 GHz 3,600 MHz 3,600,000 kHz | 4.5 GHz 4,500 MHz 4,500,000 kHz | 2,048 GiB 2,097,152 MiB 2,147,483,648 KiB 2,199,023,255,552 B 2 TiB | ✔ | ✘ | ✘ | ✔ | ||||||||||
PRO 5995WX | 7 nm 0.007 μm 7.0e-6 mm | 8 March 2022 | Ryzen Threadripper | Chagall | 64 | 128 | 280 W 280,000 mW 0.375 hp 0.28 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 2.7 GHz 2,700 MHz 2,700,000 kHz | 4.5 GHz 4,500 MHz 4,500,000 kHz | 2,048 GiB 2,097,152 MiB 2,147,483,648 KiB 2,199,023,255,552 B 2 TiB | ✔ | ✘ | ✘ | ✔ | ||||||||||
Multiprocessors (dual-socket) | |||||||||||||||||||||||||
72F3 | $ 2,468.00 € 2,221.20 £ 1,999.08 ¥ 255,018.44 | 15 March 2021 | EPYC | Milan | 8 | 16 | 180 W 180,000 mW 0.241 hp 0.18 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 3.7 GHz 3,700 MHz 3,700,000 kHz | 4.1 GHz 4,100 MHz 4,100,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7313 | $ 1,083.00 € 974.70 £ 877.23 ¥ 111,906.39 | 15 March 2021 | EPYC | Milan | 16 | 32 | 155 W 155,000 mW 0.208 hp 0.155 kW | 128 MiB 131,072 KiB 134,217,728 B 0.125 GiB | 3 GHz 3,000 MHz 3,000,000 kHz | 3.7 GHz 3,700 MHz 3,700,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7343 | $ 1,565.00 € 1,408.50 £ 1,267.65 ¥ 161,711.45 | 15 March 2021 | EPYC | Milan | 16 | 32 | 190 W 190,000 mW 0.255 hp 0.19 kW | 128 MiB 131,072 KiB 134,217,728 B 0.125 GiB | 3.2 GHz 3,200 MHz 3,200,000 kHz | 3.9 GHz 3,900 MHz 3,900,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
73F3 | $ 3,521.00 € 3,168.90 £ 2,852.01 ¥ 363,824.93 | 15 March 2021 | EPYC | Milan | 16 | 32 | 240 W 240,000 mW 0.322 hp 0.24 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 3.5 GHz 3,500 MHz 3,500,000 kHz | 4 GHz 4,000 MHz 4,000,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7413 | $ 1,825.00 € 1,642.50 £ 1,478.25 ¥ 188,577.25 | 15 March 2021 | EPYC | Milan | 24 | 48 | 180 W 180,000 mW 0.241 hp 0.18 kW | 128 MiB 131,072 KiB 134,217,728 B 0.125 GiB | 2.65 GHz 2,650 MHz 2,650,000 kHz | 3.6 GHz 3,600 MHz 3,600,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7443 | $ 2,010.00 € 1,809.00 £ 1,628.10 ¥ 207,693.30 | 15 March 2021 | EPYC | Milan | 24 | 48 | 200 W 200,000 mW 0.268 hp 0.2 kW | 128 MiB 131,072 KiB 134,217,728 B 0.125 GiB | 2.85 GHz 2,850 MHz 2,850,000 kHz | 4 GHz 4,000 MHz 4,000,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7453 | $ 1,570.00 € 1,413.00 £ 1,271.70 ¥ 162,228.10 | 15 March 2021 | EPYC | Milan | 28 | 56 | 225 W 225,000 mW 0.302 hp 0.225 kW | 64 MiB 65,536 KiB 67,108,864 B 0.0625 GiB | 2.75 GHz 2,750 MHz 2,750,000 kHz | 3.45 GHz 3,450 MHz 3,450,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
74F3 | $ 2,900.00 € 2,610.00 £ 2,349.00 ¥ 299,657.00 | 15 March 2021 | EPYC | Milan | 24 | 48 | 240 W 240,000 mW 0.322 hp 0.24 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 3.2 GHz 3,200 MHz 3,200,000 kHz | 4 GHz 4,000 MHz 4,000,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7513 | $ 2,840.00 € 2,556.00 £ 2,300.40 ¥ 293,457.20 | 15 March 2021 | EPYC | Milan | 32 | 64 | 200 W 200,000 mW 0.268 hp 0.2 kW | 128 MiB 131,072 KiB 134,217,728 B 0.125 GiB | 2.6 GHz 2,600 MHz 2,600,000 kHz | 3.65 GHz 3,650 MHz 3,650,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7543 | $ 3,761.00 € 3,384.90 £ 3,046.41 ¥ 388,624.13 | 15 March 2021 | EPYC | Milan | 32 | 64 | 225 W 225,000 mW 0.302 hp 0.225 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 2.8 GHz 2,800 MHz 2,800,000 kHz | 3.7 GHz 3,700 MHz 3,700,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
75F3 | $ 4,860.00 € 4,374.00 £ 3,936.60 ¥ 502,183.80 | 15 March 2021 | EPYC | Milan | 32 | 64 | 280 W 280,000 mW 0.375 hp 0.28 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 2.95 GHz 2,950 MHz 2,950,000 kHz | 4 GHz 4,000 MHz 4,000,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7643 | $ 4,995.00 € 4,495.50 £ 4,045.95 ¥ 516,133.35 | 15 March 2021 | EPYC | Milan | 48 | 96 | 225 W 225,000 mW 0.302 hp 0.225 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 2.3 GHz 2,300 MHz 2,300,000 kHz | 3.6 GHz 3,600 MHz 3,600,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7663 | $ 6,366.00 € 5,729.40 £ 5,156.46 ¥ 657,798.78 | 15 March 2021 | EPYC | Milan | 56 | 112 | 240 W 240,000 mW 0.322 hp 0.24 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 2 GHz 2,000 MHz 2,000,000 kHz | 3.5 GHz 3,500 MHz 3,500,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7713 | $ 7,060.00 € 6,354.00 £ 5,718.60 ¥ 729,509.80 | 15 March 2021 | EPYC | Milan | 64 | 128 | 225 W 225,000 mW 0.302 hp 0.225 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 2 GHz 2,000 MHz 2,000,000 kHz | 3.675 GHz 3,675 MHz 3,675,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
7763 | $ 7,890.00 € 7,101.00 £ 6,390.90 ¥ 815,273.70 | 15 March 2021 | EPYC | Milan | 64 | 128 | 280 W 280,000 mW 0.375 hp 0.28 kW | 256 MiB 262,144 KiB 268,435,456 B 0.25 GiB | 2.45 GHz 2,450 MHz 2,450,000 kHz | 3.5 GHz 3,500 MHz 3,500,000 kHz | 4,096 GiB 4,194,304 MiB 4,294,967,296 KiB 4,398,046,511,104 B 4 TiB | ✔ | ✔ | ✔ | ✔ | ||||||||||
Count: 57 |
Designers[edit]
- Mark Evers, Chief Architect
Bibliography[edit]
- AMD 'Tech Day', February 22, 2017
- AMD 2017 Financial Analyst Day, May 16, 2017
References[edit]
- ↑ "White Paper: Security Analysis of AMD Predictive Store Forwarding", AMD, March 2021
- ↑ "AMD64 Architecture Programmer’s Manual Volume 2: System Programming", AMD Publ. #24593, Rev. 3.37, March 2021
- ↑ "AMD64 Architecture Programmer’s Manual Volume 3: General-Purpose and System Instructions", AMD Publ. #24594, Rev. 3.32, March 2021
- ↑ "AMD64 Architecture Programmer’s Manual Volume 4: 128-Bit and 256-Bit Media Instructions", AMD Publ. #26568, Rev. 3.24, May 2020
- ↑ 5.0 5.1 "AMD64 Technology Platform Quality of Service Extensions", AMD Publ. #56375, Rev. 1.02, October 2020
- ↑ "Software Optimization Guide for AMD Family 19h Processors (PUB)", AMD Publ. #56665, Rev. 3.00, November 2020
- ↑ "Preliminary Processor Programming Reference (PPR) for AMD Family 19h Model 01h, Revision B1 Processors", AMD Publ. #55898, Rev. 0.35, February 5, 2021
- ↑ "Preliminary Processor Programming Reference (PPR) for AMD Family 19h Model 01h, Revision B1 Processors", AMD Publ. #55898, Rev. 0.50, May 27, 2021
- ↑ "FP6 Processor Motherboard Design Guide", AMD Publ. #56178, Rev. 1.03, January 2020
See Also[edit]
- AMD Zen, Zen 2, Zen 4
- Intel Tigerlake
- Read also: AMD Zen 3 Ryzen Deep Dive Review
- Read here: AMD Zen 3 Reviews
codename | Zen 3 + |
core count | 64 +, 56 +, 48 +, 32 +, 28 +, 24 +, 16 +, 12 +, 8 + and 6 + |
designer | AMD + |
first launched | October 8, 2020 + |
full page name | amd/microarchitectures/zen 3 + |
instance of | microarchitecture + |
instruction set architecture | x86-64 + |
manufacturer | TSMC + and GlobalFoundries + |
microarchitecture type | CPU + |
name | Zen 3 + |
pipeline stages | 19 + |