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  • mosfet
    ...rs. The 5th valence electron is loosely bound to that group V element. The thermal vibrations is enough make that electron free to move - leaving positive ion ...or HIGH and LOW. The positive voltage of the transistor is called VDD (or POWER or PWR). VDD represents the logic 1 value in digital circuits. In TTL logic
    8 KB (1,362 words) - 23:38, 17 November 2015
  • Property:tdp
    This is a '''[[has type::quantity]]''' property representing thermal design power of the device.
    273 bytes (34 words) - 16:47, 1 January 2016
  • intel/atom x5/x5-e8000
    ...by [[Intel]] in early 2016. This ultra-low power SoC has a thermal design power of just 5 W and operates at a base frequency of 1.04 GHz with a burst up to
    4 KB (475 words) - 17:42, 27 March 2018
  • intel/microarchitectures/bonnell
    ...irst x86-compatible [[microarchitecture]] designed to target the ultra-low power market. Bonnell (project Silverthorne then) was designed by a then-new low-power design team Intel created at their Texas Development Center in Austin in 20
    38 KB (5,468 words) - 20:29, 23 May 2019
  • intel/core i7ee/i7-920xm
    | power = ...nm process]]. The i7-920XM supports 8GB of memory and has a thermal design power of 55 W.
    4 KB (522 words) - 20:46, 4 October 2018
  • intel/core i7ee/i7-940xm
    | power = ...nm process]]. The i7-940XM supports 8GB of memory and has a thermal design power of 55 W.
    4 KB (537 words) - 15:01, 13 December 2019
  • intel/microarchitectures/sandy bridge (client)
    ...ture with a brand new core design which is both more highly performing and power efficient. The front-end has been entirely redesigned to incorporate a new ** New power management unit
    84 KB (13,075 words) - 00:54, 29 December 2020
  • intel/microarchitectures/skylake (client)
    ** Lower-power I/O (eMMC, UFS, SDXC) ...nd efficiency in order to cover a large spectrum of devices from ultra-low power to high-performance computing. Additionally, a large number of improvements
    79 KB (11,922 words) - 06:46, 11 November 2022
  • intel/core i7ee/i7-975
    ...core. This chip supports up to 24 GiB of memory and has a thermal design power of 130 W.
    4 KB (415 words) - 16:24, 13 December 2017
  • intel/core i7ee/i7-965
    ...core. This chip supports up to 24 GiB of memory and has a thermal design power of 130 W.
    4 KB (415 words) - 16:24, 13 December 2017
  • intel/core i7ee/i7-980x
    ...3.6 GHz. This MPU supports up to 24 GiB of memory and has a thermal design power of 130 W.
    4 KB (419 words) - 16:24, 13 December 2017
  • intel/core i7ee/i7-990x
    ....73 GHz. This MPU supports up to 24 GiB of memory and has a thermal design power of 130 W.
    4 KB (414 words) - 16:24, 13 December 2017
  • intel/core i7ee/i7-3960x
    ...this chip supports up to 64 GiB (DDR3) of memory and has a Thermal Design Power of 130 W.
    5 KB (517 words) - 23:32, 22 September 2019
  • intel/core i7ee/i7-3970x
    ...this chip supports up to 64 GiB (DDR3) of memory and has a Thermal Design Power of 150 W.
    4 KB (456 words) - 16:24, 13 December 2017
  • intel/turbo boost technology
    ...n on TBT-enabled processors when there is sufficient headroom - subject to power rating, temperature rating, and current limits. ...d on a number of factors such as: estimated current consumption, estimated power consumption, core temperature, and the number of active cores.
    7 KB (990 words) - 14:39, 23 July 2022
  • Property:tdp down
    ...[has type::quantity]]''' property representing configurable thermal design power down of the device.
    330 bytes (41 words) - 20:59, 9 May 2016
  • Property:tdp up
    ...[has type::quantity]]''' property representing configurable thermal design power up of the device.
    330 bytes (41 words) - 21:00, 9 May 2016
  • amd/am486
    ...ips they branded as "Enhanced Am486". Those processors had a number of new power saving features (e.g. SMM and Stop Clock Mode). The additional features fou === Thermal & Clock ===
    13 KB (1,897 words) - 09:30, 21 July 2021
  • amd/am5x86
    ...d|Am486#Enhanced Am486|Enhanced Am486s}} which included various system and power management features (e.g. SMM & Stop-clock control). Additionally the 5x86 === Thermal & Clock ===
    7 KB (1,043 words) - 16:50, 14 June 2020
  • amd/k5
    === Thermal & Clock === * [[:File:CPU Thermal Management (Am486, Am5x86, K5) (August 1995).pdf|CPU Thermal Management]]; Publication #18448 Revision D/0; August 1995.
    8 KB (1,002 words) - 22:19, 17 June 2022
  • microarchitecture
    ...r companies|companies]] with different design goals (e.g. budget, thermal, power, and performance). The exact design of the microarchitecture ultimately det
    3 KB (431 words) - 22:51, 21 November 2017
  • amd/microarchitectures/zen
    ...ew design, built from the ground up for optimal balance of performance and power capable of covering the entire computing spectrum from fanless notebooks to ...roprocessor - transistor allocation/die size, clock/frequency restriction, power limitations, and new instructions to implement.
    79 KB (12,095 words) - 15:27, 9 June 2023
  • amd/packages/socket am4
    |MA/MB_EVENT_L||DRAM Thermal Event Status |SATA_ZP(0-1)_L||Zero Power SATA {{abbr|ODD}}
    30 KB (6,098 words) - 01:58, 12 January 2024
  • intel/cores/diamondville
    ...s based on the {{intel|Bonnell|l=arch}} microarchitecture. Those ultra-low power chips were manufactured on Intel's 45 nm process and were specifically aime ...h as full support for [[x86-64]]. Diamondville generally targets the 4-8 W thermal envelope typically fan-less designs.
    4 KB (470 words) - 22:20, 15 April 2017
  • intel/atom/230
    | average power = | idle power =
    4 KB (479 words) - 16:14, 13 December 2017
  • intel/atom/330
    | average power = | idle power =
    4 KB (524 words) - 16:14, 13 December 2017
  • amd/infinity fabric
    ...llaneous system control signals - this includes things such as thermal and power management, tests, security, and 3rd party IP. With those two planes, AMD c .... Additionally [[inversion encoding]] was used to save another 10% average power per bit.
    8 KB (1,271 words) - 21:50, 18 August 2020
  • amd/ryzen threadripper
    ...er models. Higher-performance dies allow for higher efficiency in terms of power consumption at higher clock speeds and in theory allow for higher overclock ...ntroduction of higher core count models but at the cost of a much higher [[thermal design point]]. 2900-Series doubled the core count to as much as [[32 cores
    13 KB (1,744 words) - 15:33, 16 April 2022
  • x86/avx-512
    ...timizations where execution resources are dynamically disabled if power or thermal limits are reached instead of downclocking the CPU core which also affects
    83 KB (13,667 words) - 15:45, 16 March 2023
  • intel/frequency behavior
    ...s are added and the overall core grows in capabilities. Unfortunately, the power constraints have remained the same and in many situations have gotten more ...act additional performance through higher frequency whenever the power and thermal budgets allow.
    5 KB (797 words) - 01:10, 1 June 2020
  • small core
    ...meet stringent [[die size|area]] and electrical constraints (e.g., power, thermal, area). This is in contrast to a [[big core]] that implements the same [[ar
    407 bytes (61 words) - 05:47, 29 December 2018
  • amd/frequency behavior
    ...act additional performance through higher frequency whenever the power and thermal budgets allow. ...ead, the processor will automatically allow turbo for as many cores as the power budget allows.
    2 KB (286 words) - 11:35, 2 May 2020
  • intel/cores/coffee lake h
    ...chip to increase the clock frequency by an additional 200 MHz so long the thermal temperatures allows provided the cooling solution is adequate. |?intel thermal velocity boost#GHz
    5 KB (648 words) - 17:43, 6 December 2018
  • intel/microarchitectures/enhanced netburst
    ...aul Otellini (then, president and chief operating officer) confirmed that "thermal considerations" were the root of the problem and that all future Intel proc
    3 KB (334 words) - 07:05, 29 December 2018
  • intel/celeron/797
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (642 words) - 19:19, 17 March 2018
  • intel/celeron/787
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (642 words) - 19:18, 17 March 2018
  • intel/celeron/b720
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:21, 17 March 2018
  • intel/celeron/b710
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:21, 17 March 2018
  • intel/celeron/807
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    5 KB (655 words) - 19:19, 17 March 2018
  • intel/celeron/887
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (651 words) - 19:21, 17 March 2018
  • intel/celeron/877
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    5 KB (657 words) - 19:20, 17 March 2018
  • intel/celeron/867
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (642 words) - 19:20, 17 March 2018
  • intel/celeron/b840
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:22, 17 March 2018
  • intel/celeron/b830
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:22, 17 March 2018
  • intel/celeron/857
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (642 words) - 19:20, 17 March 2018
  • intel/celeron/b820
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:22, 17 March 2018
  • intel/celeron/b815
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 16:13, 17 March 2018
  • intel/celeron/847
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (633 words) - 19:20, 17 March 2018
  • intel/celeron/b810
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (638 words) - 19:22, 17 March 2018
  • intel/celeron/b800
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (639 words) - 19:22, 17 March 2018
  • intel/celeron/847e
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (647 words) - 19:20, 17 March 2018
  • intel/celeron/827e
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (647 words) - 19:19, 17 March 2018
  • intel/celeron/b810e
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (652 words) - 19:22, 17 March 2018
  • intel/celeron/817
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (649 words) - 19:19, 17 March 2018
  • intel/celeron/827
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (640 words) - 19:19, 17 March 2018
  • intel/celeron/b860e
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (647 words) - 19:23, 17 March 2018
  • intel/celeron/897
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (646 words) - 19:21, 17 March 2018
  • intel/celeron/837
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (640 words) - 19:20, 17 March 2018
  • intel/celeron/887e
    |idle power=2.3 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (645 words) - 19:21, 17 March 2018
  • intel/celeron/b730
    |idle power=3.1 W * [[:File:2nd-gen-core-mobile-thermal-guide.pdf|Thermal Design Guide for Embedded Applications]]
    4 KB (642 words) - 11:47, 21 June 2019
  • microsoft/scorpio engine
    ** Up to 5 ports configurable x4, x2, x1 with power-of-two alignment | PWROK || Power OK input; Indicates that all voltage planes and free-running clocks are wit
    15 KB (2,390 words) - 02:54, 17 May 2023
  • nxp/qoriq
    | arch = POWER & ARM Communication SoC '''QorIQ''' (pronounced "''Core IQ''") is a family of [[ARM]] and [[POWER]] embedded and networking microprocessors designed and sold by [[NXP]] (for
    6 KB (795 words) - 20:23, 31 October 2017
  • bitmain/sophon/bm1680
    ...OPS]] (SP), the BM1680 has a typical power dissipation of 25 W with a peak power of 41 W. The chip was [[taped-out]] in April 2017 and began sampling in Jun The MCU Subsystem is a low-power {{arch|32}} embedded [[ARM]] microcontroller which can be boot from SPI Fla
    4 KB (603 words) - 09:59, 11 August 2018
  • dark silicon
    ...r to keep the chip power consumption within its pragmatic [[thermal design power]] (TDP) constraints.
    252 bytes (39 words) - 05:18, 10 February 2018
  • tdp
    {{title|Thermal Design Power (TDP)}} ...r point of the thermal profile and is used for determining the appropriate thermal solution design target.
    3 KB (478 words) - 02:52, 26 September 2018
  • intel/thermal velocity boost
    {{intel title|Thermal Velocity Boost (TVB)}} '''Thermal Velocity Boost''' ('''TVB''') is a microprocessor technology developed by [
    2 KB (411 words) - 17:23, 9 August 2021
  • amd/packages/socket tr4
    ...ed by pin [[#SP3R1|SP3R2]] and Socket TR4 motherboards are not supposed to power up the socket if a SP3 or sWRX8 processor is installed.<!--AMD-55809 Sec 11 ...6 lanes, up to 8 ports per interface configurable x16, x8, x4, x2, x1 with power-of-two alignment (e.g. 1x4 + 4x1 + 1x8)
    86 KB (17,313 words) - 02:48, 13 March 2023
  • amd/packages/socket sp3
    ...R1|SP3R1]], and [[#SP3R2|SP3R2]], and SP3 motherboards are not supposed to power up the socket if a TR4 or sTRX4 processor is installed.<!--AMD-55414 Sec 11 ...he {{abbr|PSP}}, SMUs and other IPs, primarily for temperature monitoring, power and frequency control. Four socket systems are not supported although the a
    110 KB (21,122 words) - 02:46, 13 March 2023
  • amd/pbo
    ...ing mechanism]] found in various [[AMD]] processors that pushes the system power budget beyond its rated specifications in order to allow {{amd|Precision Bo ...ically increases the chip power budget by sensing SoC information (such as power, current, voltage, temperature) as well as motherboard subsystem [[VRM]] co
    2 KB (277 words) - 16:05, 26 May 2021
  • Property:tdp (typical)
    ...s type::quantity]]''' property representing the ''TYPICAL'' thermal design power of the device.
    289 bytes (36 words) - 12:02, 25 December 2018
  • tesla (car company)/fsd chip
    ...ermal requirements of prior solutions - including staying with the maximum power consumption of 100 W. Since the chip itself is designed specifically for Te ...hoices for both data types is largely driven by their effort to reduce the power consumption (e.g., a 32-bit FP addition consumes roughly 9 times as much as
    13 KB (1,952 words) - 20:34, 16 September 2023
  • intel/microarchitectures/rocket lake
    | {{intel|Rocket Lake U|l=core}} || Ultra-low power|| GT2 || Light notebooks, portable All-in-Ones (AiOs), Minis, and conferenc ...Threading|HT}} !! {{x86|AVX}} !! {{x86|AVX2}} !! {{x86|AVX512}} !! {{intel|Thermal Velocity Boost|TVB}} !! [[ECC]]
    5 KB (700 words) - 12:55, 20 November 2021
  • intel/microarchitectures/spring hill
    ** Leverages the [[DVFS]] power controller ...ase of integration into existing infrastructure without additional cooling/power capacity.
    9 KB (1,292 words) - 08:41, 26 March 2020
  • amd/ryzen threadripper/3970x
    * {{cite techdoc|title=Power and Thermal Data Sheet for AMD Family 17h Models 30h-3Fh sTRX4 Processors|publ=AMD|pid=
    4 KB (700 words) - 12:54, 18 March 2023
  • amd/ryzen threadripper/3960x
    * {{cite techdoc|title=Power and Thermal Data Sheet for AMD Family 17h Models 30h-3Fh sTRX4 Processors|publ=AMD|pid=
    4 KB (700 words) - 12:54, 18 March 2023
  • amd/ryzen threadripper/3990x
    * {{cite techdoc|title=Power and Thermal Data Sheet for AMD Family 17h Models 30h-3Fh sTRX4 Processors|publ=AMD|pid=
    4 KB (687 words) - 12:54, 18 March 2023
  • amd/packages/socket 754
    ...ACPI C1 (Halt), C2, C3/S1 (Stop Grant), S3 (Core & HT power down), S5 (all power off) * Thermal diode, overtemperature protection
    5 KB (662 words) - 09:51, 29 January 2020
  • amd/packages/socket 940
    ...tates, ACPI C1 (Halt), S1 (Stop Grant), S3 (Core & HT power down), S5 (all power off) * Thermal diode, overtemperature protection
    4 KB (576 words) - 15:27, 30 January 2020
  • amd/packages/socket 939
    ...tates, ACPI C1 (Halt), S1 (Stop Grant), S3 (Core & HT power down), S5 (all power off) * Thermal diode, overtemperature protection
    4 KB (490 words) - 22:47, 9 February 2020
  • amd/List of AMD publications
    ...||[[:File:CPU Thermal Management (Am486, Am5x86, K5) (August 1995).pdf|CPU Thermal Management]]||1995-08||Am486, Am5x86, K5 ...ge Power Supply Circuits (Am486, Am5x86, K5) (August 1995).pdf|Low Voltage Power Supply Circuits]]||1995-08||
    181 KB (24,861 words) - 16:02, 17 April 2022
  • amd/packages/socket am2
    * Thermal diode, overtemperature protection |LDTSTOP_L||HT Stop Control Input for power management and link width and frequency change
    7 KB (1,029 words) - 18:40, 22 February 2020
  • amd/packages/socket am2+
    ...g the CPU, limiting its HT link to generation 1.0 mode, and using a single power plane. The OPGA-940 package for Socket AM2+ has the same dimensions but is * P-States; ACPI C1, C1E, C2, C3, S1, S3, S5; dual power planes
    8 KB (1,212 words) - 19:01, 22 February 2020
  • amd/packages/socket am3
    * P-States; ACPI C0, C1, C1E, S0, S1, S3, S4, S5; dual power planes * Thermal diode, overtemperature protection
    12 KB (1,960 words) - 12:23, 18 July 2020
  • amd/packages/socket am3+
    * Up to 8 P-states; APM; ACPI C1, CC6, C1E, C2, C3, S1, S3, S5; dual power planes * Thermal diode, overtemperature protection
    6 KB (822 words) - 15:01, 9 December 2022
  • amd/packages/asb1
    '''ASB1''' was a BGA-812 package for low power [[AMD]] mobile microprocessors with an * Thermal diode, overtemperature protection
    3 KB (481 words) - 16:24, 16 March 2023
  • amd/packages/asb2
    '''ASB2''' was a BGA-812 package for low power [[AMD]] mobile microprocessors with an ...nd NB P-States; ACPI C0, C1, C1E, S0, S1, S3, S4, S5; Separate core and NB power planes
    4 KB (527 words) - 16:25, 16 March 2023
  • amd/packages/ft1
    '''FT1''' was a CPU package for low power [[AMD]] microprocessors with integrated graphics targeting the thin client, |M_EVENT_L||I-IO-S||DRAM Thermal Event
    14 KB (2,611 words) - 00:31, 4 April 2022
  • amd/packages/socket fm1
    * Power Management ** ACPI P-states, processor power states C0, C1, sleep states S0, S3, S4, S5
    7 KB (1,063 words) - 15:50, 4 September 2020
  • amd/packages/socket fm2+
    * Power Management ** ACPI P-states, processor power states C0, C1, CC6, PC6, sleep states S0, S3, S4, S5
    5 KB (770 words) - 15:12, 4 September 2020
  • amd/packages/socket fm2
    * Power Management ** ACPI P-states, processor power states C0, C1, C1E, C6, CC6, sleep states S0, S3, S4, S5
    5 KB (727 words) - 15:34, 4 September 2020
  • amd/packages/ft3
    '''FT3''' is a '''BGA-769''' package for low power [[AMD]] mobile and embedded microprocessors with an integrated north bridge * Power Management
    5 KB (645 words) - 16:31, 16 March 2023
  • amd/packages/ft3b
    '''FT3b''' is a '''BGA-769''' package for low power [[AMD]] microprocessors with an integrated north bridge, graphics processor * Power Management
    4 KB (610 words) - 16:33, 16 March 2023
  • amd/packages/socket fs1r2
    * Power Management ** AMD AllDay power technology
    5 KB (755 words) - 13:50, 7 September 2020
  • amd/packages/socket am1
    * Power Management ** ACPI P-states, processor power states C0, C1, CC6, PC6, sleep states S0, S3, and S5
    5 KB (642 words) - 14:08, 7 September 2020
  • amd/packages/fp2
    * Power Management ** AMD AllDay power technology
    4 KB (641 words) - 23:21, 25 March 2023
  • amd/packages/fp3
    * Power Management ** ACPI P-states, processor power states C0, C1, CC6, PC6, sleep states S0, S3, S4, S5
    5 KB (630 words) - 23:22, 25 March 2023
  • amd/packages/fp6
    :* Up to 7 ports configurable x4, x2, x1 with power-of-two alignment (e.g. 1x4 + 2x1 + 3x2) ** 2 × USB 1.1, 2.0, 3.2 Gen 1, 2 (10 Gb/s), Type-C, DP Alt Mode, Power Delivery capable
    20 KB (3,273 words) - 17:47, 10 May 2023
  • amd/packages/socket f
    ...800 MT/s and uses dual power planes supplying the cores and northbridge, a power saving feature. Its desktop counterpart is {{\\|Socket AM2+}}. Socket Fr2 i * Power Management
    11 KB (1,717 words) - 17:25, 5 February 2021
  • x86/thermal protection
    {{x86 title|Thermal protection}} ...the thermal protection circuit has tripped. The motherboard is supposed to power off the processor in response and a system reset is necessary to leave this
    536 bytes (81 words) - 18:52, 12 January 2021
  • amd/packages/socket s1g1
    * P-States, multiple ACPI compliant low-power states including C1E with AltVID, AMD PowerNow! technology * Thermal Controls
    8 KB (1,126 words) - 18:53, 12 January 2021

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