This property describes a integrated circuit package type. Examples are:

• Flip-Chip Organic Land Grid Array (FC-OLGA)
• Organic Micro Ball Grid Array
• Ceramic Pin Grid Array (CPGA)

Only an abbreviation may be specified.

See also

• Property:socket
• Property:package
• Property:package type
• Property:package length
• Property:package width
• Property:package height
• Property:package contacts
• Property:package pitch

Pages using the property "package type"

Showing 25 pages using this property.

View (previous 25 | next 25) (20 | 50 | 100 | 250 | 500)

S
Socket C32 - AMD +	Organic Flip-Chip Land Grid Array  +
Socket F - AMD +	Organic Flip-Chip Land Grid Array  +
Socket FM1 - AMD +	Organic Micro Pin Grid Array  +
Socket FM2+ - AMD +	Organic Micro Pin Grid Array  +
Socket FM2 - AMD +	Organic Micro Pin Grid Array  +
Socket FS1 - AMD +	Organic Micro Pin Grid Array  +
Socket FS1r2 - AMD +	Organic Micro Pin Grid Array  +
Socket G34 - AMD +	FC-OLGA  +
Socket S1g1 - AMD +	Organic Micro Pin Grid Array  +
Socket S1g2 - AMD +	Organic Micro Pin Grid Array  +
Socket S1g3 - AMD +	Organic Micro Pin Grid Array  +
Socket S1g4 - AMD +	Organic Micro Pin Grid Array  +
Socket SP3 - Packages - AMD +	FC-OLGA  +
Socket SP5 - Packages - AMD +	FC-OLGA  +
Socket sTRX4 - AMD +	FC-OLGA  +
Socket sWRX8 - AMD +	FC-OLGA  +
Socket TR4 (SP3r2, sTR4) - Packages - AMD +	FC-OLGA  +
Sophon BM1680 - Bitmain#package +	FCBGA  +
Sophon BM1682 - Bitmain#package +	FCBGA  +
Sophon BM1684 - Bitmain#package +	FCBGA  +
Sophon BM1686 - Bitmain#package +	FCBGA  +
Super Socket 7 - AMD +	Ceramic Pin Grid Array  +
T
TMS1000 - TI#package +	PDIP  +, CDIP  +
TMS1098 - TI#package +	PDIP  +, CDIP  +
TMS1099 - TI#package +	PDIP  +, CDIP  +