|Introduction||May 16, 2017 (announced)|
June 20, 2017 (launched)
|TDP||120 W, 155 W, 180 W|
|Type||Organic Flip-Chip Land Grid Array|
|Dimension||58.5 mm × 75.4 mm|
Socket SP3 is a land grid array microprocessor socket designed by AMD for their EPYC family supported by the Zen microarchitectures. This socket is designed for ICs with a 4094-contact FCLGA packages.
SP3 is a socket specifically designed by AMD for their EPYC family of server processors and is supported by processors based on the Zen microarchitectures. Physically, the package is identical to the one used for Socket TR4 for their Threadripper processors, however, the features are very different.
- David. S. (March 2018). "ISSCC 2018: AMD’s Zeppelin; Multi-chip routing and packaging"
- AMD (November 2017). "Thermal Design Guide for Socket SP3 Processors"
|first announced||May 16, 2017 +|
|first launched||June 20, 2017 +|
|instance of||package +|
|market segment||Server +|
|name||Socket SP3 +|
|tdp||120 W (120,000 mW, 0.161 hp, 0.12 kW) +, 155 W (155,000 mW, 0.208 hp, 0.155 kW) + and 180 W (180,000 mW, 0.241 hp, 0.18 kW) +|