Below is a list of Intel microarchitectures:
Contents
CPU Microarchitectures
- See also: Intel, Lake, Core, and intel/core
Intel CPU Microarchitectures | |||||||||||
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General | Details | ||||||||||
µarch | Type | Manuf | Introduction | Phase-out | Process | Cores | Pipeline Num•Min•Max | ||||
80386 | CPU | Intel | 1984-03-01 | 1989-01-01 | 1,500 nm 1.5 μm 0.0015 mm | ||||||
80486 | CPU | Intel, AMD | 1989-04-10 | 1995-01-01 | 1,000 nm 1 μm , 800 nm0.001 mm 0.8 μm , 600 nm8.0e-4 mm 0.6 μm 6.0e-4 mm | ||||||
P5 | CPU | Intel | 1993-04-01 | 1995-10-01 | 600 nm 0.6 μm 6.0e-4 mm | ||||||
P6 | CPU | Intel | 1995-10-01 | 2000-12-01 | 350 nm 0.35 μm , 250 nm3.5e-4 mm 0.25 μm 2.5e-4 mm | ||||||
NetBurst | CPU | Intel | 2000-11-20 | 2006-04-01 | 180 nm 0.18 μm 1.8e-4 mm | ||||||
Merced | CPU | Intel | 2001-06-01 | 180 nm 0.18 μm 1.8e-4 mm | 1 | ||||||
McKinley | CPU | Intel | 2002-07-08 | 180 nm 0.18 μm 1.8e-4 mm | 1, 2 | ||||||
Pentium M | CPU | Intel | 2003-01-01 | 2005-01-01 | 130 nm 0.13 μm , 90 nm1.3e-4 mm 0.09 μm 9.0e-5 mm | ||||||
Madison | CPU | Intel | 2003-06-30 | 130 nm 0.13 μm 1.3e-4 mm | 1 | ||||||
Madison 9M | CPU | Intel | 2004-11-08 | 130 nm 0.13 μm 1.3e-4 mm | 1 | ||||||
Modified Pentium M | CPU | Intel | 2006-01-01 | 2008-01-01 | 65 nm 0.065 μm 6.5e-5 mm | ||||||
Core | CPU | Intel | 2006-04-01 | 2009-05-01 | 65 nm 0.065 μm 6.5e-5 mm | ||||||
Montecito | CPU | Intel | 2006-07-18 | 90 nm 0.09 μm 9.0e-5 mm | 1, 2 | ||||||
Polaris | CPU | Intel | 2007-02-01 | 65 nm 0.065 μm 6.5e-5 mm | 80 | 9 | |||||
Montvale | CPU | Intel | 2007-10-31 | 90 nm 0.09 μm 9.0e-5 mm | 1, 2 | ||||||
Penryn | CPU | Intel | 2007-11-01 | 2008-09-01 | 45 nm 0.045 μm 4.5e-5 mm | ||||||
Bonnell | CPU | Intel | 2008-03-02 | 2011-01-01 | 45 nm 0.045 μm 4.5e-5 mm | 1, 2 | 16 | 19 | |||
Nehalem | CPU | Intel | 2008-08-01 | 2010-03-01 | 45 nm 0.045 μm 4.5e-5 mm | ||||||
Rock Creek | CPU | Intel | 2009-12-01 | 45 nm 0.045 μm 4.5e-5 mm | 48 | ||||||
Westmere | CPU | Intel | 2010-01-01 | 2011-08-01 | 32 nm 0.032 μm 3.2e-5 mm | ||||||
Tukwila | CPU | Intel | 2010-02-08 | 65 nm 0.065 μm 6.5e-5 mm | 1, 2 | ||||||
Knights Ferry | CPU | Intel | 2010-05-31 | 2011-01-01 | 45 nm 0.045 μm 4.5e-5 mm | 32 | |||||
Sandy Bridge (client) | CPU | Intel | 2010-09-13 | 2012-11-01 | 32 nm 0.032 μm 3.2e-5 mm | 2, 4 | 14 | 19 | |||
Saltwell | CPU | Intel | 2011-01-01 | 2013-01-01 | 32 nm 0.032 μm 3.2e-5 mm | 1, 2 | 16 | ||||
Knights Corner | CPU | Intel | 2011-01-01 | 2013-01-01 | 22 nm 0.022 μm 2.2e-5 mm | 57, 60, 61 | |||||
Ivy Bridge | CPU | Intel | 2011-05-04 | 2013-04-01 | 22 nm 0.022 μm 2.2e-5 mm | ||||||
Poulson | CPU | Intel | 2012-11-08 | 32 nm 0.032 μm 3.2e-5 mm | 1, 2 | ||||||
Silvermont | CPU | Intel | 2013-01-01 | 2015-01-01 | 22 nm 0.022 μm 2.2e-5 mm | 1, 2, 4, 8 | 12 | 14 | |||
Haswell | CPU | Intel | 2013-06-04 | 2015-01-01 | 22 nm 0.022 μm 2.2e-5 mm | 2, 4, 6, 8, 16, 10, 12, 14, 18 | 14 | 19 | |||
Broadwell | CPU | Intel | 2014-10-01 | 14 nm 0.014 μm 1.4e-5 mm | 2, 4, 6, 8, 10, 12, 14, 16, 18, 20, 22 | 14 | 19 | ||||
Airmont | CPU | Intel | 2015-01-01 | 2017-01-01 | 14 nm 0.014 μm 1.4e-5 mm | 1, 2, 4, 8 | 12 | 14 | |||
Skylake (client) | CPU | Intel | 2015-08-05 | 14 nm 0.014 μm 1.4e-5 mm | 2, 4 | 14 | 19 | ||||
Goldmont | CPU | Intel | 2016-08-30 | 14 nm 0.014 μm 1.4e-5 mm | 2, 4, 8, 12, 16 | 12 | 14 | ||||
Kaby Lake | CPU | Intel | 2016-08-30 | 14 nm 0.014 μm 1.4e-5 mm | 2, 4 | 14 | 19 | ||||
Kittson | CPU | Intel | 2017-01-01 | 22 nm 0.022 μm 2.2e-5 mm | 1, 2 | ||||||
Skylake (server) | CPU | Intel | 2017-05-04 | 14 nm 0.014 μm 1.4e-5 mm | 4, 6, 8, 10, 12, 14, 16, 18, 20, 22, 24, 26, 28 | 14 | 19 | ||||
Coffee Lake | CPU | Intel, dell | 2017-10-05 | 14 nm 0.014 μm 1.4e-5 mm | 14 | 19 | |||||
Goldmont Plus | CPU | Intel | 2017-12-11 | 14 nm 0.014 μm 1.4e-5 mm | 2, 4 | ||||||
Knights Mill | CPU | Intel | 2017-12-18 | 2019-08-09 | 14 nm 0.014 μm 1.4e-5 mm | ||||||
Palm Cove | CPU | Intel | 2018-01-01 | 10 nm 0.01 μm 1.0e-5 mm | 2 | 14 | 19 | ||||
Amber Lake | CPU | Intel | 2018-04-01 | 14 nm 0.014 μm 1.4e-5 mm | 2 | 14 | 19 | ||||
Whiskey Lake | CPU | Intel | 2018-04-01 | 4 | 14 | 19 | |||||
Cannon Lake | CPU | Intel | 2018-05-15 | 10 nm 0.01 μm 1.0e-5 mm | 2 | 14 | 19 | ||||
Cascade Lake | CPU | Intel | 2019-01-01 | 14 nm 0.014 μm 1.4e-5 mm | 2, 4, 6, 8, 10, 12, 16, 18, 20, 22, 24, 26, 28, 32, 48, 56 | 14 | 19 | ||||
Tremont | CPU | Intel | 2019-01-01 | 10 nm 0.01 μm 1.0e-5 mm | |||||||
Snow Ridge | CPU | Intel | 2019-01-01 | 10 nm 0.01 μm 1.0e-5 mm | |||||||
Sunny Cove | CPU | Intel | 2019-01-01 | 2021-01-01 | 10 nm 0.01 μm 1.0e-5 mm | 2, 4, 8, 10, 12, 16, 18, 20, 24, 26, 28, 32, 36, 38, 40 | 14 | 19 | |||
Lakefield | CPU | Intel | 2019-01-01 | 22 nm 0.022 μm , 10 nm2.2e-5 mm 0.01 μm 1.0e-5 mm | 5 | ||||||
Ice Lake (client) | CPU | Intel | 2019-05-27 | 10 nm 0.01 μm 1.0e-5 mm | 2, 4 | 14 | 19 | ||||
Willow Cove | CPU | Intel | 2020-01-01 | 10 nm 0.01 μm 1.0e-5 mm | 2, 4, 6, 8 | 14 | 19 | ||||
Cooper Lake | CPU | Intel | 2020-06-18 | 28, 24, 20, 18, 16, 8 | 14 | 19 | |||||
Tiger Lake | CPU | Intel | 2020-09-02 | 10 nm 0.01 μm 1.0e-5 mm | 2, 4, 6, 8 | 14 | 19 | ||||
Alder Lake | CPU | Intel | 2021-01-01 | 10 nm 0.01 μm 1.0e-5 mm | 16, 14, 10, 6 | ||||||
Gracemont | CPU | Intel | 2021-01-01 | 10 nm 0.01 μm 1.0e-5 mm | |||||||
Rocket Lake | CPU | Intel | 2021-03-16 | 14 nm 0.014 μm 1.4e-5 mm | 4, 6, 8 | 14 | 19 | ||||
Ice Lake (server) | CPU | Intel | 2021-04-01 | 8, 10, 12, 16, 18, 20, 24, 26, 28, 32, 36, 38, 40 | 14 | 19 | |||||
Golden Cove | CPU | Intel | 2021-11-04 | 10 nm 0.01 μm 1.0e-5 mm | |||||||
Ocean Cove | CPU | Intel | 2022-01-01 | ||||||||
Raptor Lake | CPU | Intel | 2022-09-27 | 24, 16, 8 | |||||||
Emerald Rapids | CPU | Intel | 2023-01-01 | ||||||||
Meteor Lake | CPU | Intel | 2023-01-01 | ||||||||
Sapphire Rapids | CPU | Intel | 2023-01-01 | ||||||||
Granite Rapids | CPU | Intel | 2024-01-01 | 120, 80, 40 | |||||||
Sierra Forest | CPU | Intel | 2024-06-04 | ||||||||
Diamond Rapids | CPU | Intel | 2025-01-01 |
Newest models
- TSMC N3B (3 nm)
- Lunar Lake (hybrid) • Lion Cove (P)/Skymont (E) • Ultra 200V • 2024-09
- Arrow Lake (hybrid) • Ultra Series 2 • 2024-10 (desktop)/2025-01 (mobile)
- Intel 18A
- Panther Lake (hybrid) • Cougar Cove (P)/Darkmont,, (E) • Ultra 300 • 2025
- Diamond Rapids • Panther Cove X (Mountain Stream) • 2025
- Nova Lake (hybrid) • Coyote Cove • 2026
- Razer Lake (hybrid) • (TBA) • 2027
GPU Microarchitectures
Intel GPU Microarchitectures | |||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|
General | Details | ||||||||||
µarch | Introduction | Phase-out | Process | ||||||||
Gen1 | 1998-01-01 | ||||||||||
Gen2 | 2002-01-01 | ||||||||||
Gen3 | 2004-01-01 | ||||||||||
Gen3.5 | 2005-01-01 | 90 nm 0.09 μm 9.0e-5 mm | |||||||||
Gen4 | 2006-01-01 | 65 nm 0.065 μm 6.5e-5 mm | |||||||||
Gen5 | 2008-06-03 | 45 nm 0.045 μm 4.5e-5 mm | |||||||||
Larrabee | 2008-08-12 | 2010-01-01 | 32 nm 0.032 μm , 45 nm3.2e-5 mm 0.045 μm 4.5e-5 mm | ||||||||
Gen5.75 | 2010-01-01 | 45 nm 0.045 μm 4.5e-5 mm | |||||||||
Gen6 | 2010-09-13 | 32 nm 0.032 μm 3.2e-5 mm | |||||||||
Gen7 | 2011-05-04 | 22 nm 0.022 μm 2.2e-5 mm | |||||||||
Gen7.5 | 2013-06-04 | 22 nm 0.022 μm 2.2e-5 mm | |||||||||
Gen8 | 2014-10-01 | 14 nm 0.014 μm 1.4e-5 mm | |||||||||
Gen9 | 2015-08-05 | 14 nm 0.014 μm 1.4e-5 mm | |||||||||
Gen9.5 | 2016-08-30 | 14 nm 0.014 μm 1.4e-5 mm | |||||||||
Gen11 | 2018-01-01 | 10 nm 0.01 μm 1.0e-5 mm | |||||||||
Gen10 | 2018-01-01 | 10 nm 0.01 μm 1.0e-5 mm | |||||||||
Arctic Sound | 2020-01-01 | 10 nm 0.01 μm 1.0e-5 mm | |||||||||
Gen12 | 2020-01-01 | 10 nm 0.01 μm 1.0e-5 mm | |||||||||
Jupiter Sound | 2022-01-01 | 10 nm 0.01 μm 1.0e-5 mm |
Many-core
Initial effort & Polaris
Intel actual large effort research into the area of many-core started after the February 2004 Intel Developer Forum following Pradeep Dubey famous keynote titled "The Era of Tera." Around the 2004-2005 Intel formed a number of strategic research projects to explorer and study the feasibility and challenges of many-core and tera-scale processing. One of the earliest examples of such project was the Tera-scale Computing Research Program which was unveiled by Justin Rattner, then-CTO, at the spring 2006 Intel Develop Forum.
The first product to come directly from that project was Polaris, an 80-core chip designed using modular tiles that could scale in the x- and y- directions using a routing system that interconnected all the tiles in a mesh topology. Fabricated on a 65 nm process, the chip was around 275 mm² and incorporated around 100M transistors. The chip also attempted to solve some of the inherent problems dealing with a large amount of cores such as the bandwidth. 3D stacked SRAM was utilized to achieve bandwidths of over 1 Tb/s. Operating as high as 5.7 GHz, the chip could reach over 1.8 teraFLOPS of sustained performance.
Larrabee
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