This property describes a integrated circuit package type. Examples are:

• Flip-Chip Organic Land Grid Array (FC-OLGA)
• Organic Micro Ball Grid Array
• Ceramic Pin Grid Array (CPGA)

Only an abbreviation may be specified.

See also

• Property:socket
• Property:package
• Property:package type
• Property:package length
• Property:package width
• Property:package height
• Property:package contacts
• Property:package pitch

Pages using the property "package type"

Showing 25 pages using this property.

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Q
QorIQ P2020 - Freescale#package +	TE-PBGA-II  +
R
R-Car E1 - Renesas#package +	BGA  +
R-Car E2 - Renesas#package +	BGA  +
R-Car H1 - Renesas#package +	BGA  +
R-Car H2 - Renesas#package +	BGA  +
R-Car H3 (SiP) - Renesas#package +	BGA  +
R-Car H3 - Renesas#package +	BGA  +
R-Car L1 - Renesas#package +	BGA  +
R-Car M1A - Renesas#package +	BGA  +
R-Car M1S - Renesas#package +	BGA  +
R-Car M2 - Renesas#package +	BGA  +
R-Car M3 (SiP) - Renesas#package +	BGA  +
R-Car M3 - Renesas#package +	BGA  +
R-Car V2H - Renesas#package +	BGA  +
S
Scorpio Engine - Microsoft +	FC-OBGA  +
Skylake DE - Cores - Intel#package +	BGA  +
Skylake U - Cores - Intel#package +	BGA  +
Socket 563 - AMD +	FC-µOPGA  +
Socket 754 - AMD +	Organic Pin Grid Array  +
Socket 939 - AMD +	Organic Pin Grid Array  +
Socket AM1 - AMD +	Organic Micro Pin Grid Array  +
Socket AM2+ - AMD +	Organic Micro Pin Grid Array  +
Socket AM2 - AMD +	Organic Micro Pin Grid Array  +
Socket AM4 - AMD +	Organic Micro Pin Grid Array  +
Socket AM5 - Packages - AMD +	FC-OLGA  +