This property describes a integrated circuit package type. Examples are:

• Flip-Chip Organic Land Grid Array (FC-OLGA)
• Organic Micro Ball Grid Array
• Ceramic Pin Grid Array (CPGA)

Only an abbreviation may be specified.

See also

• Property:socket
• Property:package
• Property:package type
• Property:package length
• Property:package width
• Property:package height
• Property:package contacts
• Property:package pitch

Pages using the property "package type"

Showing 25 pages using this property.

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Package ASB2 - AMD +	Organic Micro Ball Grid Array  +
Package CBGA-360 - AMD +	Ceramic Ball Grid Array  +
Package FP2 - AMD +	Organic Micro Ball Grid Array  +
Package FP3 - AMD +	Organic Micro Ball Grid Array  +
Package FP4 - AMD +	Organic Micro Ball Grid Array  +
Package FP5 - AMD +	Organic Micro Ball Grid Array  +
Package FP6 - AMD +	FC-OBGA  +
Package FT1 - AMD +	FC-OBGA  +
Package FT3 - AMD +	Organic Micro Ball Grid Array  +
Package FT3b - AMD +	Organic Micro Ball Grid Array  +
Package FT4 - AMD +	Organic Micro Ball Grid Array  +
Package OBGA-349 - AMD +	Organic Ball Grid Array  +
Package SP1 - AMD +	Organic Micro Ball Grid Array  +
Package SP4 - AMD +	FC-OBGA  +
Package SP4r2 - AMD +	FC-OBGA  +
Pentium 4405U - Intel#package +	BGA  +
Pentium 907 - Intel#package +	BGA  +
Pentium 917 - Intel#package +	BGA  +
Pentium 927 - Intel#package +	BGA  +
Pentium 957 - Intel#package +	BGA  +
Pentium 967 - Intel#package +	BGA  +
Pentium 977 - Intel#package +	BGA  +
Pentium 987 - Intel#package +	BGA  +
Pentium 997 - Intel#package +	BGA  +
Pentium B940 - Intel#package +	PGA  +