Page title matches

• amd/packages/fp5
  5 KB (642 words) - 23:22, 25 March 2023
• amd/packages/fp6
  All FP6 packages carry a monolithic die which integrates eight CPU cores, two memory control
  20 KB (3,273 words) - 17:47, 10 May 2023
• amd/packages/socket f
  ...cket systems. Uniprocessor Opterons with a DDR2 interface were released in packages for {{\\|Socket AM2}} and {{\\|Socket AM2+|AM2+}} with a single HT link. So ...cessors support UDIMMs instead of RDIMMs. Socket Fr3 is incompatible with packages for other revisions.
  11 KB (1,717 words) - 17:25, 5 February 2021
• amd/packages/socket s1g1
  8 KB (1,126 words) - 18:53, 12 January 2021
• amd/packages/socket s1
  #REDIRECT [[amd/packages/socket s1g1]]
  38 bytes (6 words) - 18:55, 12 January 2021
• amd/packages/socket s1g2
  8 KB (1,211 words) - 19:08, 12 January 2021
• amd/packages/socket s1g3
  5 KB (767 words) - 19:14, 12 January 2021
• amd/packages/socket s1g4
  10 KB (1,781 words) - 19:23, 12 January 2021
• amd/packages/socket c32
  ...links. Uniprocessor Opterons with DDR3 memory controllers were released in packages for {{\\|Socket AM3}} and {{\\|Socket AM3+|AM3+}} which support two memory Socket C32 has the same dimensions as Socket F, however the LGA-1207 packages for these sockets are mechanically, due to keying notches in different posi
  7 KB (998 words) - 20:07, 7 February 2021
• amd/packages/socket g34
  ...generations. Uniprocessor Opterons with a DDR3 interface were released in packages for {{\\|Socket AM3}} and {{\\|Socket AM3+|AM3+}} which make a single HT li
  36 KB (7,214 words) - 15:50, 23 April 2022
• amd/packages/g34
  #REDIRECT [[amd/packages/socket g34]]
  37 bytes (5 words) - 20:50, 7 February 2021
• amd/packages/c32
  #REDIRECT [[amd/packages/socket c32]]
  37 bytes (5 words) - 20:50, 7 February 2021
• amd/packages/am3+
  #REDIRECT [[amd/packages/socket am3+]]
  38 bytes (5 words) - 20:51, 7 February 2021
• amd/packages/fr6
  #REDIRECT [[amd/packages/socket f]]
  35 bytes (5 words) - 21:07, 7 February 2021
• amd/packages/fr2
  #REDIRECT [[amd/packages/socket f]]
  35 bytes (5 words) - 21:07, 7 February 2021
• amd/packages/fr5
  #REDIRECT [[amd/packages/socket f]]
  35 bytes (5 words) - 21:08, 7 February 2021
• amd/packages/sp4
  |contemporary link=amd/packages/sp4r2 '''SP4''' and its contemporary '''{{amd|SP4r2|l=pack}}''' are microprocessor packages of [[AMD]] {{amd|epyc embedded#3000 Series (Zen)|EPYC 3000}} "{{amd|Snowy O
  7 KB (1,088 words) - 05:09, 24 March 2023
• amd/packages/sp4r2
  |contemporary link=amd/packages/sp4 '''SP4r2''' and its contemporary '''{{amd|SP4|l=pack}}''' are microprocessor packages of [[AMD]] {{amd|epyc embedded#3000 Series (Zen)|EPYC 3000}} "{{amd|Snowy O
  7 KB (1,011 words) - 05:09, 24 March 2023
• amd/packages/socket swrx8
  |predecessor link=amd/packages/socket tr4 |contemporary link=amd/packages/socket strx4
  11 KB (1,577 words) - 02:53, 13 March 2023
• amd/packages/socket strx4
  |predecessor link=amd/packages/socket tr4 |contemporary link=amd/packages/socket swrx8
  14 KB (2,188 words) - 11:45, 6 April 2024

Page text matches

• hitachi/6309
  ! Part !! [[clock generator|Clock]] !! OP Temp !! Packages !! Notes
  4 KB (514 words) - 00:54, 19 May 2016
• intel/pentium (2009)
  ...replaced with {{intel|Direct Media Interface}} 1.0. These processors use {{packages|Socket-G1}}. They all have the following features: ...were introduced in mid-[[2011]]. Mobile Pentium uses {{intel|FCBGA-1023}} packages and {{intel|rPGA988B}} for B models. Sandy Bridge incorporated the [[integr
  20 KB (2,661 words) - 00:45, 11 October 2017
• intel/celeron
  ...replaced with {{intel|Direct Media Interface}} 1.0. These processors use {{packages|Socket-G1}}. They all have the following features:
  25 KB (3,201 words) - 03:13, 22 September 2018
• intel/xeon d
  | type = System in packages
  13 KB (1,784 words) - 08:04, 6 April 2019
• 16 µm lithography process
  ...those years were the [[TO-5]] and [[TO-18]] (Transistor Outline) metal-can packages.
  502 bytes (66 words) - 23:04, 20 May 2018
• 20 µm lithography process
  ...5]] and [[TO-18]] (Transistor Outline) metal-can packages and dual in-line packages.
  902 bytes (119 words) - 23:04, 20 May 2018
• 50 µm lithography process
  ...those years were the [[TO-5]] and [[TO-18]] (Transistor Outline) metal-can packages.
  524 bytes (70 words) - 23:04, 20 May 2018
• intel/microarchitectures/sandy bridge (client)
  Sandy Bridge comes in three different [[C4]] packages: [[PGA]] for mobile computers, [[LGA]] for desktop systems and [[BGA]] for
  84 KB (13,075 words) - 00:54, 29 December 2020
• intel/microarchitectures/skylake (client)
  === Packages ===
  79 KB (11,922 words) - 06:46, 11 November 2022
• intel/microarchitectures/kaby lake
  === Packages ===
  38 KB (5,431 words) - 10:41, 8 April 2024
• intel/microarchitectures/ice lake (client)
  ** New Type3, Type4 packages The new Ice Lake packages include a thin-film magnetic inductor array on the landing side. Those are
  23 KB (3,613 words) - 12:31, 20 June 2021
• intel/core i7ee/i7-2920xm
  |package module 1={{packages/intel/pga-988b}}
  5 KB (710 words) - 16:24, 13 December 2017
• intel/core i7ee/i7-2960xm
  |package module 1={{packages/intel/pga-988b}}
  5 KB (710 words) - 03:49, 26 June 2018
• intel/core i7/i7-6650u
  |package module 1={{packages/intel/fcbga-1356}}
  4 KB (649 words) - 16:22, 13 December 2017
• intel/core i7/i7-6660u
  |package module 1={{packages/intel/fcbga-1356}}
  4 KB (649 words) - 16:22, 13 December 2017
• intel/core i7/i7-6600u
  |package module 1={{packages/intel/fcbga-1356}}
  4 KB (654 words) - 17:22, 26 March 2018
• intel/xeon e3/e3-1280 v5
  |package module 1={{packages/intel/lga-1151}}
  3 KB (485 words) - 00:29, 7 April 2018
• intel/xeon e3/e3-1275 v5
  |package module 1={{packages/intel/lga-1151}}
  4 KB (620 words) - 00:27, 7 April 2018
• intel/xeon e3/e3-1270 v5
  |package module 1={{packages/intel/lga-1151}}
  3 KB (490 words) - 00:29, 7 April 2018
• intel/xeon e3/e3-1260l v5
  |package module 1={{packages/intel/lga-1151}}
  3 KB (489 words) - 16:26, 13 December 2017

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