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(Members)
(Ryzen AI (Max) 300 Series)
 
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</table>
 
</table>
 
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{{comp table end}}
 +
 +
=== [[Ryzen Threadripper]] Series ===
 +
:;"Shimada Peak" (Zen 5) • Socket sTR5 (4 nm)
 +
 +
<pre>
 +
Model Name  Cores/Threads Base/Boost Clock Socket     Process  L3 Cache  TDP Released
 +
 +
Ryzen TR 9960X 24/48 4.2/5.3 GHz Socket sTR5 4 nm 128 MB 350 W Jul 2025
 +
Ryzen TR 9970X 32/64 4.0/5.4 GHz Socket sTR5 4 nm 128 MB 350 W Jul 2025
 +
Ryzen TR 9980X 64/128 3.2/5.4 GHz Socket sTR5 4 nm 256 MB 350 W Jul 2025
 +
Ryzen TR PRO 9945WX 12/24 4.7/5.4 GHz Socket sTR5 4 nm 64 MB 350 W Jul 2025
 +
Ryzen TR PRO 9955WX 16/32 4.5/5.4 GHz Socket sTR5 4 nm 64 MB 350 W Jul 2025
 +
Ryzen TR PRO 9965WX 24/48 4.2/5.4 GHz Socket sTR5 4 nm 128 MB 350 W Jul 2025
 +
Ryzen TR PRO 9975WX 32/64 4.0/5.4 GHz Socket sTR5 4 nm 128 MB 350 W Jul 2025
 +
Ryzen TR PRO 9985WX 64/128 3.2/5.4 GHz Socket sTR5 4 nm 256 MB 350 W Jul 2025
 +
Ryzen TR PRO 9995WX 96/192 2.5/5.4 GHz Socket sTR5 4 nm 384 MB 350 W Jul 2025
 +
</pre>
  
 
=== [[Ryzen]] 9000 Series ===
 
=== [[Ryzen]] 9000 Series ===
:;"Granite Ridge" (Desktop)
+
:;"Granite Ridge" (Desktop) • Memory DDR5-5600, Socket AM5 (4 nm)
 +
 
 +
<pre>
 +
Model Name  Cores/Threads Base/Boost Clock Cache (L3/L2)  Graphics (int.) TDP Released
 +
 
 +
Ryzen 9 9950X3D2 16/32 4.3/5.6 GHz 192/16 MB 2x RDNA 2 CUs 200 W
 +
Ryzen 9 9950X3D 16/32 4.3/5.7 GHz 128/16 MB 2x RDNA 2 CUs 170 W Jan 2025
 +
Ryzen 9 9950X 16/32 4.3/5.7 GHz 64/16 MB 2x RDNA 2 CUs 170 W Aug 2024
 +
Ryzen 9 PRO 9945 12/24 3.4/TBD GHz 64/12 MB 2x RDNA 2 CUs 65 W
 +
Ryzen 9 9900X3D 12/24 4.4/5.5 GHz 128/12 MB 2x RDNA 2 CUs 120 W Jan 2025
 +
Ryzen 9 9900X 12/24 4.4/5.6 GHz 64/12 MB 2x RDNA 2 CUs 120 W Aug 2024
 +
Ryzen 7 9850X3D 8/16 4.7/5.6 GHz 96/8 MB 2x RDNA 2 CUs 120 W
 +
Ryzen 7 9800X3D 8/16 4.7/5.2 GHz 96/8 MB 2x RDNA 2 CUs 120 W Nov 2024
 +
Ryzen 7 PRO 9745 8/16 3.8/TBD GHz 32/8 MB 2x RDNA 2 CUs 65 W
 +
Ryzen 7 9700X 8/16 3.8/5.5 GHz 32/8 MB 2x RDNA 2 CUs  65/105W Aug 2024
 +
Ryzen 7 9700F 8/16 3.8/5.5 GHz 32/8 MB N/A 65 W Sep 2025
 +
Ryzen 5 PRO 9645 6/12 3.9/TBD GHz 32/6 MB 2x RDNA 2 CUs 65 W
 +
Ryzen 5 9600X3D 6/12 3.9/TBD GHz 96/6 MB 2x RDNA 2 CUs 65 W
 +
Ryzen 5 9600X 6/12 3.9/5.4 GHz 32/6 MB 2x RDNA 2 CUs  65/105W Aug 2024
 +
Ryzen 5 9600 6/12 3.8/5.2 GHz 32/6 MB 2x RDNA 2 CUs 65 W
 +
Ryzen 5 9500F 6/12 3.8/5.0 GHz 32/6 MB N/A 65 W Sep 2025
 +
</pre>
 +
 
 +
:;"Fire Range" (Desktop & Mobile) • Socket FL1 (4 nm)
 +
 
 +
<pre>
 +
Model Name  Cores/Threads Base/Boost Clock  Socket    Process  L3 Cache TDP Released
 +
 
 +
Ryzen 9 9850HX 12/24 3.0/5.2 GHz Socket FL1 4 nm 64 MB 55 W Jan 2025
 +
Ryzen 9 9955HX 16/32 2.5/5.4 GHz Socket FL1 4 nm 64 MB 55 W Jan 2025
 +
Ryzen 9 9955HX3D 16/32 2.5/5.4 GHz Socket FL1 4 nm 128 MB 55 W Jan 2025
 +
</pre>
 +
 
 +
=== [[Ryzen]] AI (Max) 300 Series ===
 +
 
 +
:;"Krackan Point" (HPU Mobile) • Socket FP8 (4 nm)
 +
 
 +
<pre>
 +
Model Name  Cores/Threads Base/Boost Clock   Socket    Process  L3 Cache TDP Released
 +
 
 +
Ryzen AI 5 330 (KP2) 4/8 2.0/4.5 GHz Socket FP8 4 nm 4 MB 28 W Jul 2025
 +
Ryzen AI 5 340 6/12 2.0/4.8 GHz Socket FP8 4 nm 8 MB 28 W Jan 2025
 +
Ryzen AI 5 PRO 340 6/12 2.0/4.8 GHz Socket FP8 4 nm 8 MB 28 W Jan 2025
 +
Ryzen AI 7 350 8/16 2.0/5.0 GHz Socket FP8 4 nm 8 MB 28 W Jan 2025
 +
Ryzen AI 7 PRO 350 8/16 2.0/5.0 GHz Socket FP8 4 nm 8 MB 28 W Jan 2025
 +
</pre>
 +
 
 +
:;"Strix Point" (Mobile w/ GPU & APU) • Socket FP8 (4 nm)
 +
 
 +
<pre>
 +
Model Name  Cores/Threads Base/Boost Clock   Socket    Process  L3 Cache TDP Released
 +
 
 +
Ryzen AI 7 PRO 360 8/16 2.0/5.0 GHz Socket FP8 4 nm 8 MB 28 W Jan 2025
 +
Ryzen AI 9 365 10/20 2.0/5.0 GHz Socket FP8 4 nm 16 MB 28 W Jul 2024
 +
Ryzen AI 9 HX 370 12/24 2.0/5.1 GHz Socket FP8 4 nm 16 MB 28 W Jul 2024
 +
Ryzen AI 9 HX 375 12/24 2.0/5.1 GHz Socket FP8 4 nm 16 MB 28 W Jul 2024
 +
Ryzen AI 9 HX PRO 370 12/24 2.0/5.1 GHz Socket FP8 4 nm 16 MB 28 W Jan 2025
 +
Ryzen AI 9 HX PRO 375 12/24 2.0/5.1 GHz Socket FP8 4 nm 16 MB 28 W Jan 2025
 +
</pre>
 +
 
 +
:;"Strix Halo" (HPU Notebook) • Socket FP11 (4 nm)
 +
 
 +
<pre>
 +
Model Name  Cores/Threads Base/Boost Clock   Socket    Process  L3 Cache TDP Released
 +
 
 +
Ryzen AI Max 385 8/16 3.6/5.0 GHz Socket FP11 4 nm 32 MB 55 W Jan 2025
 +
Ryzen AI Max 390 12/24 3.2/5.0 GHz Socket FP11 4 nm 64 MB 55 W Jan 2025
 +
Ryzen AI Max+ 395 16/32 3.0/5.1 GHz Socket FP11 4 nm 64 MB 55 W Jan 2025
 +
Ryzen AI Max PRO 380 6/12 3.6/4.9 GHz Socket FP11 4 nm 16 MB 55 W Jan 2025
 +
Ryzen AI Max PRO 385 8/16 3.6/5.0 GHz Socket FP11 4 nm 32 MB 55 W Jan 2025
 +
Ryzen AI Max PRO 390 12/24 3.2/5.0 GHz Socket FP11 4 nm 64 MB 55 W Jan 2025
 +
Ryzen AI Max+ PRO 395 16/32 3.0/5.1 GHz Socket FP11 4 nm 64 MB 55 W Jan 2025
 +
</pre>
 +
 
 +
=== [[Ryzen]] AI 400 Series ===
 +
:;"Gorgon Point" (APU)
 +
 
 +
<pre>
 +
Model Name  Cores/Threads Boost Clock Cache NPU GPU   Lanes  TDP
 +
 
 +
Ryzen AI 9 HX 470 12/24 5.25 GHz+ 36 MB 16 CU RDNA 3.5 16 PCIe Gen4 15-45W
 +
Ryzen AI 9 465 10/20 5.00 GHz 34 MB 12 CU RDNA 3.5 16 PCIe Gen4 15-45W
 +
Ryzen AI 7 460 8/16 5.20 GHz+ 24 MB 8 CU RDNA 3.5 16 PCIe Gen4 15-45W
 +
Ryzen AI 7 450 8/16 5.15 GHz+ 24 MB 8 CU RDNA 3.5 16 PCIe Gen4 15-45W
 +
Ryzen AI 7 445 6/12 TBD TBD 4 CU RDNA 3.5 16 PCIe Gen4 15-45W
 +
Ryzen AI 5 440 6/12 4.80 GHz 22 MB 4 CU RDNA 3.5 16 PCIe Gen4 15-45W
 +
Ryzen AI 5 435 6/12 4.70 GHz 14 MB 4 CU RDNA 3.5 14 PCIe Gen4 15-45W
 +
Ryzen AI 5 430 4/8 TBD 12 MB 4 CU RDNA 3.5 14 PCIe Gen4 15-45W
 +
Ryzen AI 3 420 4/8 4.60 GHz 12 MB 2 CU RDNA 3.5 14 PCIe Gen4 15-45W
 +
</pre>
 +
 
 +
=== [[EPYC Embedded]] 4005 Series ===
 +
:;"Grado" EPYC Embedded (Zen 5)
 +
 
 +
<pre>
 +
Model Name  Cores/Threads Base/Max Freq. L3 Cache TDP
 +
 
 +
EPYC Embedded 4585PX 16/32 4.3/5.7 GHz 128 MB 170W
 +
EPYC Embedded 4565P 16/32 4.3/5.7 GHz 64 MB 170W
 +
EPYC Embedded 4545P 16/32 3.0/5.4 GHz 64 MB 65W
 +
EPYC Embedded 4465P 12/24 3.4/5.4 GHz 64 MB 65W
 +
EPYC Embedded 4345P 8/16 3.8/5.5 GHz 32 MB 65W
 +
EPYC Embedded 4245P 6/12 3.9/5.4 GHz 32 MB 65W
 +
</pre>
 +
 
 +
=== [[EPYC Embedded]] 2005 Series ===
 +
:;EPYC Embedded (Zen 5)
  
 
<pre>
 
<pre>
Model Name  Cores/Threads Base/Boost Clock Cache (L3/L2) Graphics (int.) Memory Support TDP
+
Model Name  Cores/Threads Base/Max Freq. L3 Cache TDP
  
Ryzen 9 9950X3D2 16/32 4.3/5.6 GHz 192/16 MB 2x RDNA 2 CUs DDR5-5600 200W
+
EPYC Embedded 2875 16/32 3.0/4.5 GHz 64 MB 75 W
Ryzen 9 9950X3D 16/32 4.3/5.7 GHz 128/16 MB 2x RDNA 2 CUs DDR5-5600 170W
+
EPYC Embedded 2655 12/24 2.7/4.5 GHz 64 MB 55 W
Ryzen 9 9950X 16/32 4.3/5.7 GHz 64/16 MB 2x RDNA 2 CUs DDR5-5600 170W
+
EPYC Embedded 2435 8/16 2.8/4.5 GHz 32 MB 45 W
Ryzen 9 PRO 9945 12/24 3.4/TBD GHz 64/12 MB 2x RDNA 2 CUs DDR5-5600 65W
 
Ryzen 9 9900X3D 12/24 4.4/5.5 GHz 128/12 MB 2x RDNA 2 CUs DDR5-5600 120W
 
Ryzen 9 9900X 12/24 4.4/5.6 GHz 64/12 MB 2x RDNA 2 CUs DDR5-5600 120W
 
Ryzen 7 9850X3D 8/16 4.7/5.6 GHz 96/8 MB 2x RDNA 2 CUs DDR5-5600 120W
 
Ryzen 7 9800X3D 8/16 4.7/5.2 GHz 96/8 MB 2x RDNA 2 CUs DDR5-5600 120W
 
Ryzen 7 PRO 9745 8/16 3.8/TBD GHz 32/8 MB 2x RDNA 2 CUs DDR5-5600 65W
 
Ryzen 7 9700X 8/16 3.8/5.5 GHz 32/8 MB 2x RDNA 2 CUs DDR5-5600 65W/105W
 
Ryzen 7 9700F 8/16 3.8/5.5 GHz 32/8 MB N/A DDR5-5600 65W
 
Ryzen 5 PRO 9645 6/12 3.9/TBD GHz 32/6 MB 2x RDNA 2 CUs DDR5-5600 65W
 
Ryzen 5 9600X3D 6/12 3.9/TBD GHz 96/6 MB 2x RDNA 2 CUs DDR5-5600 65W
 
Ryzen 5 9600X 6/12 3.9/5.4 GHz 32/6 MB 2x RDNA 2 CUs DDR5-5600 65W/105W
 
Ryzen 5 9600 6/12 3.8/5.2 GHz 32/6 MB 2x RDNA 2 CUs DDR5-5600 65W
 
 
</pre>
 
</pre>
  

Latest revision as of 10:50, 26 December 2025

Edit Values
Zen 5 µarch
General Info
Arch TypeCPU
DesignerAMD
ManufacturerTSMC
Introduction2024
Process4 nm, 3 nm
Core Configs192, 160, 144, 128, 96, 64, 48, 32, 24, 20, 16, 12, 10, 8, 6
PE Configs384, 320, 288, 256, 192, 128, 96, 64, 48, 40, 32, 24, 20, 16, 12
Pipeline
TypeSuperscalar
OoOEYes
SpeculativeYes
Reg RenamingYes
Instructions
ISAAMD64, x86-64
ExtensionsAMX, AVX, AVX2, AVX-512
Cores
Core NamesTurin,
Shimada Peak,
Granite Ridge,
Fire Range,
Strix Point
Succession

Zen 5 is a microarchitecture Already released and sold being by AMD as a successor to Zen 4

History[edit]

Zen 5 was first mentioned by lead architect Michael Clark during a discussion on April 9th, 2018 [1]

Codenames[edit]

Product Codenames:

Core Model C/T Target
Turin EPYC 9005 Up to 128/256 High-end EPYC 5th Gen series server multiprocessors
Turin Dense EPYC 9005 Up to 192/384 High-performance EPYC server processors
Shimada Peak Ryzen 9000 Up to 32/64 ? Threadripper Workstation & enthusiasts market processors
Granite Ridge Ryzen 9000 Up to 16/32 Mainstream to high-end desktops & PC market processors
(Gaming Desktop CPU)
Fire Range Ryzen 9000 Up to 16/32 Mainstream desktop & mobile processors
Strix Point Ryzen AI 300 Up to 12/24 Mainstream mobile processors with GPU
(Gaming APU with RDNA3 or RDNA4)
Strix Halo Ryzen AI 300 Up to 16/32 High-performance ultrathin notebook processors
Krackan Point Ryzen AI 300 Up to ?/? High-performance ultrathin mobile processors
Sonoma Valley Ryzen APU Family Up to ?/? AMD Low-end Ryzen APU Family, Samsung 4 nm (TSMC)
(Zen 5c Quad-core CPU, RDNA3 2CU GPU, TDP 35W)

The Zen 5 microarchitecture powers Ryzen 9000 series desktop processors (codenamed "Granite Ridge"), Epyc 9005 server

processors (codenamed "Turin"), and Ryzen AI 300 thin and light mobile processors (codenamed "Strix Point").

Architectural Codenames:

Arch Codename
Core Nirvana
CCD Eldora

Comparison[edit]

Core Zen Zen+ Zen 2 Zen 3 Zen 3+ Zen 4 Zen 4c Zen 5 Zen 5c Zen 6 Zen 6c
Codename Core Valhalla Cerberus Persephone Dionysus Nirvana Prometheus Morpheus Monarch
CCD Aspen
Highlands
Brecken
Ridge
Durango Vindhya Eldora
Cores
(threads)
CCD 8 (16) 8 (16) 8 (16) 16 (32) 8 (16) 16 (32)
CCX 4 (8) 8 (16) 8 (16) 8 (16) 8 (16)
L3 cache CCD 32 MB 32 MB 32 MB 32 MB 32 MB 32 MB
CCX 16 MB 32 MB 32 MB 16 MB 32 MB
Die size CCD area 44 mm2 74 mm2 80.7 mm2 66.3 mm2 72.7 mm2 70.6 mm2
Core area
(Fab node)
7 mm2
(14 nm)
(12 nm) 2.83 mm2
(7 nm)
3.24 mm2
(7 nm)
(7 nm) 3.84 mm2
(5 nm)
2.48 mm2
(5 nm)
(4 nm) (3 nm) (2 nm) (2 nm)

Process Technology[edit]

Zen 5 is to be produced on a 4 nm process, Zen 5c is to be produced on a 3 nm process.

Architecture[edit]

AMD Zen 5 released in July 2024. The seventh microarchitecture in the Zen microarchitecture series.

Codenamed Granite Ridge, Strix Point, and Turin, it is slated for TSMC 4 nm or 3 nm manufacturing.
  • LITTLE design
- Improved 16% IPC and clock speed
- possibly more L3 cache per chiplet

Key changes from Zen 4[edit]

Core level (vs. Zen 4 microarchitectures)
  • Instruction set
AVX-512 VP2INTERSECT support
AVX-VNNI support
  • Front end
• Branch prediction improvements
- L1 BTB size increased significantly from 1.5K → 16K (10.7x)
- L2 BTB size increases from 7K → 8K
- Increased size of TAGE
- Introduction of 2-ahead predictor structure
- Return stack size increased from 32 → 52 entries (+62.5%)
• Improved instruction cache latency and bandwidth
- Instruction fetch bandwidth increased from 32B → 64B per cycle
- L2 instruction TLB size increased from 512 → 2048 entries (4x)
• Introducing a dual decode pipeline
- Decoder throughput scaled from 4 to 8 (2x4) per cycle (4 per thread, 4 in single thread)
- Op cache throughput expanded from 9 → 12 (2x6) per cycle (6 per thread, 6 for single thread)
- Unlike Intel E-Core, where a single thread can utilize multiple clusters, one cluster is used per SMT thread.
  • Back end
• Dispatch width of integer operations expanded from 6 → 8
• The size of ROB (reorder buffer) has been expanded from 320 to 448 entries (+40%)
• Integer register file capacity expanded from 192 → 240 entries (+25%)
• Floating point register file capacity expanded from 192 to 384 entries (2x)
• Flag register file capacity expanded to 192 entries
• Increased size of integer scheduler
- Scheduler size expanded from 4x24 (=96) → 88+56 (=144) entries (+50%)
- Adoption of integrated scheduler configuration similar to Intel P-Core
• Increased size of floating point scheduler
- The size of the pre-scheduler queue has been expanded from 64 to 96 entries (+50%).
- Scheduler size expanded from 2x32 (=64) → 3x38 (=114) entries (+78%)
• Number of ALUs increased from 4 → 6 (+50%)
• Number of multiplication units increases from 1 → 3 (3x)
• Number of branch units increased from 2 → 3 (+50%)
• Number of AGU increased from 3 → 4 (+33%)
- Number of loads that can be processed per cycle increased from 3 → 4 (same as 2 for 128 bits or more)
- Number of 128/256 bit stores that can be processed per cycle increased from 1 → 2
Desktop and server products such as Granite Ridge can process AVX-512 SIMD in one cycle.
However, mobile products process 256 bits in two cycles like the previous Zen 4.
  • Memory subsystem
• Load/Store Queue
- Increased size
• Prefetcher
- Added 2D stride prefetcher
- Improved stream & region prefetcher
• L1 data cache
- Capacity increased from 32 KB → 48 KB
- Associativity increases from 8-way → 12-way
- Bandwidth doubled
• L2 data cache
- Associativity increases from 8-way → 16-way
- Bandwidth increases from 32B → 64B per cycle
• L3 data cache
- Slight improvement in latency
- Maximum number of in-flight misses increased to 320
  • Physical design
Improved power gating technology
  • The overall expansion of the architecture has improved performance per clock
by an average of 16% compared to the previous generation.

Members[edit]

EPYC 9005 Series[edit]

"Turin/Turin Dense" (Server)

The fifth generation of EPYC processors was launched on October 10, 2024, at AMD's Advancing AI event, with general availability beginning in November 2024. Based on the Zen 5 microarchitecture, the 9005 series, codenamed "Turin", is manufactured by TSMC using a 4 nm process for standard Zen 5 cores and a 3 nm process for Zen 5c cores.

It utilizes the Socket SP5 socket, maintaining compatibility with the previous generation. The series offers core counts ranging from 8 cores to 192 cores, with support for up to 12 channels of DDR5-6000 memory (up to 6 TiB per socket) and 128 PCIe 5.0 lanes, enhancing performance and efficiency for high-performance computing, cloud, and AI workloads.

The series includes standard Zen 5 models, high-frequency "F" SKUs, single-socket "P" SKUs, and dense Zen 5c models, with TDPs ranging from 155 W to 500 W.

 List of Zen 5-based EPYC Processors
 Main SpecsFrequency
ModelPriceLaunchedCoresThreadsL2$L3$TDPMemoryBase FreqMax Boost
 Uniprocessors
EPYC 9015P$ 527November 20248168 MiB32 MiB155 WDDR5-60003.8 GHz4.1 GHz
EPYC 9125P$ 1,121November 2024163216 MiB64 MiB200 WDDR5-60004.0 GHz4.3 GHz
EPYC 9355P$ 4,771November 2024326432 MiB256 MiB300 WDDR5-60003.65 GHz4.05 GHz
EPYC 9755P$ 12,984November 2024128256128 MiB256 MiB400 WDDR5-60002.7 GHz4.1 GHz
 Multiprocessors (dual-socket)
EPYC 9015$ 527November 20248168 MiB32 MiB155 WDDR5-60003.8 GHz4.1 GHz
EPYC 9115$ 744November 2024122412 MiB32 MiB155 WDDR5-60003.6 GHz4.0 GHz
EPYC 9125$ 1,121November 2024163216 MiB64 MiB200 WDDR5-60004.0 GHz4.3 GHz
EPYC 9175F$ 2,624November 2024163216 MiB512 MiB320 WDDR5-60004.2 GHz5.0 GHz
EPYC 9215$ 1,518November 2024204020 MiB64 MiB200 WDDR5-60003.7 GHz4.1 GHz
EPYC 9255$ 2,238November 2024244824 MiB96 MiB240 WDDR5-60003.65 GHz4.05 GHz
EPYC 9275F$ 3,224November 2024244824 MiB96 MiB300 WDDR5-60004.1 GHz4.8 GHz
EPYC 9335$ 2,991November 2024326432 MiB128 MiB240 WDDR5-60003.35 GHz3.9 GHz
EPYC 9355$ 4,771November 2024326432 MiB256 MiB300 WDDR5-60003.65 GHz4.05 GHz
EPYC 9375F$ 5,198November 2024326432 MiB256 MiB320 WDDR5-60004.0 GHz4.8 GHz
EPYC 9455$ 5,987November 2024489648 MiB256 MiB300 WDDR5-60003.25 GHz3.85 GHz
EPYC 9535$ 6,876November 20246412864 MiB256 MiB300 WDDR5-60002.9 GHz3.75 GHz
EPYC 9555$ 9,251November 20246412864 MiB256 MiB360 WDDR5-60003.2 GHz4.0 GHz
EPYC 9575F$ 10,166November 20246412864 MiB256 MiB400 WDDR5-60003.5 GHz5.0 GHz
EPYC 9655$ 10,592November 20249619296 MiB256 MiB400 WDDR5-60002.7 GHz4.1 GHz
EPYC 9745$ 11,494November 2024128256128 MiB256 MiB400 WDDR5-60002.4 GHz3.8 GHz
EPYC 9755$ 12,984November 2024128256128 MiB256 MiB400 WDDR5-60002.7 GHz4.1 GHz
EPYC 9565$ 12,593November 20249619296 MiB384 MiB400 WDDR5-60002.8 GHz4.0 GHz
EPYC 9665$ 13,630November 20249619296 MiB384 MiB400 WDDR5-60003.0 GHz4.2 GHz
EPYC 9755F$ 13,999November 2024128256128 MiB256 MiB500 WDDR5-60003.1 GHz4.4 GHz
EPYC 9825$ 13,999November 2024144288144 MiB384 MiB400 WDDR5-60002.6 GHz3.9 GHz
EPYC 9845$ 14,399November 2024160320160 MiB384 MiB400 WDDR5-60002.4 GHz3.7 GHz
EPYC 9965$ 14,813November 2024192384192 MiB384 MiB500 WDDR5-60002.25 GHz3.7 GHz
 Frequency-optimized SKUs
EPYC 9175F$ 2,624November 2024163216 MiB512 MiB320 WDDR5-60004.2 GHz5.0 GHz
EPYC 9275F$ 3,224November 2024244824 MiB96 MiB300 WDDR5-60004.1 GHz4.8 GHz
EPYC 9375F$ 5,198November 2024326432 MiB256 MiB320 WDDR5-60004.0 GHz4.8 GHz
EPYC 9575F$ 10,166November 20246412864 MiB256 MiB400 WDDR5-60003.5 GHz5.0 GHz
EPYC 9755F$ 13,999November 2024128256128 MiB256 MiB500 WDDR5-60003.1 GHz4.4 GHz
Count: 0
32 :

Ryzen Threadripper Series[edit]

"Shimada Peak" (Zen 5) • Socket sTR5 (4 nm)
Model Name  	Cores/Threads Base/Boost Clock	 Socket	     Process  L3 Cache   TDP	Released

Ryzen TR 9960X		24/48	4.2/5.3 GHz	Socket sTR5	4 nm	128 MB	350 W	Jul 2025
Ryzen TR 9970X		32/64	4.0/5.4 GHz	Socket sTR5	4 nm	128 MB	350 W	Jul 2025
Ryzen TR 9980X		64/128	3.2/5.4 GHz	Socket sTR5	4 nm	256 MB	350 W	Jul 2025
Ryzen TR PRO 9945WX	12/24	4.7/5.4 GHz	Socket sTR5	4 nm	 64 MB	350 W	Jul 2025
Ryzen TR PRO 9955WX	16/32	4.5/5.4 GHz	Socket sTR5	4 nm	 64 MB	350 W	Jul 2025
Ryzen TR PRO 9965WX	24/48	4.2/5.4 GHz	Socket sTR5	4 nm	128 MB	350 W	Jul 2025
Ryzen TR PRO 9975WX	32/64	4.0/5.4 GHz	Socket sTR5	4 nm	128 MB	350 W	Jul 2025
Ryzen TR PRO 9985WX	64/128	3.2/5.4 GHz	Socket sTR5	4 nm	256 MB	350 W	Jul 2025
Ryzen TR PRO 9995WX	96/192	2.5/5.4 GHz	Socket sTR5	4 nm	384 MB	350 W	Jul 2025

Ryzen 9000 Series[edit]

"Granite Ridge" (Desktop) • Memory DDR5-5600, Socket AM5 (4 nm)
Model Name  	Cores/Threads Base/Boost Clock Cache (L3/L2)  Graphics (int.)	 TDP	Released

Ryzen 9 9950X3D2	16/32	4.3/5.6 GHz	192/16 MB	2x RDNA 2 CUs	200 W
Ryzen 9 9950X3D		16/32	4.3/5.7 GHz	128/16 MB	2x RDNA 2 CUs	170 W	Jan 2025
Ryzen 9 9950X		16/32	4.3/5.7 GHz	 64/16 MB	2x RDNA 2 CUs	170 W	Aug 2024
Ryzen 9 PRO 9945	12/24	3.4/TBD GHz	 64/12 MB	2x RDNA 2 CUs	 65 W
Ryzen 9 9900X3D		12/24	4.4/5.5 GHz	128/12 MB	2x RDNA 2 CUs	120 W	Jan 2025
Ryzen 9 9900X		12/24	4.4/5.6 GHz	 64/12 MB	2x RDNA 2 CUs	120 W	Aug 2024
Ryzen 7 9850X3D		 8/16	4.7/5.6 GHz	 96/8 MB	2x RDNA 2 CUs	120 W
Ryzen 7 9800X3D		 8/16	4.7/5.2 GHz	 96/8 MB	2x RDNA 2 CUs	120 W	Nov 2024
Ryzen 7 PRO 9745	 8/16	3.8/TBD GHz	 32/8 MB	2x RDNA 2 CUs	 65 W
Ryzen 7 9700X		 8/16	3.8/5.5 GHz	 32/8 MB	2x RDNA 2 CUs  65/105W	Aug 2024
Ryzen 7 9700F		 8/16	3.8/5.5 GHz	 32/8 MB	N/A		 65 W	Sep 2025
Ryzen 5 PRO 9645	 6/12	3.9/TBD GHz	 32/6 MB	2x RDNA 2 CUs	 65 W
Ryzen 5 9600X3D		 6/12	3.9/TBD GHz	 96/6 MB	2x RDNA 2 CUs	 65 W
Ryzen 5 9600X		 6/12	3.9/5.4 GHz	 32/6 MB	2x RDNA 2 CUs  65/105W	Aug 2024
Ryzen 5 9600		 6/12	3.8/5.2 GHz	 32/6 MB	2x RDNA 2 CUs	 65 W
Ryzen 5 9500F		 6/12	3.8/5.0 GHz	 32/6 MB	N/A		 65 W	Sep 2025
"Fire Range" (Desktop & Mobile) • Socket FL1 (4 nm)
Model Name  	Cores/Threads Base/Boost Clock   Socket     Process  L3 Cache	 TDP	Released

Ryzen 9 9850HX		12/24	3.0/5.2 GHz	Socket FL1	4 nm	 64 MB	 55 W	Jan 2025
Ryzen 9 9955HX		16/32	2.5/5.4 GHz	Socket FL1	4 nm	 64 MB	 55 W	Jan 2025
Ryzen 9 9955HX3D	16/32	2.5/5.4 GHz	Socket FL1	4 nm	128 MB	 55 W	Jan 2025

Ryzen AI (Max) 300 Series[edit]

"Krackan Point" (HPU Mobile) • Socket FP8 (4 nm)
Model Name  	Cores/Threads Base/Boost Clock	  Socket     Process  L3 Cache	 TDP	Released

Ryzen AI 5 330 (KP2)	4/8	2.0/4.5 GHz	Socket FP8	4 nm	 4 MB	 28 W	Jul 2025
Ryzen AI 5 340		6/12	2.0/4.8 GHz	Socket FP8	4 nm	 8 MB	 28 W	Jan 2025
Ryzen AI 5 PRO 340	6/12	2.0/4.8 GHz	Socket FP8	4 nm	 8 MB	 28 W	Jan 2025
Ryzen AI 7 350		8/16	2.0/5.0 GHz	Socket FP8	4 nm	 8 MB	 28 W	Jan 2025
Ryzen AI 7 PRO 350	8/16	2.0/5.0 GHz	Socket FP8	4 nm	 8 MB	 28 W	Jan 2025
"Strix Point" (Mobile w/ GPU & APU) • Socket FP8 (4 nm)
Model Name  	Cores/Threads Base/Boost Clock	  Socket     Process  L3 Cache	 TDP	Released

Ryzen AI 7 PRO 360	 8/16	2.0/5.0 GHz	Socket FP8	4 nm	 8 MB	 28 W	Jan 2025
Ryzen AI 9 365		10/20	2.0/5.0 GHz	Socket FP8	4 nm	16 MB	 28 W	Jul 2024
Ryzen AI 9 HX 370	12/24	2.0/5.1 GHz	Socket FP8	4 nm	16 MB	 28 W	Jul 2024
Ryzen AI 9 HX 375	12/24	2.0/5.1 GHz	Socket FP8	4 nm	16 MB	 28 W	Jul 2024
Ryzen AI 9 HX PRO 370	12/24	2.0/5.1 GHz	Socket FP8	4 nm	16 MB	 28 W	Jan 2025
Ryzen AI 9 HX PRO 375	12/24	2.0/5.1 GHz	Socket FP8	4 nm	16 MB	 28 W	Jan 2025
"Strix Halo" (HPU Notebook) • Socket FP11 (4 nm)
Model Name  	Cores/Threads Base/Boost Clock	  Socket     Process  L3 Cache	 TDP	Released

Ryzen AI Max 385	 8/16	3.6/5.0 GHz	Socket FP11	4 nm	32 MB	 55 W	Jan 2025
Ryzen AI Max 390	12/24	3.2/5.0 GHz	Socket FP11	4 nm	64 MB	 55 W	Jan 2025
Ryzen AI Max+ 395	16/32	3.0/5.1 GHz	Socket FP11	4 nm	64 MB	 55 W	Jan 2025
Ryzen AI Max PRO 380	 6/12	3.6/4.9 GHz	Socket FP11	4 nm	16 MB	 55 W	Jan 2025
Ryzen AI Max PRO 385	 8/16	3.6/5.0 GHz	Socket FP11	4 nm	32 MB	 55 W	Jan 2025
Ryzen AI Max PRO 390	12/24	3.2/5.0 GHz	Socket FP11	4 nm	64 MB	 55 W	Jan 2025
Ryzen AI Max+ PRO 395	16/32	3.0/5.1 GHz	Socket FP11	4 nm	64 MB	 55 W	Jan 2025

Ryzen AI 400 Series[edit]

"Gorgon Point" (APU)
Model Name  	Cores/Threads	Boost Clock	Cache	NPU	GPU	   Lanes  	TDP

Ryzen AI 9 HX 470	12/24	5.25 GHz+	36 MB	16 CU RDNA 3.5	16 PCIe Gen4	15-45W
Ryzen AI 9 465		10/20	5.00 GHz	34 MB	12 CU RDNA 3.5	16 PCIe Gen4	15-45W
Ryzen AI 7 460		 8/16	5.20 GHz+	24 MB	 8 CU RDNA 3.5	16 PCIe Gen4	15-45W
Ryzen AI 7 450		 8/16	5.15 GHz+	24 MB	 8 CU RDNA 3.5	16 PCIe Gen4	15-45W
Ryzen AI 7 445		 6/12	TBD		TBD	 4 CU RDNA 3.5	16 PCIe Gen4	15-45W
Ryzen AI 5 440		 6/12	4.80 GHz	22 MB	 4 CU RDNA 3.5	16 PCIe Gen4	15-45W
Ryzen AI 5 435		 6/12	4.70 GHz	14 MB	 4 CU RDNA 3.5	14 PCIe Gen4	15-45W
Ryzen AI 5 430		 4/8	TBD		12 MB	 4 CU RDNA 3.5	14 PCIe Gen4	15-45W
Ryzen AI 3 420		 4/8	4.60 GHz	12 MB	 2 CU RDNA 3.5	14 PCIe Gen4	15-45W

EPYC Embedded 4005 Series[edit]

"Grado" EPYC Embedded (Zen 5)
Model Name  	Cores/Threads	Base/Max Freq.	L3 Cache	TDP

EPYC Embedded 4585PX	16/32	4.3/5.7 GHz	128 MB		170W
EPYC Embedded 4565P	16/32	4.3/5.7 GHz	64 MB		170W
EPYC Embedded 4545P	16/32	3.0/5.4 GHz	64 MB		65W
EPYC Embedded 4465P	12/24	3.4/5.4 GHz	64 MB		65W
EPYC Embedded 4345P	 8/16	3.8/5.5 GHz	32 MB		65W
EPYC Embedded 4245P	 6/12	3.9/5.4 GHz	32 MB		65W

EPYC Embedded 2005 Series[edit]

EPYC Embedded (Zen 5)
Model Name  	Cores/Threads	Base/Max Freq.	L3 Cache	TDP

EPYC Embedded 2875	16/32	3.0/4.5 GHz	64 MB		75 W
EPYC Embedded 2655	12/24	2.7/4.5 GHz	64 MB		55 W
EPYC Embedded 2435	 8/16	2.8/4.5 GHz	32 MB		45 W

Designers[edit]

  • David Suggs, chief architect

Bibliography[edit]

See also[edit]

AMDZenRyzenEPYC
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• Power
• Performance
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• Power
• Performance
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• Power
• Performance

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• Power
• Performance

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• Power
• Performance

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codenameZen 5 +
core count192 +, 160 +, 144 +, 128 +, 96 +, 64 +, 48 +, 32 +, 24 +, 20 +, 16 +, 12 +, 10 +, 8 + and 6 +
designerAMD +
first launched2024 +
full page nameamd/microarchitectures/zen 5 +
instance ofmicroarchitecture +
instruction set architectureAMD64 + and x86-64 +
manufacturerTSMC +
microarchitecture typeCPU +
nameZen 5 +
process4 nm (0.004 μm, 4.0e-6 mm) + and 3 nm (0.003 μm, 3.0e-6 mm) +
processing element count384 +, 320 +, 288 +, 256 +, 192 +, 128 +, 96 +, 64 +, 48 +, 40 +, 32 +, 24 +, 20 +, 16 + and 12 +