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Package FT1 - AMD
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FT1
General Info
DesignerAMD
IntroductionJanuary 4, 2011 (launched)
MarketMobile, Embedded
MicroarchitectureBobcat
TDP18 W
18,000 mW
0.0241 hp
0.018 kW
Package
NameFT1,
UOB413
TypeFC-OBGA
Contacts413
Dimension19.0 mm
1.9 cm
0.748 in
× 19.0 mm
1.9 cm
0.748 in
× 1.92 mm
0.0756 in
Pitch0.8 mm
0.0315 in

FT1 was a CPU package for low power AMD microprocessors with integrated graphics targeting the thin client, embedded, and tablet market, the successor to the ASB2 package. Its counterparts for the mainstream mobile and desktop markets are Socket FS1 and Socket FM1 respectively. FT1 was superseded by the FT3 package.

Package FT1 was used in AMD's "Brazos" platform for ultrathin notebooks. All processors in the FT1 package are members of AMD's x86 CPU Family 14h with CPU cores based on the Bobcat microarchitecture, and were manufactured on a TSMC 40 nm bulk CMOS process.

Features

  • Lidless ball grid array package, 19.0 mm × 19.0 mm × 1.92 mm
    • 413 contacts, 0.8 - 1.0 mm multi-pitch
    • Organic substrate, flip chip die attachment
  • 1 × 64 bit DDR3 SDRAM interface
    • Up to 667 MHz, PC3-10600 (DDR3-1333), 10.67 GB/s raw bandwidth
    • Up to 2 DIMMs
    • UDIMM, SODIMM, or soldered DRAMs
    • JEDEC 1.5V, 1.35V
    • No ECC support
  • PCIe Gen 1, 2 (5 GT/s) from one 5-port, 8-lane controller
    • Configurable x4 General Purpose Ports (4x1, 2x2, 1x2 + 2x1, 1x4)
    • x4 Unified Media Interface to FCH
  • Two independent display controllers
    • 2 × DisplayPort 1.1a, up to 2560 × 1600 at 60 Hz, 30 bpp
    • 1 × eDP up to 2048 × 1536, 24 bpp, with ext. components
    • 1 × LVDS up to 1440 × 900 or 1400 × 1050 at 60 Hz, 18 bpp
    • 1 × VGA up to 2560 × 1600, 400 MHz
    • 2 × SL DVI up to 1920 × 1200 at 60 Hz, 24 bpp, with ext. components
    • 1 × HDMI up to 1920 × 1080 at 60 Hz, 36 bpp, with ext. components

Chipsets

  • AMD FCH A50M "Hudson-M1"
  • AMD FCH A55E "Hudson-E1"

The chipset is attached with an x4 UMI link (A50M PCIe Gen 1 (2.5 GT/s), A55E Gen 2) and can provide the following additional interfaces:

  • 4 lanes PCIe Gen 1, 2 (5 GT/s) configurable x4/x2/x1
  • 32-bit, 33 MHz PCI, max. four slots (A55E only)
  • 6 × SATA Gen 1, 2, 3 (6 Gb/s)
  • 14 × USB 1.1, 2.0
  • 2 × USB 1.1
  • Gb Ethernet MAC (A55E only)
  • HDA, LPC, SPI, SMBus, GPIO

Processors using package FT1

  • AMD C-Series "Ontario" (9 W)
  • AMD E-Series "Zacate" (18 W)
  • AMD Embedded G-Series "eBrazos"
  • AMD Z-Series "Desna" (< 6 W)
  CPUGPU
ModelFamilyCoresL2$Frequ.BrandFrequ.TDPLaunchedOPN
T16REmbedded G-Series1512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
615 MHz
0.615 GHz
615,000 kHz
Radeon HD 6250276 MHz
0.276 GHz
276,000 KHz
4.5 W
4,500 mW
0.00603 hp
0.0045 kW
June 2012GET16RFWB12GVE
T24LEmbedded G-Series1512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
1,000 MHz
1 GHz
1,000,000 kHz
5 W
5,000 mW
0.00671 hp
0.005 kW
1 March 2011GET24LFQB12GVE
T30LEmbedded G-Series1512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
1,400 MHz
1.4 GHz
1,400,000 kHz
18 W
18,000 mW
0.0241 hp
0.018 kW
1 March 2011GET30LGBB12GVE
T40EEmbedded G-Series21,024 KiB
1 MiB
1,048,576 B
9.765625e-4 GiB
1,000 MHz
1 GHz
1,000,000 kHz
Radeon HD 6250280 MHz
0.28 GHz
280,000 KHz
6.4 W
6,400 mW
0.00858 hp
0.0064 kW
23 May 2011GET40EFSB22GVE
T40NEmbedded G-Series21,024 KiB
1 MiB
1,048,576 B
9.765625e-4 GiB
1,000 MHz
1 GHz
1,000,000 kHz
Radeon HD 6290280 MHz
0.28 GHz
280,000 KHz
18 W
18,000 mW
0.0241 hp
0.018 kW
19 January 2011GET40NFPB22GVE
T40REmbedded G-Series1512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
1,000 MHz
1 GHz
1,000,000 kHz
Radeon HD 6250280 MHz
0.28 GHz
280,000 KHz
5.5 W
5,500 mW
0.00738 hp
0.0055 kW
23 May 2011GET40RFSB12GVE
T44REmbedded G-Series1512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
1,200 MHz
1.2 GHz
1,200,000 kHz
Radeon HD 6250280 MHz
0.28 GHz
280,000 KHz
9 W
9,000 mW
0.0121 hp
0.009 kW
19 January 2011GET44RFPB12GVE
T48EEmbedded G-Series21,024 KiB
1 MiB
1,048,576 B
9.765625e-4 GiB
1,400 MHz
1.4 GHz
1,400,000 kHz
Radeon HD 6250280 MHz
0.28 GHz
280,000 KHz
18 W
18,000 mW
0.0241 hp
0.018 kW
2012GET48EGBB22GVE
T48LEmbedded G-Series21,024 KiB
1 MiB
1,048,576 B
9.765625e-4 GiB
1,400 MHz
1.4 GHz
1,400,000 kHz
18 W
18,000 mW
0.0241 hp
0.018 kW
1 March 2011GET48LGBB22GVE
T48NEmbedded G-Series21,024 KiB
1 MiB
1,048,576 B
9.765625e-4 GiB
1,400 MHz
1.4 GHz
1,400,000 kHz
Radeon HD 6310520 MHz
0.52 GHz
520,000 KHz
18 W
18,000 mW
0.0241 hp
0.018 kW
19 January 2011GET48NGBB22GVE
T52REmbedded G-Series1512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
1,500 MHz
1.5 GHz
1,500,000 kHz
Radeon HD 6310500 MHz
0.5 GHz
500,000 KHz
18 W
18,000 mW
0.0241 hp
0.018 kW
19 January 2011GET52RGBB12GVE
T56EEmbedded G-Series21,024 KiB
1 MiB
1,048,576 B
9.765625e-4 GiB
1,650 MHz
1.65 GHz
1,650,000 kHz
Radeon HD 6250275 MHz
0.275 GHz
275,000 KHz
18 W
18,000 mW
0.0241 hp
0.018 kW
2012GET56EGBB22GVE
T56NEmbedded G-Series21,024 KiB
1 MiB
1,048,576 B
9.765625e-4 GiB
1,650 MHz
1.65 GHz
1,650,000 kHz
Radeon HD 6320500 MHz
0.5 GHz
500,000 KHz
18 W
18,000 mW
0.0241 hp
0.018 kW
19 January 2011GET56NGBB22GVE
Count: 13

Package Diagram

BGA-413 diag.svg

All dimensions in millimeters.

BGA-413 pn.svg

FT1 package ball numbers.

Pin Map

BGA-413 pinmap.svg

FT1 pinout.

Pin Description

Signal Type Description
M_ADD[15:0] O-IO-S DRAM Column/Row Address
M_BANK[2:0] O-IO-S DRAM Bank Address
M_CAS_L O-IO-S DRAM Column Address Strobe
M_CKE[1:0] O-IO-S DRAM Clock Enable
M_CLK_H/L[3:0] O-IO-S DRAM Differential Clock
M_DATA[63:0] B-IO-S DRAM Data Bus
M_DM[7:0] O-IO-S DRAM Data Mask
M_DQS_H/L[7:0] B-IO-D DRAM Differential Data Strobe
M_EVENT_L I-IO-S DRAM Thermal Event
M_RAS_L O-IO-S DRAM Row Address Strobe
M_RESET_L O-IO-S DRAM Reset Pin for Suspend-to-RAM Power Management Mode
M_VREF VREF Memory Interface Voltage Reference
M_WE_L O-IO-S DRAM Write Enable
M0_CS_L[1:0], M1_CS_L[1:0] O-IO-S DRAM Chip Selects
M0_ODT[1:0], M1_ODT[1:0] O-IO-S DRAM Enable Pin for On Die Termination
M_ZVDDIO_MEM_S A DRAM Interface Drive-Strength Compensation Resistor to VDDIO
P_GPP_RXP/RXN[3:0] I-PCIe-D General Purpose External PCIe Receive Data Differential Pairs
P_GPP_TXP/TXN[3:0] O-PCIe-D General Purpose External PCIe Transmit Data Differential Pairs
P_UMI_RXP/RXN[3:0] I-PCIe-D Unified Media Interface Receive Data Differential Pairs
P_UMI_TXP/TXN[3:0] O-PCIe-D Unified Media Interface Transmit Data Differential Pairs
P_ZVDD_10 A PCIe Drive-Strength Compensation Resistor to P_VDD_10 Power Supply
P_ZVSS A PCIe Drive-Strength Compensation Resistor to VSS
LTDP0_TXP/TXN[3:0] O-PCIe-D LVDS/TMDS DisplayPort 0 Differential Transmitter
TDP1_TXP/TXN[3:0] O-PCIe-D TMDS DisplayPort 1 Differential Transmitter
LTDP0/TDP1_AUXP/AUXN B-IO33-D DisplayPort Auxiliary Channel
LTDP0/TDP1_HPD I-IO33-S DisplayPort Hot Plug Detect
DP_BLON O-IO33-S Display Panel Backlight Enable
DP_DIGON O-IO33-S Display Panel Power Enable
DP_VARY_BL O-IO33-S Display Backlight Brightness Control
DP_ZVSS A DP Drive-Strength Compensation Resistor to VSS
DAC_RED, DAC_REDB A Red for Video Monitor Output
DAC_GREEN, DAC_GREENB A Green for Video Monitor Output
DAC_BLUE, DAC_BLUEB A Blue for Video Monitor Output
DAC_HSYNC, DAC_VSYNC O-IO33-S Display Horizontal, Vertical Sync
DAC_SCL O-IO33-OD I2C Clock for Display (to video monitor)
DAC_SDA B-IO33-OD I2C Data for Display
DAC_ZVSS A DAC Drive-Strength Compensation Resistor to DAC Ground Pin
CLKIN_H/L I-IO18-D 100 MHz PLL Differential Reference Clock
DISP_CLKIN_H/L I-IO18-D 100 MHz Display Controller Reference Clock
DMAACTIVE_L I-IO18-S Indicated System DMA Activity
PWROK I-IO18-S Voltages and CLKIN have reached specified operation
RESET_L I-IO18-S Processor Reset
ALERT_L O-IO33-OD Programmable pin that can indicate different events, including a SB-TSI interrupt
PROCHOT_L B-IO33-OD Processor in HTC-active state
SIC I-IO33-S Sideband Interface (SB-TSI) Clock
SID B-IO33-OD Sideband Interface Data
THERMTRIP_L O-IO33-OD Thermal Sensor Trip Output
DBREQ_L I-IO18-S Debug Request
DBRDY O-IO18-S Debug Ready
TCK I-IO18-S JTAG Clock
TDI I-IO18-S JTAG Data Input
TDO O-IO18-S JTAG Data Output
TMS I-IO18-S JTAG Mode Select
TRST_L I-IO18-S JTAG Reset
TEST* Test signal
SVC O-IO18-S Serial VID Interface Clock
SVD B-IO18-OD Serial VID Interface Data
VDDCR_CPU S Core Power Supply
VDDCR_CPU_SENSE A VDDCR_CPU Voltage Monitor Pin
VDDCR_NB S Northbridge Power Supply
VDDCR_NB_SENSE A VDDCR_NB Voltage Monitor Pin
VDDIO_MEM_S S DRAM I/O Ring Power Supply
VDDIO_MEM_S_SENSE A VDDIO_MEM_S Voltage Monitor Pin
VDD_10 S 1.05 V Supply Pins
VDDPL_10 S 1.05 V Supply Pin for System PLL
VDD_18 S 1.8 V Supply Pins
VDD_18_DAC S 1.8 V Supply Pin for DAC
VDD_33 S 3.3 V Supply Pin
VSS S Ground
VSS_SENSE A VSS Voltage Monitor Pin
VSSBG_DAC S DAC Ground
RSVD Reserved

Pin Types

I/O-PCIe-D Input / Output, PCIe Voltage Domain, Differential
I/O/B-IO-D/S/OD Input / Output / Bidirectional, VDDIO_MEM_S, Differential / Single-Ended / Open Drain
I/O/B-IO18-D/S/OD Input / Output / Bidirectional, VDD_18, Differential / Single-Ended / Open Drain
I/O/B-IO33-D/S/OD Input / Output / Bidirectional, VDD_33, Differential / Single-Ended / Open Drain
A Analog
S Supply Voltage

Bibliography

See also

Retrieved from "https://en.wikichip.org/w/index.php?title=amd/packages/ft1&oldid=99921"
Facts about "Package FT1 - AMD"
RDF feed
designerAMD +
first launchedJanuary 4, 2011 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitectureBobcat +
nameFT1 +
packageFT1 + and UOB413 +
package contacts413 +
package height1.92 mm (0.0756 in) +
package length19 mm (1.9 cm, 0.748 in) +
package pitch0.8 mm (0.0315 in) +
package typeFC-OBGA +
package width19 mm (1.9 cm, 0.748 in) +
tdp18 W (18,000 mW, 0.0241 hp, 0.018 kW) +