From WikiChip
Property:package type
965
U
This property describes a integrated circuit package type. Examples are:
- Flip-Chip Organic Land Grid Array (FC-OLGA)
- Organic Micro Ball Grid Array
- Ceramic Pin Grid Array (CPGA)
Only an abbreviation may be specified.
See also[edit]
- Property:socket
- Property:package
- Property:package type
- Property:package length
- Property:package width
- Property:package height
- Property:package contacts
- Property:package pitch
Pages using the property "package type"
Showing 25 pages using this property.
Q | |
---|---|
QorIQ P1022 - Freescale#package + | TE-PBGA-II + |
QorIQ P1023 - Freescale#package + | TE-PBGA + |
QorIQ P1024 - Freescale#package + | TE-PBGA + |
QorIQ P1025 - Freescale#package + | TE-PBGA + |
QorIQ P2010 - Freescale#package + | TE-PBGA-II + |
QorIQ P2020 - Freescale#package + | TE-PBGA-II + |
R | |
R-Car E1 - Renesas#package + | BGA + |
R-Car E2 - Renesas#package + | BGA + |
R-Car H1 - Renesas#package + | BGA + |
R-Car H2 - Renesas#package + | BGA + |
R-Car H3 (SiP) - Renesas#package + | BGA + |
R-Car H3 - Renesas#package + | BGA + |
R-Car L1 - Renesas#package + | BGA + |
R-Car M1A - Renesas#package + | BGA + |
R-Car M1S - Renesas#package + | BGA + |
R-Car M2 - Renesas#package + | BGA + |
R-Car M3 (SiP) - Renesas#package + | BGA + |
R-Car M3 - Renesas#package + | BGA + |
R-Car V2H - Renesas#package + | BGA + |
S | |
Scorpio Engine - Microsoft + | FC-OBGA + |
Skylake DE - Cores - Intel#package + | BGA + |
Skylake U - Cores - Intel#package + | BGA + |
Socket 563 - AMD + | FC-µOPGA + |
Socket 754 - AMD + | Organic Pin Grid Array + |
Socket 939 - AMD + | Organic Pin Grid Array + |
Facts about "package type"
Has type "Has type" is a predefined property that describes the datatype of a property and is provided by Semantic MediaWiki. | Text + |