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  • | nMOS/pMOS || depletion-mode nMOS || nMOS/pMOS/CMOS ||
    1 KB (119 words) - 23:04, 20 May 2018
  • | HMOS-II || HMOS-E || P646 (CHMOS III) || NMOS III || || CMOS-2 ! colspan="3" | [[HP]] NMOS-III Design Rules
    3 KB (332 words) - 23:04, 20 May 2018
  • | nMOS || CMOS || CMOS || BiCMOS
    1 KB (166 words) - 23:04, 20 May 2018
  • | tech = nMOS ...designed by [[Toshiba]] during the late 1970s. The [[microprocessor]] uses nMOS technology and was primarily used in printers and displays.
    1 KB (119 words) - 14:45, 3 February 2016
  • ...d became the first truly widely used DRAM chip. Those chips used Si-gate [[nMOS]] transistors using a polysilicon word line and an aluminum metal bit line. | fab 1 xtor.tech = nMOS, pMOS
    5 KB (632 words) - 23:04, 20 May 2018
  • * pull-down network (PDN) - a set of [[NMOS]] transistors connected between GND and the output line
    1 KB (221 words) - 18:07, 26 November 2018
  • [[File:Nmos.svg|thumb|right|[[n-type semiconductor]].]] An '''nMOS transistor''' is built with a p-type body with two regions of n-type semico
    8 KB (1,362 words) - 23:38, 17 November 2015
  • ...to HIGH as it's connected to VDD but not GND. When the input is HIGH, the nMOS transistor is on and the pMOS transistor is off yielding an output that is ...e \( i_{DP} = i_{DN} = 0 \). When the input is LOW, pMOS is conducting and nMOS is off; the load capacitor is charged via the pMOS device.The power dissipa
    6 KB (983 words) - 04:50, 8 November 2015
  • | tech = nMOS
    2 KB (244 words) - 00:33, 19 May 2016
  • | tech = nMOS
    1 KB (140 words) - 05:28, 22 January 2016
  • | tech 2 = nMOS ...instructions with a 10 microsecond instruction cycle. The chips come in [[nMOS]], [[pMOS]], and [[CMOS]] versions.
    4 KB (462 words) - 19:14, 13 October 2019
  • | tech 2 = nMOS | {{matsushita|MN1542}} || 2048x8 ROM, 152x4 RAM, 28 I/O || NMOS ||
    3 KB (301 words) - 19:23, 13 October 2019
  • ...]], the 10800 series was designed for very high speed applications where [[nMOS]] components were insufficient.
    2 KB (179 words) - 00:03, 3 February 2016
  • .... A year later, National introduced the {{national|cops ii|COPS II}}, an [[nMOS]] (and later [[CMOS]]) versions of those chips.
    2 KB (274 words) - 18:29, 5 February 2016
  • | tech = nMOS ...national|cops i|COPS I}} in 1977. Components in the COPS II were made in [[nMOS]] and [[CMOS]] technology instead of [[pMOS]] as used in COPS I. The COPS I
    6 KB (685 words) - 22:49, 5 February 2016
  • | {{\|3222}} || Refresh Controller for 4K NMOS DRAMs
    3 KB (308 words) - 05:03, 18 February 2020
  • | tech = nMOS ...40/MB8840H series''' is a [[microprocessor family|family]] of {{arch|4}} [[nMOS]] [[microcontroller]]s developed by [[Fujitsu]] and introduced in 1977{{dat
    2 KB (263 words) - 14:57, 4 February 2016
  • * {{fujitsu|MB8840}}, a [[NMOS]] version
    2 KB (215 words) - 14:55, 4 February 2016
  • ...is architecturally identical to the {{fujitsu|MB8840|MB8840 family}} (An [[nMOS]] version). The {{fujitsu|MB88500}} series is a high-speed version of this * {{fujitsu|MB8840}}, a [[NMOS]] version
    2 KB (230 words) - 07:46, 28 February 2017
  • | tech = nMOS
    2 KB (280 words) - 00:57, 19 May 2016
  • ...fet|MOS]] [[transistor]]s - [[pmos transistor|pMOS]] and [[pMOS transistor|nMOS]]. CMOS is the dominant technology used for [[VLSI]] and [[ULSI]] circuit ...S]] and [[nMOS transistor|nMOS]]. To better understand this, consider an [[nMOS transistor]]. Because it can pull no higher than V<sub>DD</sub> - V<sub>t</
    7 KB (1,159 words) - 21:01, 8 February 2019
  • ...ors are cascaded with an [[NPN transistor]]. When the input is HIGH, the [[NMOS transitor]] is conducting becoming the base current for the Q<sub>2</sub> N
    2 KB (329 words) - 08:33, 16 January 2019
  • ...removing redundant sets of [[pMOS transistor|pMOS]] and [[nMOS transistor|nMOS]] pairs of [[transistor]]s.
    903 bytes (132 words) - 00:34, 8 December 2015
  • *** [[nmos logic|n-type metal–oxide–semiconductor logic]] (nMOS)
    1 KB (145 words) - 00:40, 26 December 2015
  • | tech 2 = nMOS ...OS logic|pMOS]] technology, TI later expended the family into [[nMOS logic|nMOS]] and [[CMOS]].
    6 KB (711 words) - 04:39, 26 April 2017
  • | tech = nMOS
    1 KB (121 words) - 22:16, 16 January 2016
  • | tech = nMOS ...1975. The chipset was manufactured by [[Western Digital]] in [[nMOS logic|nMOS]] technology under a $6.3M contract<ref>{{apa mag|month=February|day=26|yea
    2 KB (253 words) - 00:33, 19 May 2016
  • | tech = nMOS
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  • | tech = nMOS
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  • | tech = nMOS
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  • | tech = nMOS ...designed by [[Toshiba]] during the late 1970s. The [[microprocessor]] uses nMOS technology and was primarily used in very low-end controllers.
    1 KB (146 words) - 11:49, 23 May 2021
  • | tech = nMOS
    5 KB (683 words) - 23:46, 7 March 2018
  • | tech = nMOS
    2 KB (172 words) - 17:18, 12 December 2016
  • | tech = nMOS
    4 KB (406 words) - 16:10, 26 January 2019
  • ...[[Intel]]'s 2nd generation FinFET transistors. Intel uses TiN pMOS / TiAlN nMOS as work function metals. Intel makes use of 193 nm immersion lithography wi ...irst generation of FinFET-based transistors. Samsung uses TiN pMOS / TiAIC nMOS as work function metals. Samsung node has gone through a number of refineme
    17 KB (2,243 words) - 19:32, 25 May 2023
  • [[File:intel 14nm+ (nmos).png|400px]]
    38 KB (5,431 words) - 10:41, 8 April 2024
  • | NMOS I | nMOS
    710 bytes (91 words) - 06:15, 18 January 2022
  • ...ng density. Loveland went on on to create a third and final process, the ''NMOS III'' using a [[1.5 µm process]]. While they succeeded in doubling the den | fab 1 xtor.tech = nMOS
    2 KB (325 words) - 06:22, 20 July 2018
  • | nMOS || nMOS || nMOS
    1 KB (122 words) - 06:21, 20 July 2018
  • ** [[Allows value::nMOS]]
    466 bytes (57 words) - 19:57, 18 February 2020
  • | tech = nMOS
    9 KB (1,192 words) - 01:35, 29 May 2016
  • ...d. These chips were remade by AMD in [[static CMOS]] design (as opposed to nMOS), resulting in considerably lower power dissipation. This MPU was rated to
    3 KB (288 words) - 15:18, 13 December 2017
  • ...d. These chips were remade by AMD in [[static CMOS]] design (as opposed to nMOS), resulting in considerably lower power dissipation. This MPU was rated to
    3 KB (290 words) - 15:18, 13 December 2017
  • ...d. These chips were remade by AMD in [[static CMOS]] design (as opposed to nMOS), resulting in considerably lower power dissipation. This MPU was rated to
    3 KB (290 words) - 15:18, 13 December 2017
  • ...d. These chips were remade by AMD in [[static CMOS]] design (as opposed to nMOS), resulting in considerably lower power dissipation. This MPU was rated to
    3 KB (260 words) - 15:18, 13 December 2017
  • ...d. These chips were remade by AMD in [[static CMOS]] design (as opposed to nMOS), resulting in considerably lower power dissipation. This MPU was rated to
    3 KB (261 words) - 15:18, 13 December 2017
  • | technology = nMOS
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  • | tech = nMOS ...instance of::microprocessor]][[microprocessor family::Am186]][[technology::nMOS]]
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  • [[File:intel 14nm++ (nmos).png|400px]]
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  • | technology = <!-- technology (e.g. CMOS, pMOS, nMOS, etc..) -->
    4 KB (473 words) - 09:26, 3 December 2019
  • | technology = nMOS * [[nMOS]] transistors
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  • ...[PLA]]s. Layout was generated automatically using EDA tools using [[Psuedo nMOS]] logic in order to save on space, albeit at the slight expense of static p
    7 KB (1,035 words) - 06:24, 21 November 2023
  • ...ecouples the read port from the write port. A new read buffer comprising 2 nMOS transistors is added to the 6T cell.
    6 KB (920 words) - 03:14, 30 December 2019
  • Typically, the area between the end of the nMOS and pMOS devices is used as the gate contact hit location. In an effort to
    4 KB (600 words) - 00:24, 21 June 2022
  • ...gate region, thereby reducing the dead space region between the end of the nMOS and the end of the pMOS devices. Traditionally, the gate is extended from the nMOS/pMOS device outward over the inactive isolation region. The gate via is the
    3 KB (354 words) - 23:31, 19 June 2022