| small || Use small factor image size. | large || Use large factor image size.

...for the lower 128-bit half and the FP domain for the upper 128-bit half to form the entire 256-bit value. The re-using of existing datapaths results in a f ...ing for two of the cores to be "chopped off" along with their L3 slices to form a dual-core die. Additionally, the GPU can be optimized for a particular se

...ficient, the move resulted in unintentionally making the FIVR the limiting factor when it came to overclocking. [[File:skylake tdp-form factor range.png|right|500px]]

Perceptrons are the simplest form of machine learning and lend themselves to somewhat easier hardware impleme The retire queue and the integer and floating point rename units form the retire control unit (RCU) tracking instructions, registers, and depende

.... This server MPU is designed for advanced 2S environments (1U square form factor). Operating at 2.2 GHz with a {{intel|turbo boost}} frequency of 2.9 GHz fo

...er MPU is designed for frequency-optimized 2S environments (2U square form factor). Operating at 3.2 GHz with a {{intel|turbo boost}} frequency of 3.6 GHz fo

...er MPU is designed for frequency-optimized 2S environments (2U square form factor). Operating at 3.4 GHz with a {{intel|turbo boost}} frequency of 3.7 GHz fo

.... This server MPU is designed for standard 2S environments (1U square form factor). Operating at 2.4 GHz with a {{intel|turbo boost}} frequency of 3.4 GHz fo

...er MPU is designed for frequency-optimized 2S environments (2U square form factor). Operating at 3.5 GHz with a {{intel|turbo boost}} frequency of 3.7 GHz fo

.... This server MPU is designed for standard 2S environments (1U square form factor). Operating at 2.2 GHz with a {{intel|turbo boost}} frequency of 3.1 GHz fo

...This server MPU is designed for low-power 2S environments (1U square form factor). Operating at 1.8 GHz with a {{intel|turbo boost}} frequency of 2.9 GHz fo

...er MPU is designed for frequency-optimized 2S environments (1U square form factor). Operating at 2.6 GHz with a {{intel|turbo boost}} frequency of 3.2 GHz fo

.... This server MPU is designed for standard 2S environments (1U square form factor). Operating at 2.1 GHz with a {{intel|turbo boost}} frequency of 3 GHz for

...016. This server MPU is designed for basic 2S environments (1U square form factor). Operating at 1.7 GHz with a {{intel|turbo boost}} frequency of 3.2 GHz fo

...016. This server MPU is designed for basic 2S environments (1U square form factor). Operating at 1.7 GHz with no {{intel|turbo boost}} support, this MPU has

...This server MPU is designed for low-power 2S environments (1U square form factor). Operating at 2.2 GHz with a {{intel|turbo boost}} frequency of 3.2 GHz fo

In its simplest form, such as the case with [[single-core]] [[microprocessors]], a core is often * [[core factor]]

LSCs [[form factor]] are often dictated by things such as the substrate size and the collapsed

== Form factors == ...or. More recently, accelerator cards became available in a number of other form factors such as an [[M.2]] PCIe board, [[OCP Accelerator Module]], and [[ED

'''Kapoho Bay''' is a USB stick form factor that incorporates 1 or 2 Loihi chips. Announced on Dec 6, 2018, Kapoho Bay

Cambricon also sells the MLU100 in a PCIe [[accelerator card]] form factor. The x16 PCIe card comes in two versions with a 16 GiB and a 32 GiB of DDR4

...cket. There are three V100 GPUs per POWER9 socket. Those use the SXM2 form factor and come with 16 GiB of HBM2 memory for a total of 48 GiB of HBM2 and 2.7 T

...bandwidth, and thus high [[bytes per FLOP]], while moving a smaller [[form factor]], it was necessary to drop the large amount of DDR memory channels. Instea

...tecture from there. The inference chips use low-power PCIe, M.2, and ruler form factors designed for servers, workstations, and embedded applications. ...with 32 GiB of four [[HBM2]] stacks in a [[CoWoS]] package and come in two form factors: [[PCIe Gen 3]] and an [[OCP OAM]] [[accelerator card]].

...o existing Tesla models and is therefore largely the same in terms of form factor and I/O. The computer itself fits just behind the glove compartment of the ...both FSD chips simultaneously for processing. The two chips independently form a future plan for the car - a detailed plan of what the car should do next.

...new class of compute devices with high performance in a mobile phone form factor. To that end, Lakefield barrows requirements from both desktop/laptop and s

...ght PCIe-driven [[accelerator card]] form factor such as [[M.2]]. The form factor and power envelope is selected for its ease of integration into existing in Spring Hill comes in a PCIe [[accelerator card]] form factor.

...itecture. This chip ships in a number of products in a [[PCIe cards]] form factor. ...p ships in a number of products in both a [[PCIe card]] and an [[OCP OAM]] form factors. Habana also designed the HLS-1 system which incorporates eight HL-

...at up to 950 MHz. This chip comes in a PCIe 4.0 [[accelerator card]] form factor and incorporates 32 GiB of [[HBM2]] memory. This NPU exposes 16 {{nervana|S

...o 1.1 GHz. This chip comes in an [[OPC OAM|OAM]] [[accelerator card]] form factor and incorporates 32 GiB of [[HBM2]] memory. This NPU exposes 16 {{nervana|S

...itecture, the NNP-I 1300 comes in a PCIe Gen 3.0 [[accelerator card]] form factor with two NPU chips, each with all 24 {{intel|Spring Hill#Inference Compute

...at a TDP of 12 W. This chip comes in an [[M.2]] [[accelerator card]] form factor.

...System Considerations for Dual AMD Athlon™ MP Processors in Tower and 1U Form Factors]||2002-08-27|| ...s.amd.com/assets/pdf/amd_sff_whitepaper_final2.pdf White Paper: Small Form Factor Board Designs]||||R-Series Platform

...{{\\|Socket F}} for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package {{\\|ASB1}}. Sock

...{{\\|Socket F}} for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package {{\\|ASB1}}. Sock

...{\\|Socket G34}} for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package {{\\|ASB2}}. Sock

...{\\|Socket G34}} for the server and workstation market. For the small form factor desktop, mobile and embedded market AMD developed package {{\\|ASB2}}. Sock

integrated DDR2 memory controller targeting the small form factor desktop, mobile and embedded market.

integrated DDR3 memory controller targeting the small form factor desktop, mobile and embedded market.

* "White Paper: Small Form Factor Board Designs", AMD Publ. #54507, Rev. A

...ssors and {{\\|Socket F}} for servers and workstations. For the small form factor desktop, ultrathin mobile, and embedded market AMD developed package {{\\|A

...}, for servers {{\\|Socket C32}} and {{\\|Socket G34}}. For the small form factor desktop, ultrathin mobile and embedded market AMD developed package {{\\|AS

...}, for servers {{\\|Socket C32}} and {{\\|Socket G34}}. For the small form factor desktop, mobile and embedded market AMD developed package {{\\|ASB2}}. Sock

* 3-factor learning '''Oheo Gulch''' is a PCIe card form factor that incorporates a single socketed Loihi 2 chip.