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Hexagon - Microarchitectures - Qualcomm
| Edit Values | |
| Hexagon µarch | |
| General Info | |
| Arch Type | DSP |
| Designer | Qualcomm |
| Manufacturer | TSMC |
| Process | 65 nm, 45 nm, 28 nm, 14 nm, 10 nm |
| Pipeline | |
| Type | 4-way VLIW, 4-thread SMT |
| OoOE | No |
| Decode | 4-way |
| Instructions | |
| Extensions | HVX |
Hexagon is VLIW DSP architecture designed by Qualcomm. It is used in many Qualcomm's SoC as Audio, Sensor or Compute coprocessor, and in the many Qualcomm modems. Usually runs some kind of Real-time OS, optimized for low power and small chip area. Supports of simultaneous execution of several threads, with interleaved multithreading in V1-V4 and dynamic multithreading since V5.
Contents
Architecture[edit]
Versions of Hexagon Architecture:
- V1 - 65nm, October 2006
- V2 - 65nm, December 2007
- V3M - 45nm, June 2009
- V3C - 45nm, August 2009
- V3L - 45nm, November 2009
- V4M - 28nm, December 2010
- V4C - 28nm, December 2010
- V4L - 28nm, April 2011
- V5A - 28nm, December 2012
- V5H - 28nm, December 2012
- Hexagon 400
- Only Fixed Point
- Hexagon 500
- Floating Point
- Hexagon 600
- Hexagon Vector eXtensions (HVX) added
Overview[edit]
Block Diagram[edit]
Memory Hierarchy[edit]
- L1I Cache:
- L1D Cache:
- L2 Cache:
- L3 Cache:
- TLBs:
Versions[edit]
| DSP/NPU versions |
Process node, nm |
Introduction (release) |
Threads (TOPS) |
Per-thread clock, MHz |
Total core clock, MHz |
Products |
|---|---|---|---|---|---|---|
| QDSP6 V1 | 65 nm | 2006 | • | |||
| QDSP6 V2 | 65 nm | 2007 | 6 | 100 | 600 MHz | Snapdragon S1 • QSD8250 • QSD8650 • |
| QDSP6 V3 (1 Gen) | 45 nm | 2009 | 6 | 67 | 400 MHz | Snapdragon S3 • APQ8060 • |
| QDSP6 V3 (2 Gen) | 45 nm | 2009 | 4 | 100 | 400 MHz | Snapdragon S3 • MSM8260 • MSM8660 • |
| QDSP6 V4 (V4M, V4C, V4L) |
28 nm | 2010 | 3 | 167 | 500 MHz | Snapdragon S4 • Plus • Pro • Prime • Snapdragon 6 • 600 • |
| QDSP6 V5 (V5A, V5H) |
28 nm | 2013 | 3 | 200 or greater with DMT |
600 MHz | Snapdragon 4 • 410 • 412 • 800 • 801 • |
| 536 | 28 nm 12 nm |
2014 | Snapdragon 2 • 205 • 208 • 210 • 212 • Snapdragon 4 • 425 • 427 • 429 • 430 • 435 • 439 • | |||
| V50 (or QDSP6 V5.0) | 28 nm | 2014 | 700 MHz 800 MHz (805) |
Snapdragon • 415 • 610 • 615 • 616 • 805 • | ||
| 546 | 28 nm 14 nm |
2015 | Snapdragon 6 • 450 • 617 • 625 • 626 • 632 • | |||
| V56 (or QDSP6 V5.6) | 28 nm 20 nm |
2015 | 700 MHz 800 MHz (808/810) |
Snapdragon 6 • 650 • 652 • 653 • 808 • 810 • | ||
| 642 | 14 nm | 2017 | Snapdragon 6 • 630 • | |||
| 680 (or QDSP6 V6) | 14 nm | 2016 | 4 | 500 | 787 MHz (660) 2.0 GHz (820 & 821) |
Snapdragon 6 • 636 • 660 • Snapdragon 8 • 820 • 821 • |
| 682 | 10 nm | 2017 | Snapdragon 8 • 835 • | |||
| 683 | 11 nm | 2020 | Snapdragon 4 • 460 • 662 • | |||
| 685 | 11 nm 10 nm |
2018 | (3 TOPS) | Snapdragon • 670 • 675 • 678 • • 710 • 712 • 845 • 850 • | ||
| 686 | 6/8 nm 11 nm |
2019 | (3.3 TOPS) | Snapdragon 4 • 480 • 480+ • Snapdragon 6 • 665 • 680 • 685 • 695 • | ||
| 688 | 8 nm | 2019 | (3.6 TOPS) | Snapdragon 7 • 730 • 730G • 732G • | ||
| 690 | 7 nm | 2019 | (7 TOPS / 9 TOPS) |
Snapdragon 8 • 855 • 855+ • 860 • • 8c • 8cx • 8cx (Gen 2) • • Microsoft SQ1 • SQ2 • | ||
| 692 | 8 nm | 2020 | (5 TOPS) | Snapdragon 7 • 690 • 720G • • 7c • 7c (Gen 2) • | ||
| 694 | 8 nm | 2020 | (4.7 TOPS) | Snapdragon 7 • 750G • | ||
| 696 | 7 nm | 2020 | (5.4 TOPS) | Snapdragon 7 • 765 • 765G • 768G • | ||
| 698 | 7 nm | 2020 | (15 TOPS) | Snapdragon 8 • 865 • 865+ • 870 • 8cx (Gen 3) • • Microsoft SQ3 • | ||
| 770 | 6 nm 5 nm |
2021 | (12 TOPS) | Snapdragon 7 • 778G • 778G+ • 780G • 782G • | ||
| 780 | 5 nm | 2021 | (26 TOPS / 32 TOPS) |
Snapdragon 8 • 888 • 888+ • | ||
| 790 (NPU/HTP)[1] | 4 nm | 2021 | (32 TOPS) (INT8) |
Snapdragon 8 • 8 (Gen 1) • 8+ (Gen 1) • | ||
| NPU (HTP Gen 2) | 4 nm | 2022 | (26 TOPS) (INT8) |
Snapdragon 8 • 8 (Gen 2) • | ||
| NPU (HTP Gen 3) | 4 nm | 2023 | (34 TOPS) (INT8) |
Snapdragon 8 • 8 (Gen 3) • 8s (Gen 3) • | ||
| NPU (HTP Gen 4) | 3 nm | 2024 | (50 TOPS) (INT8)[2] |
Snapdragon 8 • 8 Elite • | ||
| NPU (HTP Gen 4) | 4 nm | 2024 | (45 TOPS) (INT8)[3][4] |
Snapdragon X • X • X Elite • X Plus • |
Core[edit]
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This section is empty; you can help add the missing info by editing this page. |
Die[edit]
All SoCs using Hexagon[edit]
| |
This section is empty; you can help add the missing info by editing this page. |
Documents[edit]
| |
This section is empty; you can help add the missing info by editing this page. |
References[edit]
- Lucian Codrescu, Qualcomm, Qualcomm Hexagon DSP: An architecture optimized for mobile multimedia and communications, HotChips 2013
- Lucian Codrescu, Qualcomm, Architecture of the Hexagon 680 DSP for Mobile Imaging and Computer Vision, HotChips #27 2015
- ↑ https://ai-benchmark.com/ranking_processors
- ↑ https://www.reddit.com/r/LocalLLaMA/comments/1gy9wsx/npu_information_for_apple_and_snapdragon/
- ↑ https://www.ernestchiang.com/en/notes/general/tops-comparison-table-by-brand/
- ↑ https://www.anandtech.com/show/21445/qualcomm-snapdragon-x-architecture-deep-dive
Facts about "Hexagon - Microarchitectures - Qualcomm"
| codename | Hexagon + |
| designer | Qualcomm + |
| full page name | qualcomm/microarchitectures/hexagon + |
| instance of | microarchitecture + |
| manufacturer | TSMC + |
| name | Hexagon + |
| process | 65 nm (0.065 μm, 6.5e-5 mm) +, 45 nm (0.045 μm, 4.5e-5 mm) +, 28 nm (0.028 μm, 2.8e-5 mm) +, 14 nm (0.014 μm, 1.4e-5 mm) + and 10 nm (0.01 μm, 1.0e-5 mm) + |