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Snapdragon 850 - Qualcomm
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Snapdragon 850
General Info
DesignerQualcomm
ManufacturerSamsung
Model NumberSDM850
MarketMobile
IntroductionJune 5, 2018 (announced)
June 5, 2018 (launched)
General Specs
FamilySnapdragon 800
Frequency2,960 MHz
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A75, Cortex-A55
Core NameKryo 385 Gold, Kryo 385 Silver
Process10 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max CPUs1 (Uniprocessor)
Max Memory8 GiB

Snapdragon 850 is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in mid-2018. Fabricated on Samsung's 10nm LPP process, the 850 features four Kryo 385 Silver high-efficiency cores operating at ? GHz along with four high-performance Kryo 385 Gold operating at 2.96 GHz. The Snapdragon 850 integrates the Adreno 630 GPU operation at ? MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.

Overview[edit]

Positioned as a replacement for the 845 for always-connected ARM-based PCs and fabricated on Samsung's second-generation 10LPP process, the 850 is for the most part a higher-binned version of its predecessor. The chip features four high-performance cores based on the Cortex-A75 microarchitecture and four low-power cores based on the Cortex-A55 microarchitecture. This chip incorporates the X20 LTE modem, supporting Cat 18 up to 1.2 Gbps download and Cat 13 up to 150 Mbps upload.

Cache[edit]

Main articles: Cortex-A75 § Cache and Cortex-A55 § Cache


Quad-core cluster Cortex-A75:

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
L1I$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
4x64 KiB4-way set associative 
L1D$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
4x64 KiB4-way set associative 

L2$1 MiB
1,024 KiB
1,048,576 B
9.765625e-4 GiB
  4x256 KiB8-way set associative 

Quad-core cluster Cortex-A55:

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
L1I$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
4x64 KiB2-way set associative 
L1D$256 KiB
0.25 MiB
262,144 B
2.441406e-4 GiB
4x64 KiB4-way set associative 

L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  4x128 KiB8-way set associative 
  • 2 MiB L3

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3733
Supports ECCNo
Max Mem8 GiB
Frequency1866 MHz
Controllers1
Channels4
Width16 bit
Max Bandwidth29.87 GiB/s
51.974 GB/s
30,586.88 MiB/s
0.0292 TiB/s
0.0321 TB/s
Bandwidth
Single 6.95 GiB/s
Double 13.91 GiB/s
Quad 29.87 GiB/s

DSP[edit]

This chip features Qualcomm's Hexagon 685 DSP.

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUAdreno 630
DesignerQualcomm
Frequency? MHz
"? MHz" is not a number.
Output

Standards
DirectX12
OpenCL2.0
OpenGL ES3.2
Vulkan1.0
  • Hardware Acceleration
  • 4K HDR video playback (10-bit color depth, Rec. 2020 color gamut)
  • Decode: H.264 (AVC), H.265 (HEVC) and VP9
  • Up to 4K Ultra HD video capture @ 30FPS
  • Up to 1080p video capture @120 FPS

Audio[edit]

  • Aqstic audio codec and Aqstic smart speaker amplifier
    • Up to native DSD support, PCM up to 384 kHz/32-bit
  • Qualcomm aptX audio playback with support for aptX Classic and HD

ISP[edit]

  • 2x Image Sensor Processor (ISP)
  • 14-bit

Megapixel:

  • Up to 16 MP dual camera
  • Up to 32 MP single camera

Connectivity[edit]

  • WiFi
    • Integrated 802.11ac 2 x 2 with MU-MIMO
    • Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual
    • Band Simultaneous (DBS) + 60 GHz
  • Bluetooth 5.0
  • RF Front End
  • LTE Modem
    • Snapdragon X15
      • Downlink:
        • Category 18 up to 1,200 Mbps
        • 5 x 20 MHz carrier aggregation, up to 256-QAM
        • Up to 4 x 4 MIMO on three aggregated carriers
      • Uplink:
        • Category 13 up to 150 Mbps
        • 2 x 20 MHz carrier aggregation, up to 64-QAM

Location[edit]

  • GPS
    • Glonass, BeiDou, Galileo, QZSS, and SBAS
  • Low power geofencing and tracking, sensor assisted navigation
base frequency2,960 MHz (2.96 GHz, 2,960,000 kHz) +
core count8 +
core nameKryo 385 Gold + and Kryo 385 Silver +
designerQualcomm +
dspHexagon 685 DSP +
familySnapdragon 800 +
first announcedJune 5, 2018 +
first launchedJune 5, 2018 +
full page namequalcomm/snapdragon 800/850 +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 630 +
integrated gpu designerQualcomm +
isaARMv8 +
isa familyARM +
l1$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l1d$ description4-way set associative +
l1d$ size0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) +
l1i$ description4-way set associative + and 2-way set associative +
l1i$ size0.25 MiB (256 KiB, 262,144 B, 2.441406e-4 GiB) +
l2$ description8-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + and 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
ldateJune 5, 2018 +
manufacturerSamsung +
market segmentMobile +
max cpu count1 +
max memory8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth29.87 GiB/s (51.974 GB/s, 30,586.88 MiB/s, 0.0292 TiB/s, 0.0321 TB/s) +
max memory channels4 +
microarchitectureCortex-A75 + and Cortex-A55 +
model numberSDM850 +
nameSnapdragon 850 +
process10 nm (0.01 μm, 1.0e-5 mm) +
supported memory typeLPDDR4X-3733 +
technologyCMOS +
thread count8 +
word size64 bit (8 octets, 16 nibbles) +