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{{microarchitecture | {{microarchitecture | ||
|atype=CPU | |atype=CPU | ||
− | |name=Cortex- | + | |name=Cortex-A55 |
|designer=ARM Holdings | |designer=ARM Holdings | ||
|manufacturer=TSMC | |manufacturer=TSMC |
Revision as of 19:11, 12 November 2022
Edit Values | |
Cortex-A55 µarch | |
General Info | |
Arch Type | CPU |
Designer | ARM Holdings |
Manufacturer | TSMC, Samsung, GlobalFoundries, SMIC |
Introduction | May 29, 2017 |
Process | 16 nm, 14 nm, 10 nm, 7 nm, 12 nm |
Core Configs | 1, 2, 3, 4 |
Pipeline | |
Type | In-order |
OoOE | No |
Speculative | Yes |
Reg Renaming | Yes |
Stages | 8 |
Decode | 2-way |
Instructions | |
ISA | ARMv8.2 |
Extensions | FPU, NEON, TrustZone |
Cache | |
L1I Cache | 8-64 KiB/core 4-way set associative |
L1D Cache | 8-64 KiB/core 4-way set associative |
L2 Cache | 64-256 KiB/core 4-way set associative |
L3 Cache | 0-4 MiB/Cluster |
Succession | |
Cortex-A55 (codename Ananke) is an ultra-high efficiency microarchitecture designed by ARM Holdings as a successor to the Cortex-A53. The Cortex-A55, which implemented the ARMv8.2 ISA, is typically found in entry-level smartphone and other embedded devices. Often A55 cores are combined with higher performance processors (e.g. based on Cortex-A75) in DynamIQ big.LITTLE configuration to achieve better energy/performance.
Note that this microarchitecture is designed as a synthesizable IP core and is sold to other semiconductor companies to be implemented in their own chips.
Contents
Process Technology
The Cortex-A55 was primarily designed to make use of TSMC's 16 nm process with a 7 nm optimized version set for the end of 2017 or early 2018.
Architecture
The Cortex-A55 is an improved version of the A53 which introduces a number of performance enhancements as well as designed to be implemented based on ARM's DynamIQ big.LITTLE design.
Key changes from Cortex-A53
- Higher performance (ARM claims: up to 2x mem perf, up to 15% less power from A53)
- Implements ARMv8.2 (from ARMv8.0)
- Designed as a cluster of 1 to 8 cores
- Adds DynamIQ Shared Unit (DSU)
- Branch predictor was re-written
- Memory subsystem
- L2
- L2 cache is now private to each core (from shared between all cores)
- Latency was cut by half
- Now runs at the same frequency as the core
- Configurable size from 64 KiB to 256 KiB
- L3
- A new L3 cache was introduced
- Shared by all cores
- Configurable size: 0 MiB - 4 MiB
- L2
- NEON is improved
- New instructions
- Up to 16x 8-bit integer operations per cycle
- Up to 8x 16-bit floating point per cycle
Licensees
Arm named the following companies as licensees.
Die
This section is empty; you can help add the missing info by editing this page. |
All Cortex-A55 Chips
List of all Cortex-A55 Chips | |||||||||||||||||||||||||
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Main processor | IGP | ||||||||||||||||||||||||
Model | Launched | Designer | Family | Core | C | T | L2$ | L3$ | Frequency | Max Mem | Designer | Name | Frequency | ||||||||||||
1000 | 2020 | MediaTek | Dimensity | Cortex-A77, Cortex-A55 | 8 | 8 | 2.6 GHz 2,600 MHz , 2 GHz2,600,000 kHz 2,000 MHz 2,000,000 kHz | 16 GiB 16,384 MiB 16,777,216 KiB 17,179,869,184 B 0.0156 TiB | Arm Holdings | Mali-G77 | |||||||||||||||
1000L | 2020 | MediaTek | Dimensity | Cortex-A77, Cortex-A55 | 8 | 8 | 2.2 GHz 2,200 MHz , 2 GHz2,200,000 kHz 2,000 MHz 2,000,000 kHz | Arm Holdings | Mali-G77 | ||||||||||||||||
800 | March 2020 | MediaTek | Dimensity | Cortex-A76, Cortex-A55 | 8 | 8 | 2 GHz 2,000 MHz 2,000,000 kHz | 16 GiB 16,384 MiB 16,777,216 KiB 17,179,869,184 B 0.0156 TiB | Arm Holdings | Mali-G57 | |||||||||||||||
9810 | 25 February 2018 | Samsung, ARM Holdings | Exynos | Cortex-A55, Meerkat | 8 | 8 | 0.25 MiB 256 KiB , 2 MiB262,144 B 2.441406e-4 GiB 2,048 KiB 2,097,152 B 0.00195 GiB | 4 MiB 4,096 KiB 4,194,304 B 0.00391 GiB | 2.704 GHz 2,704 MHz , 1.794 GHz2,704,000 kHz 1,794 MHz 1,794,000 kHz | ARM Holdings | Mali-G72 | 572 MHz 0.572 GHz 572,000 KHz | |||||||||||||
9820 | January 2019 | Samsung, ARM Holdings | Exynos | Cortex-A75, Cortex-A55, Cheetah | 8 | 8 | 0.5 MiB 512 KiB , 1 MiB524,288 B 4.882812e-4 GiB 1,024 KiB 1,048,576 B 9.765625e-4 GiB | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 12 GiB 12,288 MiB 12,582,912 KiB 12,884,901,888 B 0.0117 TiB | ARM Holdings | Mali-G76 | ||||||||||||||
9825 | 2019 | Samsung, ARM Holdings | Exynos | Cortex-A75, Cortex-A55, Cheetah | 8 | 8 | 1 MiB 1,024 KiB , 0.5 MiB1,048,576 B 9.765625e-4 GiB 512 KiB 524,288 B 4.882812e-4 GiB | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 2.73 GHz 2,730 MHz , 2.4 GHz2,730,000 kHz 2,400 MHz , 1.95 GHz2,400,000 kHz 1,950 MHz 1,950,000 kHz | 12 GiB 12,288 MiB 12,582,912 KiB 12,884,901,888 B 0.0117 TiB | ARM Holdings | Mali-G76 | 754 MHz 0.754 GHz 754,000 KHz | ||||||||||||
990 | 2020 | Samsung, ARM Holdings | Exynos | Mongoose 5, Cortex-A76, Cortex-A55 | 8 | 8 | 1 MiB 1,024 KiB , 0.5 MiB1,048,576 B 9.765625e-4 GiB 512 KiB 524,288 B 4.882812e-4 GiB | 2 MiB 2,048 KiB 2,097,152 B 0.00195 GiB | 3.016 GHz 3,016 MHz , 2.6 GHz3,016,000 kHz 2,600 MHz , 2.106 GHz2,600,000 kHz 2,106 MHz 2,106,000 kHz | 16 GiB 16,384 MiB 16,777,216 KiB 17,179,869,184 B 0.0156 TiB | ARM Holdings | Mali-G77 | 832 MHz 0.832 GHz 832,000 KHz | ||||||||||||
G80 | 3 February 2020 | MediaTek, ARM Holdings | Helio | Cortex-A75, Cortex-A55 | 8 | 8 | 1.8 GHz 1,800 MHz , 2 GHz1,800,000 kHz 2,000 MHz 2,000,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | ARM Holdings | Mali-G52 | 950 MHz 0.95 GHz 950,000 KHz | ||||||||||||||
P65 | 25 June 2019 | MediaTek, ARM Holdings | Helio | Cortex-A75, Cortex-A55 | 8 | 8 | 2 GHz 2,000 MHz 2,000,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | ARM Holdings | Mali-G52 | 820 MHz 0.82 GHz 820,000 KHz | ||||||||||||||
P90 | 13 December 2018 | MediaTek, ARM Holdings | Helio | Cortex-A75, Cortex-A55 | 8 | 8 | 2.2 GHz 2,200 MHz , 2 GHz2,200,000 kHz 2,000 MHz 2,000,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | Imagination Technologies | PowerVR GM 9446 | 970 MHz 0.97 GHz 970,000 KHz | ||||||||||||||
810 | 21 June 2019 | HiSilicon, ARM Holdings | Kirin | Cortex-A76, Cortex-A55 | 8 | 8 | 1 MiB 1,024 KiB , 0.75 MiB1,048,576 B 9.765625e-4 GiB 768 KiB 786,432 B 7.324219e-4 GiB | 2.27 GHz 2,270 MHz , 1.88 GHz2,270,000 kHz 1,880 MHz 1,880,000 kHz | ARM Holdings | Mali-G52 | 850 MHz 0.85 GHz 850,000 KHz | ||||||||||||||
980 | 31 August 2018 | HiSilicon, ARM Holdings | Kirin | Cortex-A76, Cortex-A55 | 8 | 8 | 2 MiB 2,048 KiB , 0.5 MiB2,097,152 B 0.00195 GiB 512 KiB 524,288 B 4.882812e-4 GiB | 2.6 GHz 2,600 MHz , 1.92 GHz2,600,000 kHz 1,920 MHz , 1.8 GHz1,920,000 kHz 1,800 MHz 1,800,000 kHz | ARM Holdings | Mali-G76 | 720 MHz 0.72 GHz 720,000 KHz | ||||||||||||||
990 4G | 6 September 2019 | HiSilicon, ARM Holdings | Kirin | Cortex-A76, Cortex-A55 | 8 | 8 | 2 MiB 2,048 KiB , 0.5 MiB2,097,152 B 0.00195 GiB 512 KiB 524,288 B 4.882812e-4 GiB | 2.86 GHz 2,860 MHz , 1.86 GHz2,860,000 kHz 1,860 MHz , 2.088 GHz1,860,000 kHz 2,088 MHz 2,088,000 kHz | ARM Holdings | Mali-G76 | 600 MHz 0.6 GHz 600,000 KHz | ||||||||||||||
990 5G | 6 September 2019 | HiSilicon, ARM Holdings | Kirin | Cortex-A76, Cortex-A55 | 8 | 8 | 2 MiB 2,048 KiB , 0.5 MiB2,097,152 B 0.00195 GiB 512 KiB 524,288 B 4.882812e-4 GiB | 2.86 GHz 2,860 MHz , 2.36 GHz2,860,000 kHz 2,360 MHz , 1.95 GHz2,360,000 kHz 1,950 MHz 1,950,000 kHz | ARM Holdings | Mali-G76 | 600 MHz 0.6 GHz 600,000 KHz | ||||||||||||||
SDM670 | 8 August 2018 | Qualcomm, ARM Holdings | Snapdragon 600 | Kryo 360 Gold, Kryo 360 Silver | 8 | 8 | 1.7 GHz 1,700 MHz , 2.2 GHz1,700,000 kHz 2,200 MHz 2,200,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | Qualcomm | Adreno 615 | |||||||||||||||
SDM675 | 22 October 2018 | Qualcomm, ARM Holdings | Snapdragon 600 | Kryo 460 Gold, Kryo 460 Silver | 8 | 8 | 0.25 MiB 256 KiB , 0.0625 MiB262,144 B 2.441406e-4 GiB 64 KiB 65,536 B 6.103516e-5 GiB | 2 GHz 2,000 MHz , 1.7 GHz2,000,000 kHz 1,700 MHz 1,700,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | Qualcomm | Adreno 612 | ||||||||||||||
SDM710 | 23 May 2018 | Qualcomm, ARM Holdings | Snapdragon 700 | Kryo 360 Gold, Kryo 360 Silver | 8 | 8 | 2.2 GHz 2,200 MHz , 1.7 GHz2,200,000 kHz 1,700 MHz 1,700,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | Qualcomm | Adreno 616 | 500 MHz 0.5 GHz 500,000 KHz | ||||||||||||||
SDM712 | 6 February 2019 | Qualcomm, ARM Holdings | Snapdragon 700 | Kryo 360 Gold, Kryo 360 Silver | 8 | 8 | 2.3 GHz 2,300 MHz , 1.7 GHz2,300,000 kHz 1,700 MHz 1,700,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | Qualcomm | Adreno 616 | 550 MHz 0.55 GHz 550,000 KHz | ||||||||||||||
SDM730 | 9 April 2019 | Qualcomm, ARM Holdings | Snapdragon 700 | Kryo 470 Gold, Kryo 470 Silver | 8 | 8 | 1.8 GHz 1,800 MHz , 2.2 GHz1,800,000 kHz 2,200 MHz 2,200,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | Qualcomm | Adreno 618 | 500 MHz 0.5 GHz 500,000 KHz | ||||||||||||||
SDM730G | 9 April 2019 | Qualcomm, ARM Holdings | Snapdragon 700 | Kryo 470 Gold, Kryo 470 Silver | 8 | 8 | 2.2 GHz 2,200 MHz , 1.8 GHz2,200,000 kHz 1,800 MHz 1,800,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | Qualcomm | Adreno 618 | 575 MHz 0.575 GHz 575,000 KHz | ||||||||||||||
Snapdragon 720G | 20 January 2020 | Qualcomm | Snapdragon 700 | Kryo 465 Gold, Kryo 465 Silver | 8 | 8 | 1.8 GHz 1,800 MHz , 2.3 GHz1,800,000 kHz 2,300 MHz 2,300,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | Qualcomm | Adreno 618 | 500 MHz 0.5 GHz 500,000 KHz | ||||||||||||||
8cx | March 2019 | Qualcomm, ARM Holdings | Snapdragon 800 | Kryo 495 Gold, Kryo 495 Silver | 8 | 8 | 10 MiB 10,240 KiB 10,485,760 B 0.00977 GiB | 1.8 GHz 1,800 MHz , 2.84 GHz1,800,000 kHz 2,840 MHz , 3.02 GHz2,840,000 kHz 3,020 MHz 3,020,000 kHz | Qualcomm | Adreno 680 GPU | |||||||||||||||
SDM845 | February 2018 | Qualcomm, ARM Holdings | Snapdragon 800 | Kryo 385 Gold, Kryo 385 Silver | 8 | 8 | 1 MiB 1,024 KiB , 0.5 MiB1,048,576 B 9.765625e-4 GiB 512 KiB 524,288 B 4.882812e-4 GiB | 2.8 GHz 2,800 MHz , 1.7 GHz2,800,000 kHz 1,700 MHz 1,700,000 kHz | 10 GiB 10,240 MiB 10,485,760 KiB 10,737,418,240 B 0.00977 TiB | Qualcomm | Adreno 630 GPU | 710 MHz 0.71 GHz 710,000 KHz | |||||||||||||
SDM850 | 5 June 2018 | Qualcomm | Snapdragon 800 | Kryo 385 Gold, Kryo 385 Silver | 8 | 8 | 1 MiB 1,024 KiB , 0.5 MiB1,048,576 B 9.765625e-4 GiB 512 KiB 524,288 B 4.882812e-4 GiB | 2.96 GHz 2,960 MHz 2,960,000 kHz | 8 GiB 8,192 MiB 8,388,608 KiB 8,589,934,592 B 0.00781 TiB | Qualcomm | Adreno 630 | ||||||||||||||
SDM855 | March 2019 | ARM Holdings, Qualcomm | Snapdragon 800 | Kryo 485 Gold, Kryo 485 Silver | 8 | 8 | 0.5 MiB 512 KiB , 0.75 MiB524,288 B 4.882812e-4 GiB 768 KiB 786,432 B 7.324219e-4 GiB | 1.8 GHz 1,800 MHz , 2.42 GHz1,800,000 kHz 2,420 MHz , 2.84 GHz2,420,000 kHz 2,840 MHz 2,840,000 kHz | 16 GiB 16,384 MiB 16,777,216 KiB 17,179,869,184 B 0.0156 TiB | Qualcomm | Adreno 640 GPU | 257 MHz 0.257 GHz 257,000 KHz | |||||||||||||
SDM855AC | March 2019 | Qualcomm, ARM Holdings | Snapdragon 800 | Kryo 485 Gold, Kryo 485 Silver | 8 | 8 | 1 MiB 1,024 KiB , 0.5 MiB1,048,576 B 9.765625e-4 GiB 512 KiB 524,288 B 4.882812e-4 GiB | 1.8 GHz 1,800 MHz , 2.42 GHz1,800,000 kHz 2,420 MHz , 2.96 GHz2,420,000 kHz 2,960 MHz 2,960,000 kHz | 16 GiB 16,384 MiB 16,777,216 KiB 17,179,869,184 B 0.0156 TiB | Qualcomm | Adreno 640 GPU | 250 MHz 0.25 GHz 250,000 KHz | |||||||||||||
SDM865 | March 2020 | Qualcomm, ARM Holdings | Snapdragon 800 | Kryo 585 Gold, Kryo 585 Silver, kryo 585 prime | 8 | 8 | 0.5 MiB 512 KiB , 0.75 MiB524,288 B 4.882812e-4 GiB 768 KiB 786,432 B 7.324219e-4 GiB | 2.42 GHz 2,420 MHz , 2.84 GHz2,420,000 kHz 2,840 MHz , 2.11 GHz2,840,000 kHz 2,110 MHz 2,110,000 kHz | 16 GiB 16,384 MiB 16,777,216 KiB 17,179,869,184 B 0.0156 TiB | Qualcomm | Adreno 650 GPU | 257 MHz 0.257 GHz 257,000 KHz | |||||||||||||
Count: 27 |
codename | Cortex-A55 + |
core count | 1 +, 2 +, 3 + and 4 + |
designer | ARM Holdings + |
first launched | May 29, 2017 + |
full page name | arm holdings/microarchitectures/cortex-a55 + |
instance of | microarchitecture + |
instruction set architecture | ARMv8.2 + |
manufacturer | TSMC +, Samsung +, GlobalFoundries + and SMIC + |
microarchitecture type | CPU + |
name | Cortex-A55 + |
pipeline stages | 8 + |
process | 16 nm (0.016 μm, 1.6e-5 mm) +, 14 nm (0.014 μm, 1.4e-5 mm) +, 10 nm (0.01 μm, 1.0e-5 mm) +, 7 nm (0.007 μm, 7.0e-6 mm) + and 12 nm (0.012 μm, 1.2e-5 mm) + |