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Snapdragon 8cx - Qualcomm
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Snapdragon 8cx
sd 8cx (front).png
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerTSMC
Model Number8cx
MarketMobile
IntroductionDecember 6, 2018 (announced)
Q3, 2019 (launched)
General Specs
FamilySnapdragon 800
Series800
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A76, Cortex-A55
Core NameKryo 495 Gold, Kryo 495 Silver
Process7 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Max CPUs1 (Uniprocessor)
Electrical
TDP7 W
Packaging
sd 8cx (back).png
Succession

Snapdragon 8cx (Snapdragon 8 Compute eXtreme) is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on TSMC's 7nm process, the 8cx features four Kryo 495 Silver high-efficiency cores operating at ? GHz along with four high-performance Kryo 495 Gold operating at ? GHz. The Snapdragon 8cx integrates the Adreno 680 GPU operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to ? GiB of octa-channel LPDDR4X-4266 memory.

Overview[edit]

Block Diagram
snapdragon-8cx-compute-platform-chip-on-wafer.jpg
snapdragon-8cx-compute-platform-chip-back.jpg
snapdragon-8cx-compute-platform-chip-front.jpg

The Snapdragon 8cx was announced by Qualcomm on December 6, 2018. The chip is what Qualcomm considers a new high tier Snapdragon aimed at always-connected PCs with higher performance and thermal headroom over traditional smartphone devices. The chip comprise of a quad-core cluster of Kryo 495 Gold (Cortex-A76) big cores and a quad-core cluster of Kryo 495 Silver (Cortex-A55) little cores.

Cache[edit]

Main articles: Cortex-A76 § Cache and Cortex-A55

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L3$10 MiB
10,240 KiB
10,485,760 B
0.00977 GiB
  1x10 MiB  

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-4266
Supports ECCNo
Max Mem? GiB
Frequency2133 MHz
Controllers1
Channels8
Width16 bit
Max Bandwidth63.58 GiB/s
Bandwidth
Single 7.95 GiB/s
Double 15.89 GiB/s
Quad 31.79 GiB/s
Octa 63.58 GiB/s
  • SSD: NVME SSD
  • UFS: UFS 3.0

DSP[edit]

This chip features Qualcomm's Hexagon 685 DSP.

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUAdreno 680 GPU
DesignerQualcomm
Max Displays2
Frequency? MHz
"? MHz" is not a number.
Output

Standards
DirectX12
OpenCL2.0
OpenGL ES3.2
Vulkan1.1
  • Codec Support: H.265 (HEVC), H.264 (AVC), VP9
  • Playback: Up 4K HDR decode at 120fps
  • Capture:
    • 4K Video Capture for Ultra HD Premium Displays (4K@30fps)
    • Slow Motion video capture (720p@480fps)

Camera[edit]

  • ISP
    • Dual 14-bit ISPs
    • Qualcomm Spectra 390 image signal processor
    • Up to 16 MP dual camera
    • Up to 32 MP single camera

Connectivity[edit]

  • X24 LTE modem
    • LTE Category 20
    • Downlink:
      • 2 Gbps peak
      • 7x20 MHz carrier aggregation
      • Up to 256-QAM
      • Up to 4x4 MIMO on five carriers
      • Full-Dimension MIMO (FD-MIMO)
      • Maximum 20 spatial streams
    • Uplink:
      • 316 Mbps peak
      • 3x20 MHz carrier aggregation
      • Up to 2x 106Mbps LTE streams
      • Up to 256-QAM
      • Uplink data compression
  • LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
  • WiFi
    • Standards: 802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
    • Spectral Bands: 2.4 GHz, 5 GHz, 60 GHz
    • MIMO Configuration: 2x2 (2-stream)
  • Bluetooth
    • Bluetooth 5.0

Location[edit]

  • Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Documents[edit]

back imageFile:sd 8cx (back).png +
core count8 +
core nameKryo 495 Gold + and Kryo 495 Silver +
designerQualcomm + and ARM Holdings +
dspHexagon 685 DSP +
familySnapdragon 800 +
first announcedDecember 6, 2018 +
first launchedMarch 2019 +
full page namequalcomm/snapdragon 800/8cx +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 680 GPU +
integrated gpu designerQualcomm +
isaARMv8 +
isa familyARM +
l3$ size10 MiB (10,240 KiB, 10,485,760 B, 0.00977 GiB) +
ldate3000 +
main imageFile:sd 8cx (front).png +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory channels8 +
microarchitectureCortex-A76 + and Cortex-A55 +
model number8cx +
nameSnapdragon 8cx +
process7 nm (0.007 μm, 7.0e-6 mm) +
series800 +
supported memory typeLPDDR4X-4266 +
tdp7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
technologyCMOS +
thread count8 +
word size64 bit (8 octets, 16 nibbles) +