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Snapdragon 8cx - Qualcomm
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Snapdragon 8cx
sd 8cx (front).png
General Info
DesignerQualcomm,
ARM Holdings
ManufacturerTSMC
Model Number8cx
MarketMobile
IntroductionDecember 6, 2018 (announced)
Q3, 2019 (launched)
General Specs
FamilySnapdragon 800
Series800
LockedNo
Frequency1,800 MHz, 2,840 MHz, 1,800 MHz, 3,020 MHz
Bus speed100 MHz
Clock multiplier28x
Microarchitecture
ISAARMv8 (ARM)
MicroarchitectureCortex-A76, Cortex-A55
Core NameKryo 495 Gold, Kryo 495 Silver
Process7 nm
TechnologyCMOS
Word Size64 bit
Cores8
Threads8
Multiprocessing
Max SMP1-Way (Uniprocessor)
Electrical
Vcore0.5 V-0.95 V
TDP7 W
Packaging
sd 8cx (back).png
Succession

Snapdragon 8cx (Snapdragon 8 Compute eXtreme) is a high-performance 64-bit ARM LTE system on a chip designed by Qualcomm and introduced in late 2018. Fabricated on TSMC's 7nm process, the 8cx features four Kryo 495 Silver high-efficiency cores operating at 1.8 GHz along with four high-performance Kryo 495 Gold operating at 2.84 GHz. The Snapdragon 8cx integrates the Adreno 680 GPU operation at ? MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to ? GiB of octa-channel LPDDR4X-4266 memory.

Overview[edit]

Block Diagram
snapdragon-8cx-compute-platform-chip-on-wafer.jpg
snapdragon-8cx-compute-platform-chip-back.jpg
snapdragon-8cx-compute-platform-chip-front.jpg

The Snapdragon 8cx was announced by Qualcomm on December 6, 2018. The chip is what Qualcomm considers a new high tier Snapdragon aimed at always-connected PCs with higher performance and thermal headroom over traditional smartphone devices. The chip comprise of a quad-core cluster of Kryo 495 Gold (Cortex-A76) big cores and a quad-core cluster of Kryo 495 Silver (Cortex-A55) little cores.

Cache[edit]

Main articles: Cortex-A76 § Cache and Cortex-A55

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L3$10 MiB
10,240 KiB
10,485,760 B
0.00977 GiB
  1x10 MiB  

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-4266
Supports ECCNo
Max Mem16 GiB
Frequency2133 MHz
Controllers1
Channels8
Width16 bit
Max Bandwidth63.58 GiB/s
65,105.92 MiB/s
68.269 GB/s
68,268.505 MB/s
0.0621 TiB/s
0.0683 TB/s
Bandwidth
Single 7.95 GiB/s
Double 15.89 GiB/s
Quad 31.79 GiB/s
Octa 63.58 GiB/s
  • SSD: NVME SSD
  • UFS: UFS 3.0

DSP[edit]

This chip features Qualcomm's Hexagon 685 DSP.

Graphics[edit]

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUAdreno 680 GPU
DesignerQualcomm
Max Displays2
Frequency? MHz
"? MHz" is not a number.

Standards
DirectX12
OpenCL2.0
OpenGL ES3.2
Vulkan1.1
  • Codec Support: H.265 (HEVC), H.264 (AVC), VP9
  • Playback: Up 4K HDR decode at 120fps
  • Capture:
    • 4K Video Capture for Ultra HD Premium Displays (4K@30fps)
    • Slow Motion video capture (720p@480fps)

Camera[edit]

  • ISP
    • Dual 14-bit ISPs
    • Qualcomm Spectra 390 image signal processor
    • Up to 16 MP dual camera
    • Up to 32 MP single camera

Connectivity[edit]

  • X24 LTE modem
    • LTE Category 20
    • Downlink:
      • 2 Gbps peak
      • 7x20 MHz carrier aggregation
      • Up to 256-QAM
      • Up to 4x4 MIMO on five carriers
      • Full-Dimension MIMO (FD-MIMO)
      • Maximum 20 spatial streams
    • Uplink:
      • 316 Mbps peak
      • 3x20 MHz carrier aggregation
      • Up to 2x 106Mbps LTE streams
      • Up to 256-QAM
      • Uplink data compression
  • LTE FDD, LTE TDD including CBRS support, LAA, LTE Broadcast, WCDMA (DB-DC-HSDPA, DC-HSUPA), TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
  • WiFi
    • Standards: 802.11ad, 802.11ac Wave 2, 802.11a/b/g, 802.11n
    • Spectral Bands: 2.4 GHz, 5 GHz, 60 GHz
    • MIMO Configuration: 2x2 (2-stream)
  • Bluetooth
    • Bluetooth 5.0

Location[edit]

  • Systems: GPS, GLONASS, Beidou, Galileo, QZSS, SBAS

Utilizing devices[edit]

  • Galaxy Book S

Documents[edit]

back imageFile:sd 8cx (back).png +
base frequency1,800 MHz (1.8 GHz, 1,800,000 kHz) +, 2,840 MHz (2.84 GHz, 2,840,000 kHz) + and 3,020 MHz (3.02 GHz, 3,020,000 kHz) +
bus speed100 MHz (0.1 GHz, 100,000 kHz) +
core count8 +
core nameKryo 495 Gold + and Kryo 495 Silver +
core voltage (max)0.95 V (9.5 dV, 95 cV, 950 mV) +
core voltage (min)0.5 V (5 dV, 50 cV, 500 mV) +
designerQualcomm + and ARM Holdings +
dspHexagon 685 DSP +
familySnapdragon 800 +
first announcedDecember 6, 2018 +
first launchedMarch 2019 +
full page namequalcomm/snapdragon 800/8cx +
has ecc memory supportfalse +
has locked clock multiplierfalse +
instance ofmicroprocessor +
integrated gpuAdreno 680 GPU +
integrated gpu designerQualcomm +
isaARMv8 +
isa familyARM +
l3$ size10 MiB (10,240 KiB, 10,485,760 B, 0.00977 GiB) +
ldate3000 +
main imageFile:sd 8cx (front).png +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory bandwidth63.58 GiB/s (65,105.92 MiB/s, 68.269 GB/s, 68,268.505 MB/s, 0.0621 TiB/s, 0.0683 TB/s) +
max memory channels8 +
microarchitectureCortex-A76 + and Cortex-A55 +
model number8cx +
nameSnapdragon 8cx +
process7 nm (0.007 μm, 7.0e-6 mm) +
series800 +
smp max ways1 +
supported memory typeLPDDR4X-4266 +
tdp7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
technologyCMOS +
thread count8 +
used byGalaxy Book S +
word size64 bit (8 octets, 16 nibbles) +