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== Models ==
 
== Models ==
 
=== Bonnell ===
 
=== Bonnell ===
{{main|intel/microarchitectures/bonnell|l1=Bonnel Microarchitecture}}
+
{{main|intel/microarchitectures/bonnell|l1=Bonnell Microarchitecture}}
'''Bonnell''' was the first microarchitecture designed specifically for the ultra-low power microprocessor market. Introduced in 2008, it featured fully [[x86]]-compatible cores with a TDP of only 500 mW to 2 W, less than any other x86 processor available that the time. Bonnell's low-power came from its simplicity, being an [[in-order]] dual-issue piplined CPU. All Bonnell-based processors were manufactured on Intel's [[45 nm process]].
+
'''Bonnell''' was the first microarchitecture designed specifically for the ultra-low power microprocessor market. Introduced in 2008, it featured fully [[x86]]-compatible cores with a TDP of only 500 mW to 2 W, less than any other x86 processor available at the time. Bonnell's low-power came from its simplicity, being an [[in-order]] dual-issue pipelined CPU. All Bonnell-based processors were manufactured on Intel's [[45 nm process]].
  
 
==== Silverthorne (MIDs, 1st Gen) ====
 
==== Silverthorne (MIDs, 1st Gen) ====
 
[[File:intel atom logo (2008-2009).png|right|100px]]
 
[[File:intel atom logo (2008-2009).png|right|100px]]
 
{{see also|intel/cores/silverthorne|l1=Silverthorne Core}}
 
{{see also|intel/cores/silverthorne|l1=Silverthorne Core}}
The first series of Bonnell processors were introduced during the [[2008]] Intel Developer Forum (IDF) in Shanghai, China. Those {{arch|32}} processors were based on the the {{intel|Silverthorne|l=core}} core which were designed for the [[Mobile Internet Devices]] (MID) market. Silverthorne processors have 56 [[KiB]] of L1$ and 512 KiB of L2. Silverthorne has support for the traditional [[GTL|AGTL+]]-based [[FSB]] as well as a new low power [[CMOS]] FSB specifically introduced to reduce power.
+
The first series of Bonnell processors were introduced during the [[2008]] Intel Developer Forum (IDF) in Shanghai, China. Those {{arch|32}} processors were based on the {{intel|Silverthorne|l=core}} core which were designed for the [[Mobile Internet Devices]] (MID) market. Silverthorne processors have 56 [[KiB]] of L1$ and 512 KiB of L2. Silverthorne has support for the traditional [[GTL|AGTL+]]-based [[FSB]] as well as a new low power [[CMOS]] FSB specifically introduced to reduce power.
  
Silverthorne chips consist of 47 million [[transistors]] on a 24.2 mm² die. All processors are a [[single core]]. Additionally all models support every [[x86]] extension up to {{intel|SSSE3}} ({{intel|SMM}}, {{intel|FPU}}, {{intel|NX}}, {{intel|MMX}}, {{intel|SSE}}, {{intel|SSE2}}, {{intel|SSE3}}, {{intel|SSSE3}}). The original series of chips that were introduced in 2008 featured a tiny {{intel|FCBGA-437}} package measuring just 13 mm x 14 mm. Intel introduced an set of new models in a much bigger 22x22 mm² {{intel|FCBGA-441}} package. Models ending in ''P'' use those large packages. A couple of models (those ending with 'T') also support industrial temperature ranges.
+
Silverthorne chips consist of 47 million [[transistors]] on a 24.2 mm² die. All processors are a [[single core]]. Additionally all models support every [[x86]] extension up to {{intel|SSSE3}} ({{intel|SMM}}, {{intel|FPU}}, {{intel|NX}}, {{intel|MMX}}, {{intel|SSE}}, {{intel|SSE2}}, {{intel|SSE3}}, {{intel|SSSE3}}). The original series of chips that were introduced in 2008 featured a tiny {{intel|FCBGA-437}} package measuring just 13 mm x 14 mm. Intel introduced a set of new models in a much bigger 22x22 mm² {{intel|FCBGA-441}} package. Models ending in ''P'' use those large packages. A couple of models (those ending with 'T') also support industrial temperature ranges.
  
 
Silverthorne chips have an incredibly simple design featuring only the CPU itself on-die. The [[southbridge]] and [[northbridge]] are integrated on a secondary {{intel|Poulsbo|l=chipset}} chipset which features the [[memory controller]], an [[integrated graphics]], and the various [[I/O]] ports.
 
Silverthorne chips have an incredibly simple design featuring only the CPU itself on-die. The [[southbridge]] and [[northbridge]] are integrated on a secondary {{intel|Poulsbo|l=chipset}} chipset which features the [[memory controller]], an [[integrated graphics]], and the various [[I/O]] ports.
Line 86: Line 86:
  
 
Lincroft SoCs where also fabricated on a [[45 nm process]] but incorporate a large part of the southbridge. For those reasons the die is considerably larger, 65.25 mm² incorporating 140,000,000 transistors. As with Silverthorne, all models support every [[x86]] extension up to {{intel|SSSE3}} ({{intel|SMM}}, {{intel|FPU}}, {{intel|NX}}, {{intel|MMX}}, {{intel|SSE}}, {{intel|SSE2}}, {{intel|SSE3}}, {{intel|SSSE3}}). Lincroft integrates the same [[Imagination Technologies]] {{imgtec|PowerVR}} {{imgtec|SGX 535}} [[IGP]] as Silverthorne but operating at double the frequency. Lincroft chips are packaged in an {{intel|FCBGA-518}}.
 
Lincroft SoCs where also fabricated on a [[45 nm process]] but incorporate a large part of the southbridge. For those reasons the die is considerably larger, 65.25 mm² incorporating 140,000,000 transistors. As with Silverthorne, all models support every [[x86]] extension up to {{intel|SSSE3}} ({{intel|SMM}}, {{intel|FPU}}, {{intel|NX}}, {{intel|MMX}}, {{intel|SSE}}, {{intel|SSE2}}, {{intel|SSE3}}, {{intel|SSSE3}}). Lincroft integrates the same [[Imagination Technologies]] {{imgtec|PowerVR}} {{imgtec|SGX 535}} [[IGP]] as Silverthorne but operating at double the frequency. Lincroft chips are packaged in an {{intel|FCBGA-518}}.
 +
 +
In mid-2011 Intel introduce a number of new chips, as part of the {{intel|Oak Trail}} platform, utilizing the SM35 Express chipset.
 +
 +
<!-- NOTE:
 +
          This table is generated automatically from the data in the actual articles.
 +
          If a microprocessor is missing from the list, an appropriate article for it needs to be
 +
          created and tagged accordingly.
 +
 +
          Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
 +
-->
 +
{{comp table start}}
 +
<table class="comptable sortable tc13 tc14 tc15 tc16 tc17 tc18 tc19 tc20 tc21 tc22">
 +
<tr class="comptable-header"><th>&nbsp;</th><th colspan="20">List of Lincroft-based Atom Processors</th></tr>
 +
<tr class="comptable-header"><th>&nbsp;</th><th colspan="9">Main processor</th><th colspan="2">Memory</th><th colspan="2">[[IGP]]</th><th colspan="3">Features</th></tr>
 +
{{comp table header 1|cols=Family, Price, Process, Launched, C, T, Freq, Burst, TDP, Type, Mem, Name, Frequency, Package, {{intel|Hyper-Threading|HT}}, Burst}}
 +
{{#ask: [[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[core name::Lincroft]]
 +
|?full page name
 +
|?model number
 +
|?microprocessor family
 +
|?release price
 +
|?process
 +
|?first launched
 +
|?core count
 +
|?thread count
 +
|?base frequency#MHz
 +
|?turbo frequency (1 core)#GHz
 +
|?tdp#mW
 +
|?supported memory type
 +
|?max memory#GiB
 +
|?integrated gpu
 +
|?integrated gpu base frequency
 +
|?package
 +
|?has simultaneous multithreading
 +
|?has intel burst performance technology
 +
|format=template
 +
|template=proc table 3
 +
|sort=model number
 +
|userparam=18:17
 +
|mainlabel=-
 +
}}
 +
{{comp table count|ask=[[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[core name::Lincroft]]}}
 +
</table>
 +
{{comp table end}}
  
 
==== Diamondville (Nettops) ====
 
==== Diamondville (Nettops) ====
Line 129: Line 172:
 
}}
 
}}
 
{{comp table count|ask=[[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[core name::Diamondville||Diamondville-SC||Diamondville-DC]]}}
 
{{comp table count|ask=[[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[core name::Diamondville||Diamondville-SC||Diamondville-DC]]}}
 +
</table>
 +
{{comp table end}}
 +
=== Silvermont ===
 +
{{main|intel/microarchitectures/silvermont|l1=Silvermont Microarchitecture}}
 +
Introduced in 2013, Silvermont-based processors are manufactured on a [[22 nm process]] and introduced OoOE to the Atom line of cores.
 +
 +
=== Goldmont ===
 +
{{main|intel/microarchitectures/goldmont|l1=Goldmont Microarchitecture}}
 +
Introduced in late 2016, Goldmont-based processors which are manufactured on a [[14 nm process]] and provider considerable improvement in performance, power, and capabilities over its predecessors. Goldmont also doubled the highest count of integrated ultra-low power cores.
 +
 +
==== Denverton (Servers) ====
 +
[[File:atom c3000.png|right|200px]]
 +
{{see also|intel/cores/denverton|l1=Denverton Core}}
 +
Denverton-based chips are a complete [[system on a chip]] for dense ultra-low power servers, network devices, storage, and [[internet of things]] (IoT). Manufactured on a [[14 nm process]], those chips over up to double the cores as the previous generation as well as higher integration and more I/O capabilities. Models support up to dual-channel DDR4 ECC memory and either 128 GiB or 256 GiB of memory. All models support everything up to SSE4.2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES) as well as {{intel|VT-x}}, {{intel|VT-d}}, {{intel|EPT}}, and {{intel|Secure Boot}}. Models vary from [[2 cores]] up to [[16 cores]] and without {{intel|Hyper-Threading}} support. Those SoCs come with 6 to 20 High-Speed Input/Output (HSIO) lanes which are highly configurable lanes that allow their intended purpose (e.g., SATA, PCIe, USB) to be setup by the user in the BIOS. The exact amount of each that can be allocated is model-dependent. Additionally, each model have two to four dedicated integrated Ethernet adapters supporting up 10 GbE. Depending on the exact model, some also have integrated {{intel|QuickAssist Technology}} which offers the ability to off-load cryptography and compression tasks to a separate dedicated engine on-die.
 +
 +
<!-- NOTE:
 +
          This table is generated automatically from the data in the actual articles.
 +
          If a microprocessor is missing from the list, an appropriate article for it needs to be
 +
          created and tagged accordingly.
 +
 +
          Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
 +
-->
 +
{{comp table start}}
 +
<table class="comptable sortable tc6 tc7 tc8 tc15 tc16 tc17 tc18 tc19 tc20 tc21">
 +
<tr class="comptable-header"><th>&nbsp;</th><th colspan="20">List of Denverton Processors</th></tr>
 +
<tr class="comptable-header"><th>&nbsp;</th><th colspan="9">Main processor</th><th colspan="2">Cache</th><th colspan="2">Memory</th><th colspan="4">Configurable I/O</th><th colspan="3">Feature Diff</th></tr>
 +
{{comp table header 1|cols=Price, Family, Process, Launched, Cores, Threads, %TDP, %Frequency, %Turbo, %L1, %L2, Memory Type, Max Mem, HS I/O, PCIe, USB, SATA, ECC, {{intel|Turbo Boost|TBT}}, {{intel|quickassist technology|QAT}}}}
 +
<tr class="comptable-header comptable-header-sep"><th>&nbsp;</th><th colspan="20">Server and Cloud Storage SKUs</th></tr>
 +
{{#ask: [[Category:microprocessor models by intel]] [[core name::Denverton]] [[part of::Server and Cloud Storage SKUs]]
 +
|?full page name
 +
|?model number
 +
|?release price
 +
|?microprocessor family
 +
|?process
 +
|?first launched
 +
|?core count
 +
|?thread count
 +
|?tdp
 +
|?base frequency
 +
|?turbo frequency (1 core)
 +
|?l1$ size#KiB
 +
|?l2$ size
 +
|?supported memory type
 +
|?max memory#GiB
 +
|?max hsio lanes
 +
|?Has subobject.max pcie lanes
 +
|?max usb ports
 +
|?max sata ports
 +
|?has ecc memory support
 +
|?has intel turbo boost technology 2 0
 +
|?has integrated intel quickassist technology
 +
|format=template
 +
|template=proc table 3
 +
|userparam=22:20
 +
|mainlabel=-
 +
|valuesep=,
 +
}}
 +
<tr class="comptable-header comptable-header-sep"><th>&nbsp;</th><th colspan="20">Network and Enterprise Storage SKUs</th></tr>
 +
{{#ask: [[Category:microprocessor models by intel]] [[core name::Denverton]] [[part of::Network and Enterprise Storage SKUs]]
 +
|?full page name
 +
|?model number
 +
|?release price
 +
|?microprocessor family
 +
|?process
 +
|?first launched
 +
|?core count
 +
|?thread count
 +
|?tdp
 +
|?base frequency
 +
|?turbo frequency (1 core)
 +
|?l1$ size#KiB
 +
|?l2$ size
 +
|?supported memory type
 +
|?max memory#GiB
 +
|?max hsio lanes
 +
|?Has subobject.max pcie lanes
 +
|?max usb ports
 +
|?max sata ports
 +
|?has ecc memory support
 +
|?has intel turbo boost technology 2 0
 +
|?has integrated intel quickassist technology
 +
|format=template
 +
|template=proc table 3
 +
|userparam=22:20
 +
|mainlabel=-
 +
|valuesep=,
 +
}}
 +
<tr class="comptable-header comptable-header-sep"><th>&nbsp;</th><th colspan="20">Internet of Things and eTEMP SKUs</th></tr>
 +
{{#ask: [[Category:microprocessor models by intel]] [[core name::Denverton]] [[part of::Internet of Things and eTEMP SKUs]]
 +
|?full page name
 +
|?model number
 +
|?release price
 +
|?microprocessor family
 +
|?process
 +
|?first launched
 +
|?core count
 +
|?thread count
 +
|?tdp
 +
|?base frequency
 +
|?turbo frequency (1 core)
 +
|?l1$ size#KiB
 +
|?l2$ size
 +
|?supported memory type
 +
|?max memory#GiB
 +
|?max hsio lanes
 +
|?Has subobject.max pcie lanes
 +
|?max usb ports
 +
|?max sata ports
 +
|?has ecc memory support
 +
|?has intel turbo boost technology 2 0
 +
|?has integrated intel quickassist technology
 +
|format=template
 +
|template=proc table 3
 +
|userparam=22:20
 +
|mainlabel=-
 +
|valuesep=,
 +
}}
 +
{{comp table count|col=20|ask=[[Category:microprocessor models by intel]][[core name::Denverton]]}}
 
</table>
 
</table>
 
{{comp table end}}
 
{{comp table end}}

Latest revision as of 08:32, 16 July 2019

Intel Atom
intel atom (2015).png
Intel Atom (2015 logo)
Developer Intel
Manufacturer Intel
Type system on chips, microprocessors
Introduction March 2, 2008 (announced)
April 2, 2008 (launch)
ISA IA-32, x86-64
µarch Bonnell
Word size 32
32 bit
4 octets
8 nibbles
, 64
64 bit
8 octets
16 nibbles
Process 45 nm
0.045 μm
4.5e-5 mm
, 32 nm
0.032 μm
3.2e-5 mm
, 22 nm
0.022 μm
2.2e-5 mm
, 14 nm
0.014 μm
1.4e-5 mm
Technology CMOS
Clock 500 MHz-2400 MHz
Package FCBGA-437, PBGA-441
Socket BGA

Atom is an family of ultra-low-voltage 32 and 64-bit microprocessors and system on chips designed by Intel since 2008.

Models[edit]

Bonnell[edit]

Main article: Bonnell Microarchitecture

Bonnell was the first microarchitecture designed specifically for the ultra-low power microprocessor market. Introduced in 2008, it featured fully x86-compatible cores with a TDP of only 500 mW to 2 W, less than any other x86 processor available at the time. Bonnell's low-power came from its simplicity, being an in-order dual-issue pipelined CPU. All Bonnell-based processors were manufactured on Intel's 45 nm process.

Silverthorne (MIDs, 1st Gen)[edit]

intel atom logo (2008-2009).png
See also: Silverthorne Core

The first series of Bonnell processors were introduced during the 2008 Intel Developer Forum (IDF) in Shanghai, China. Those 32-bit processors were based on the Silverthorne core which were designed for the Mobile Internet Devices (MID) market. Silverthorne processors have 56 KiB of L1$ and 512 KiB of L2. Silverthorne has support for the traditional AGTL+-based FSB as well as a new low power CMOS FSB specifically introduced to reduce power.

Silverthorne chips consist of 47 million transistors on a 24.2 mm² die. All processors are a single core. Additionally all models support every x86 extension up to SSSE3 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3). The original series of chips that were introduced in 2008 featured a tiny FCBGA-437 package measuring just 13 mm x 14 mm. Intel introduced a set of new models in a much bigger 22x22 mm² FCBGA-441 package. Models ending in P use those large packages. A couple of models (those ending with 'T') also support industrial temperature ranges.

Silverthorne chips have an incredibly simple design featuring only the CPU itself on-die. The southbridge and northbridge are integrated on a secondary Poulsbo chipset which features the memory controller, an integrated graphics, and the various I/O ports.

 List of Silverthorne-based Atom Processors
 Main processorBusFeatures
ModelPriceProcessLaunchedCTFreqTDPSDPSpeedRatePackageHTVT-x
Z500$ 45.00
€ 40.50
£ 36.45
¥ 4,649.85
45 nm
0.045 μm
4.5e-5 mm
2 April 2008120.8 GHz
800 MHz
800,000 kHz
650 mW
0.65 W
8.7165e-4 hp
6.5e-4 kW
960 mW
0.96 W
0.00129 hp
9.6e-4 kW
100 MHz
0.1 GHz
100,000 kHz
400 MT/s
0.4 GT/s
400,000 kT/s
FCBGA-441
Z510$ 45.00
€ 40.50
£ 36.45
¥ 4,649.85
45 nm
0.045 μm
4.5e-5 mm
2 April 2008111.1 GHz
1,100 MHz
1,100,000 kHz
2,000 mW
2 W
0.00268 hp
0.002 kW
960 mW
0.96 W
0.00129 hp
9.6e-4 kW
100 MHz
0.1 GHz
100,000 kHz
400 MT/s
0.4 GT/s
400,000 kT/s
FCBGA-441
Z510P45 nm
0.045 μm
4.5e-5 mm
2 March 2009121.1 GHz
1,100 MHz
1,100,000 kHz
2,000 mW
2 W
0.00268 hp
0.002 kW
100 MHz
0.1 GHz
100,000 kHz
400 MT/s
0.4 GT/s
400,000 kT/s
FCBGA-437
Z510PT45 nm
0.045 μm
4.5e-5 mm
2 March 2009121.1 GHz
1,100 MHz
1,100,000 kHz
2,000 mW
2 W
0.00268 hp
0.002 kW
100 MHz
0.1 GHz
100,000 kHz
400 MT/s
0.4 GT/s
400,000 kT/s
FCBGA-437
Z51545 nm
0.045 μm
4.5e-5 mm
8 April 2009121.2 GHz
1,200 MHz
1,200,000 kHz
650 mW
0.65 W
8.7165e-4 hp
6.5e-4 kW
100 MHz
0.1 GHz
100,000 kHz
400 MT/s
0.4 GT/s
400,000 kT/s
FCBGA-441
Z520$ 65.00
€ 58.50
£ 52.65
¥ 6,716.45
45 nm
0.045 μm
4.5e-5 mm
2 April 2008121.333 GHz
1,333.33 MHz
1,333,330 kHz
2,000 mW
2 W
0.00268 hp
0.002 kW
960 mW
0.96 W
0.00129 hp
9.6e-4 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-441
Z520PT45 nm
0.045 μm
4.5e-5 mm
2 March 2009121.333 GHz
1,333.33 MHz
1,333,330 kHz
2,000 mW
2 W
0.00268 hp
0.002 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-437
Z530$ 95.00
€ 85.50
£ 76.95
¥ 9,816.35
45 nm
0.045 μm
4.5e-5 mm
2 April 2008121.6 GHz
1,599.99 MHz
1,599,990 kHz
2,200 mW
2.2 W
0.00295 hp
0.0022 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-441
Z530P45 nm
0.045 μm
4.5e-5 mm
2 March 2009121.6 GHz
1,599.99 MHz
1,599,990 kHz
2,000 mW
2 W
0.00268 hp
0.002 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-437
Z540$ 160.00
€ 144.00
£ 129.60
¥ 16,532.80
45 nm
0.045 μm
4.5e-5 mm
2 April 2008121.867 GHz
1,866.66 MHz
1,866,660 kHz
2,400 mW
2.4 W
0.00322 hp
0.0024 kW
960 mW
0.96 W
0.00129 hp
9.6e-4 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-441
Z55045 nm
0.045 μm
4.5e-5 mm
8 April 2009122 GHz
1,999.99 MHz
1,999,990 kHz
2,400 mW
2.4 W
0.00322 hp
0.0024 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-441
Z56045 nm
0.045 μm
4.5e-5 mm
June 2010122.133 GHz
2,133.33 MHz
2,133,330 kHz
2,500 mW
2.5 W
0.00335 hp
0.0025 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-441
Count: 12

Lincroft (MIDs, 2nd Gen)[edit]

See also: Lincroft Core

Lincroft is the second generation Bonnell-based models, a successor to Silverthorne. Lincroft is drastically different to Silverthorne. It's a complete system on a chip solution, incorporating most of the functionality of the chipset on-die, including the memory controller, display controller, and integrated graphics. Lincroft, along with the Moorestown, models were introduced on May 4, 2010.

Lincroft SoCs where also fabricated on a 45 nm process but incorporate a large part of the southbridge. For those reasons the die is considerably larger, 65.25 mm² incorporating 140,000,000 transistors. As with Silverthorne, all models support every x86 extension up to SSSE3 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3). Lincroft integrates the same Imagination Technologies PowerVR SGX 535 IGP as Silverthorne but operating at double the frequency. Lincroft chips are packaged in an FCBGA-518.

In mid-2011 Intel introduce a number of new chips, as part of the Oak Trail platform, utilizing the SM35 Express chipset.

 List of Lincroft-based Atom Processors
 Main processorMemoryIGPFeatures
ModelFamilyPriceProcessLaunchedCTFreqBurstTDPTypeMemNameFrequencyPackageHTBurst
Z600Atom45 nm
0.045 μm
4.5e-5 mm
4 May 201012800 MHz
0.8 GHz
800,000 kHz
1.2 GHz
1,200 MHz
1,200,000 kHz
1,300 mW
1.3 W
0.00174 hp
0.0013 kW
DDR-4001 GiB
1,024 MiB
1,048,576 KiB
1,073,741,824 B
9.765625e-4 TiB
PowerVR SGX535200 MHz
0.2 GHz
200,000 KHz
FCBGA-518
Z605Atom45 nm
0.045 μm
4.5e-5 mm
4 May 2010121,000 MHz
1 GHz
1,000,000 kHz
2,200 mW
2.2 W
0.00295 hp
0.0022 kW
DDR-400 DDR2-8002 GiB
2,048 MiB
2,097,152 KiB
2,147,483,648 B
0.00195 TiB
PowerVR SGX535400 MHz
0.4 GHz
400,000 KHz
FCBGA-518
Z610Atom45 nm
0.045 μm
4.5e-5 mm
4 May 201012800 MHz
0.8 GHz
800,000 kHz
1.2 GHz
1,200 MHz
1,200,000 kHz
1,300 mW
1.3 W
0.00174 hp
0.0013 kW
DDR-400 DDR2-8002 GiB
2,048 MiB
2,097,152 KiB
2,147,483,648 B
0.00195 TiB
PowerVR SGX535400 MHz
0.4 GHz
400,000 KHz
FCBGA-518
Z612Atom45 nm
0.045 μm
4.5e-5 mm
4 May 201012900 MHz
0.9 GHz
900,000 kHz
1.5 GHz
1,500 MHz
1,500,000 kHz
1,300 mW
1.3 W
0.00174 hp
0.0013 kW
DDR-400 DDR2-8002 GiB
2,048 MiB
2,097,152 KiB
2,147,483,648 B
0.00195 TiB
PowerVR SGX535400 MHz
0.4 GHz
400,000 KHz
FCBGA-518
Z615Atom45 nm
0.045 μm
4.5e-5 mm
4 May 2010121,200 MHz
1.2 GHz
1,200,000 kHz
1.6 GHz
1,600 MHz
1,600,000 kHz
2,200 mW
2.2 W
0.00295 hp
0.0022 kW
DDR-400 DDR2-8002 GiB
2,048 MiB
2,097,152 KiB
2,147,483,648 B
0.00195 TiB
PowerVR SGX535400 MHz
0.4 GHz
400,000 KHz
FCBGA-518
Z620Atom45 nm
0.045 μm
4.5e-5 mm
4 May 201012900 MHz
0.9 GHz
900,000 kHz
1.6 GHz
1,600 MHz
1,600,000 kHz
1,300 mW
1.3 W
0.00174 hp
0.0013 kW
DDR-400 DDR2-8002 GiB
2,048 MiB
2,097,152 KiB
2,147,483,648 B
0.00195 TiB
PowerVR SGX535400 MHz
0.4 GHz
400,000 KHz
FCBGA-518
Z625Atom45 nm
0.045 μm
4.5e-5 mm
4 May 2010121,500 MHz
1.5 GHz
1,500,000 kHz
1.9 GHz
1,900 MHz
1,900,000 kHz
2,200 mW
2.2 W
0.00295 hp
0.0022 kW
DDR-400 DDR2-8002 GiB
2,048 MiB
2,097,152 KiB
2,147,483,648 B
0.00195 TiB
PowerVR SGX535400 MHz
0.4 GHz
400,000 KHz
FCBGA-518
Z650Atom45 nm
0.045 μm
4.5e-5 mm
11 April 2011121,200 MHz
1.2 GHz
1,200,000 kHz
3,000 mW
3 W
0.00402 hp
0.003 kW
DDR-400 DDR2-8002 GiB
2,048 MiB
2,097,152 KiB
2,147,483,648 B
0.00195 TiB
PowerVR SGX535400 MHz
0.4 GHz
400,000 KHz
FCBGA-518
Z670Atom$ 75.00
€ 67.50
£ 60.75
¥ 7,749.75
45 nm
0.045 μm
4.5e-5 mm
11 April 2011121,500 MHz
1.5 GHz
1,500,000 kHz
3,000 mW
3 W
0.00402 hp
0.003 kW
DDR-400 DDR2-8002 GiB
2,048 MiB
2,097,152 KiB
2,147,483,648 B
0.00195 TiB
PowerVR SGX535400 MHz
0.4 GHz
400,000 KHz
FCBGA-518
Count: 9

Diamondville (Nettops)[edit]

See also: Diamondville Core

Diamondville-based processors were introduced in mid-2008. Those single-core chips were designed for more complex devices such as light-weight notebooks and various nettops. One dual-core model was also introduced which featured two identical Diamondville in a single package. Diamondville processors have 56 KiB of L1$ and 512 KiB of L2 (twice as much for the dual-core variant).

Diamondville chips consist of 47 million transistors on a 25.96 mm² die. All processors are a single core (except for the 330 which features two 230 dies). Additionally all models support every x86 extension up to SSSE3 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3). These chips utilize the bigger 22x22 mm² FCBGA-441 package.

As with the Silverthorne chips, Diamondville models only incorporate the CPU therefore they must make use of the Calistoga chipset for the memory controller, integrated graphics, and I/O functionality.

 List of Diamondville-based Atom Processors
 Main processorBusFeatures
ModelFamilyPriceProcessLaunchedCTFreqTDPSpeedRatePackageISAEISTHT
230Atom$ 29.00
€ 26.10
£ 23.49
¥ 2,996.57
45 nm
0.045 μm
4.5e-5 mm
3 June 2008121.6 GHz
1,599.99 MHz
1,599,990 kHz
4 W
4,000 mW
0.00536 hp
0.004 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-437x86-64
330Atom$ 43.00
€ 38.70
£ 34.83
¥ 4,443.19
45 nm
0.045 μm
4.5e-5 mm
21 September 2008241.6 GHz
1,599.99 MHz
1,599,990 kHz
8 W
8,000 mW
0.0107 hp
0.008 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-437x86-64
N270Atom$ 44.00
€ 39.60
£ 35.64
¥ 4,546.52
45 nm
0.045 μm
4.5e-5 mm
3 June 2008121.6 GHz
1,599.99 MHz
1,599,990 kHz
2.5 W
2,500 mW
0.00335 hp
0.0025 kW
133.33 MHz
0.133 GHz
133,330 kHz
533.33 MT/s
0.533 GT/s
533,330 kT/s
FCBGA-437x86-32
N280Atom45 nm
0.045 μm
4.5e-5 mm
7 February 2009121.667 GHz
1,666.66 MHz
1,666,660 kHz
2.5 W
2,500 mW
0.00335 hp
0.0025 kW
166.66 MHz
0.167 GHz
166,660 kHz
666.66 MT/s
0.667 GT/s
666,660 kT/s
FCBGA-437x86-32
Count: 4

Silvermont[edit]

Main article: Silvermont Microarchitecture

Introduced in 2013, Silvermont-based processors are manufactured on a 22 nm process and introduced OoOE to the Atom line of cores.

Goldmont[edit]

Main article: Goldmont Microarchitecture

Introduced in late 2016, Goldmont-based processors which are manufactured on a 14 nm process and provider considerable improvement in performance, power, and capabilities over its predecessors. Goldmont also doubled the highest count of integrated ultra-low power cores.

Denverton (Servers)[edit]

atom c3000.png
See also: Denverton Core

Denverton-based chips are a complete system on a chip for dense ultra-low power servers, network devices, storage, and internet of things (IoT). Manufactured on a 14 nm process, those chips over up to double the cores as the previous generation as well as higher integration and more I/O capabilities. Models support up to dual-channel DDR4 ECC memory and either 128 GiB or 256 GiB of memory. All models support everything up to SSE4.2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES) as well as VT-x, VT-d, EPT, and Secure Boot. Models vary from 2 cores up to 16 cores and without Hyper-Threading support. Those SoCs come with 6 to 20 High-Speed Input/Output (HSIO) lanes which are highly configurable lanes that allow their intended purpose (e.g., SATA, PCIe, USB) to be setup by the user in the BIOS. The exact amount of each that can be allocated is model-dependent. Additionally, each model have two to four dedicated integrated Ethernet adapters supporting up 10 GbE. Depending on the exact model, some also have integrated QuickAssist Technology which offers the ability to off-load cryptography and compression tasks to a separate dedicated engine on-die.

 List of Denverton Processors
 Main processorCacheMemoryConfigurable I/OFeature Diff
ModelPriceFamilyProcessLaunchedCoresThreadsTDPFrequencyTurboL1L2Memory TypeMax MemHS I/OPCIeUSBSATAECCTBTQAT
 Server and Cloud Storage SKUs
C3750$ 171.00
€ 153.90
£ 138.51
¥ 17,669.43
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 20178821 W
21,000 mW
0.0282 hp
0.021 kW
2,200 MHz
2.2 GHz
2,200,000 kHz
2,400 MHz
2.4 GHz
2,400,000 kHz
448 KiB
458,752 B
0.438 MiB
16 MiB
16,384 KiB
16,777,216 B
0.0156 GiB
DDR3L-1600, DDR4-2133256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
128
C3830$ 289.00
€ 260.10
£ 234.09
¥ 29,862.37
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 2017121221 W
21,000 mW
0.0282 hp
0.021 kW
1,900 MHz
1.9 GHz
1,900,000 kHz
2,300 MHz
2.3 GHz
2,300,000 kHz
672 KiB
688,128 B
0.656 MiB
12 MiB
12,288 KiB
12,582,912 B
0.0117 GiB
DDR3L-1600, DDR4-2133256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
128
C3850$ 323.00
€ 290.70
£ 261.63
¥ 33,375.59
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 2017121225 W
25,000 mW
0.0335 hp
0.025 kW
2,100 MHz
2.1 GHz
2,100,000 kHz
2,400 MHz
2.4 GHz
2,400,000 kHz
672 KiB
688,128 B
0.656 MiB
12 MiB
12,288 KiB
12,582,912 B
0.0117 GiB
DDR3L-1600, DDR4-2133256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
208
C3950$ 389.00
€ 350.10
£ 315.09
¥ 40,195.37
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 2017161624 W
24,000 mW
0.0322 hp
0.024 kW
1,700 MHz
1.7 GHz
1,700,000 kHz
2,200 MHz
2.2 GHz
2,200,000 kHz
896 KiB
917,504 B
0.875 MiB
16 MiB
16,384 KiB
16,777,216 B
0.0156 GiB
DDR3L-1600, DDR4-2400256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
208
C3955$ 434.00
€ 390.60
£ 351.54
¥ 44,845.22
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 2017161632 W
32,000 mW
0.0429 hp
0.032 kW
2,100 MHz
2.1 GHz
2,100,000 kHz
2,400 MHz
2.4 GHz
2,400,000 kHz
896 KiB
917,504 B
0.875 MiB
16 MiB
16,384 KiB
16,777,216 B
0.0156 GiB
DDR3L-1600, DDR4-2400256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
208
 Network and Enterprise Storage SKUs
C3338$ 27.00
€ 24.30
£ 21.87
¥ 2,789.91
Atom14 nm
0.014 μm
1.4e-5 mm
22 February 2017229 W
9,000 mW
0.0121 hp
0.009 kW
1,500 MHz
1.5 GHz
1,500,000 kHz
2,200 MHz
2.2 GHz
2,200,000 kHz
112 KiB
114,688 B
0.109 MiB
4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
DDR3L-1600, DDR4-1866128 GiB
131,072 MiB
134,217,728 KiB
137,438,953,472 B
0.125 TiB
10810
C3538$ 75.00
€ 67.50
£ 60.75
¥ 7,749.75
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 20174415 W
15,000 mW
0.0201 hp
0.015 kW
2,100 MHz
2.1 GHz
2,100,000 kHz
224 KiB
229,376 B
0.219 MiB
8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
DDR3L-1600, DDR4-2133256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
12812
C3558$ 86.00
€ 77.40
£ 69.66
¥ 8,886.38
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 20174416 W
16,000 mW
0.0215 hp
0.016 kW
2,200 MHz
2.2 GHz
2,200,000 kHz
224 KiB
229,376 B
0.219 MiB
8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
DDR3L-1600, DDR4-1866256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
12812
C3758$ 193.00
€ 173.70
£ 156.33
¥ 19,942.69
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 20178825 W
25,000 mW
0.0335 hp
0.025 kW
2,200 MHz
2.2 GHz
2,200,000 kHz
448 KiB
458,752 B
0.438 MiB
16 MiB
16,384 KiB
16,777,216 B
0.0156 GiB
DDR3L-1600, DDR4-2400256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
20816
C3858$ 332.00
€ 298.80
£ 268.92
¥ 34,305.56
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 2017121225 W
25,000 mW
0.0335 hp
0.025 kW
2,000 MHz
2 GHz
2,000,000 kHz
672 KiB
688,128 B
0.656 MiB
12 MiB
12,288 KiB
12,582,912 B
0.0117 GiB
DDR3L-1600, DDR4-2400256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
20816
C3958$ 449.00
€ 404.10
£ 363.69
¥ 46,395.17
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 2017161631 W
31,000 mW
0.0416 hp
0.031 kW
2,000 MHz
2 GHz
2,000,000 kHz
896 KiB
917,504 B
0.875 MiB
16 MiB
16,384 KiB
16,777,216 B
0.0156 GiB
DDR3L-1600, DDR4-2400256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
20816
 Internet of Things and eTEMP SKUs
C3308$ 32.00
€ 28.80
£ 25.92
¥ 3,306.56
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 2017229.5 W
9,500 mW
0.0127 hp
0.0095 kW
1,600 MHz
1.6 GHz
1,600,000 kHz
2,100 MHz
2.1 GHz
2,100,000 kHz
112 KiB
114,688 B
0.109 MiB
4 MiB
4,096 KiB
4,194,304 B
0.00391 GiB
DDR3L-1600, DDR4-1866128 GiB
131,072 MiB
134,217,728 KiB
137,438,953,472 B
0.125 TiB
686
C3508Atom14 nm
0.014 μm
1.4e-5 mm
15 August 20174411.25 W
11,250 mW
0.0151 hp
0.0113 kW
1,600 MHz
1.6 GHz
1,600,000 kHz
224 KiB
229,376 B
0.219 MiB
8 MiB
8,192 KiB
8,388,608 B
0.00781 GiB
DDR3L-1600, DDR4-1866256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
888
C3708$ 209.00
€ 188.10
£ 169.29
¥ 21,595.97
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 20178817 W
17,000 mW
0.0228 hp
0.017 kW
1,700 MHz
1.7 GHz
1,700,000 kHz
448 KiB
458,752 B
0.438 MiB
16 MiB
16,384 KiB
16,777,216 B
0.0156 GiB
DDR3L-1600, DDR4-2133256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
20816
C3808$ 369.00
€ 332.10
£ 298.89
¥ 38,128.77
Atom14 nm
0.014 μm
1.4e-5 mm
15 August 2017121225 W
25,000 mW
0.0335 hp
0.025 kW
2,000 MHz
2 GHz
2,000,000 kHz
672 KiB
688,128 B
0.656 MiB
12 MiB
12,288 KiB
12,582,912 B
0.0117 GiB
DDR3L-1600, DDR4-2133256 GiB
262,144 MiB
268,435,456 KiB
274,877,906,944 B
0.25 TiB
20816
Count: 15


SoCs[edit]

Microarchitectures[edit]

T/T Process µarch Intro Date Cores
Tick 45 nm Bonnell 2008 Silverthorne, Diamondville
Tock 2010 Lincroft, Pineview, Tunnel Creek, Stellarton, Sodaville, Groveland
Tick 32 nm Saltwell 2011 Clover Trail, Cedar Trail
Tick 22 nm Silvermont 2013 Bay Trail
Tock 14 nm Airmont 2015 Cherry Trail, Braswell
Tick Goldmont 2016
Facts about "Atom - Intel"
designerIntel +
first announcedMarch 2, 2008 +
first launchedApril 2, 2008 +
full page nameintel/atom +
instance ofsystem on a chip family + and microprocessor family +
instruction set architectureIA-32 + and x86-64 +
main designerIntel +
manufacturerIntel +
microarchitectureBonnell +
nameIntel Atom +
packageFCBGA-437 + and PBGA-441 +
process45 nm (0.045 μm, 4.5e-5 mm) +, 32 nm (0.032 μm, 3.2e-5 mm) +, 22 nm (0.022 μm, 2.2e-5 mm) + and 14 nm (0.014 μm, 1.4e-5 mm) +
socketBGA +
technologyCMOS +
word size32 bit (4 octets, 8 nibbles) + and 64 bit (8 octets, 16 nibbles) +