| Edit Values | |||||||||
| Atom Z670 | |||||||||
| General Info | |||||||||
| Designer | Intel | ||||||||
| Manufacturer | Intel | ||||||||
| Model Number | Z670 | ||||||||
| Part Number | AY80609007293AA | ||||||||
| S-Spec | SLC2P | ||||||||
| Market | Mobile | ||||||||
| Introduction | April 11, 2011 (announced) April 11, 2011 (launched) | ||||||||
| End-of-life | May 31, 2013 (last order) November 08, 2013 (last shipment) | ||||||||
| Release Price | $75 | ||||||||
| Shop | Amazon | ||||||||
| General Specs | |||||||||
| Family | Atom | ||||||||
| Series | Z650 | ||||||||
| Locked | Yes | ||||||||
| Frequency | 1,500 MHz | ||||||||
| Bus type | cDMI | ||||||||
| Bus speed | 100 MHz | ||||||||
| Bus rate | 400 MT/s | ||||||||
| Clock multiplier | 8 | ||||||||
| CPUID | 20661 | ||||||||
| Microarchitecture | |||||||||
| ISA | x86-32 (x86) | ||||||||
| Microarchitecture | Bonnell | ||||||||
| Platform | Oak Trail | ||||||||
| Chipset | Langwell | ||||||||
| Core Name | Lincroft | ||||||||
| Core Family | 6 | ||||||||
| Core Model | 38 | ||||||||
| Core Stepping | 1 | ||||||||
| Process | 45 nm | ||||||||
| Technology | CMOS | ||||||||
| Word Size | 32 bit | ||||||||
| Cores | 1 | ||||||||
| Threads | 2 | ||||||||
| Max Memory | 2 GiB | ||||||||
| Multiprocessing | |||||||||
| Max SMP | 1-Way (Uniprocessor) | ||||||||
| Electrical | |||||||||
| Vcore | 0.7 V-1.15 V | ||||||||
| TDP | 3 W | ||||||||
| Tjunction | 0 °C – 90 °C | ||||||||
| Tcase | 0 °C – 70 °C | ||||||||
| Tstorage | -55 °C – 125 °C | ||||||||
| Packaging | |||||||||
| |||||||||
Atom Z670 is an ultra-low power 32-bit x86 system on a chip designed by Intel and introduced in mid-2011. The Z670, which is based on the Bonnell microarchitecture (Lincroft core), is fabricated on a 45 nm process. This SoC incorporates a single core operating at 1.5 GHz with a low frequency mode of 600 MHz. The chip has a TDP of 3 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z670 incorporates a GMA 600 IGP operating at 400 MHz.
This chip communicates with the southbridge chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 200 MHz for a 800 MT/s effective rate. This model uses a AGTL+ signaling bus for this.
Contents
Cache[edit]
- Main article: Bonnell § Cache
|
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
|||||||||||||||||||||||||
|
|||||||||||||||||||||||||
Memory controller[edit]
|
Integrated Memory Controller
|
||||||||||||||||||
|
||||||||||||||||||
Expansions[edit]
|
Expansion Options
|
||||||||||
|
||||||||||
Graphics[edit]
This chip incroporates the "GMA 600" integrated graphics which is actually a re-branded licensed Imagination PowerVR SGX 535 IGP.
|
Integrated Graphics Information
|
|||||||||||||||||||||||||||||||||||||||||||||||||||
|
|||||||||||||||||||||||||||||||||||||||||||||||||||
- Supports hardware-accelerated HD video decode (MPEG4 part 2, H.264, WMV, and VC1)
- Supports hardware-accelerated HD video encode (MPEG4 part 2 and H.264)
Features[edit]
[Edit/Modify Supported Features]
|
Supported x86 Extensions & Processor Features
|
||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||
Die Shot[edit]
- See also: Bonnell § Lincroft Die
Documents[edit]
Datasheet[edit]
- Atom Z670 Datasheet, April 2011
- Atom Z670 Specs Update, July 2014
Manuals[edit]
| Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | Atom Z670 - Intel#package + |
| base frequency | 1,500 MHz (1.5 GHz, 1,500,000 kHz) + |
| bus rate | 400 MT/s (0.4 GT/s, 400,000 kT/s) + |
| bus speed | 100 MHz (0.1 GHz, 100,000 kHz) + |
| bus type | cDMI + |
| chipset | Langwell + |
| clock multiplier | 8 + |
| core count | 1 + |
| core family | 6 + |
| core model | 38 + |
| core name | Lincroft + |
| core stepping | 1 + |
| core voltage (max) | 1.15 V (11.5 dV, 115 cV, 1,150 mV) + |
| core voltage (min) | 0.7 V (7 dV, 70 cV, 700 mV) + |
| cpuid | 20661 + |
| designer | Intel + |
| family | Atom + |
| first announced | April 11, 2011 + |
| first launched | April 11, 2011 + |
| full page name | intel/atom/z670 + |
| has ecc memory support | false + |
| has feature | Hyper-Threading Technology + and Enhanced SpeedStep Technology + |
| has intel enhanced speedstep technology | true + |
| has locked clock multiplier | true + |
| has simultaneous multithreading | true + |
| instance of | microprocessor + |
| integrated gpu | PowerVR SGX535 + |
| integrated gpu base frequency | 400 MHz (0.4 GHz, 400,000 KHz) + |
| integrated gpu designer | Imagination Technologies + |
| integrated gpu max memory | 256 MiB (262,144 KiB, 268,435,456 B, 0.25 GiB) + |
| isa | x86-32 + |
| isa family | x86 + |
| l1$ size | 56 KiB (57,344 B, 0.0547 MiB) + |
| l1d$ description | 6-way set associative + |
| l1d$ size | 24 KiB (24,576 B, 0.0234 MiB) + |
| l1i$ description | 8-way set associative + |
| l1i$ size | 32 KiB (32,768 B, 0.0313 MiB) + |
| l2$ description | 8-way set associative + |
| l2$ size | 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) + |
| last order | May 31, 2013 + |
| last shipment | November 8, 2013 + |
| ldate | April 11, 2011 + |
| main image | |
| manufacturer | Intel + |
| market segment | Mobile + |
| max case temperature | 343.15 K (70 °C, 158 °F, 617.67 °R) + |
| max cpu count | 1 + |
| max junction temperature | 363.15 K (90 °C, 194 °F, 653.67 °R) + |
| max memory | 2,048 MiB (2,097,152 KiB, 2,147,483,648 B, 2 GiB, 0.00195 TiB) + |
| max memory bandwidth | 2.98 GiB/s (3,051.52 MiB/s, 3.2 GB/s, 3,199.751 MB/s, 0.00291 TiB/s, 0.0032 TB/s) + |
| max memory channels | 1 + |
| max storage temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
| microarchitecture | Bonnell + |
| min case temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
| min junction temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
| min storage temperature | 218.15 K (-55 °C, -67 °F, 392.67 °R) + |
| model number | Z670 + |
| name | Atom Z670 + |
| package | FCBGA-518 + |
| part number | AY80609007293AA + |
| platform | Oak Trail + |
| process | 45 nm (0.045 μm, 4.5e-5 mm) + |
| release price | $ 75.00 (€ 67.50, £ 60.75, ¥ 7,749.75) + |
| s-spec | SLC2P + |
| series | Z650 + |
| smp max ways | 1 + |
| socket | BGA-518 + |
| supported memory type | DDR-400 + and DDR2-800 + |
| tdp | 3 W (3,000 mW, 0.00402 hp, 0.003 kW) + |
| technology | CMOS + |
| thread count | 2 + |
| word size | 32 bit (4 octets, 8 nibbles) + |
