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Atom Z670 - Intel
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Atom Z670
lincroft chips.png
General Info
DesignerIntel
ManufacturerIntel
Model NumberZ670
Part NumberAY80609007293AA
S-SpecSLC2P
MarketMobile
IntroductionApril 11, 2011 (announced)
April 11, 2011 (launched)
End-of-lifeMay 31, 2013 (last order)
November 08, 2013 (last shipment)
Release Price$75
General Specs
FamilyAtom
SeriesZ650
LockedYes
Frequency1,500 MHz
Bus typecDMI
Bus speed100 MHz
Bus rate400 MT/s
Clock multiplier8
CPUID20661
Microarchitecture
ISAx86-32 (x86)
MicroarchitectureBonnell
PlatformOak Trail
ChipsetLangwell
Core NameLincroft
Core Family6
Core Model38
Core Stepping1
Process45 nm
TechnologyCMOS
Word Size32 bit
Cores1
Threads2
Max CPUs1 (Uniprocessor)
Max Memory2 GiB
Electrical
Vcore0.7 V-1.15 V
TDP3 W
Tjunction0 °C – 90 °C
Tcase0 °C – 70 °C
Tstorage-55 °C – 125 °C
Packaging
PackageFCBGA-518 (FCBGA)
Dimension13.8 mm x 13.8 mm x 1.1 mm
Pin Count518
SocketBGA-518 (BGA)

Atom Z670 is an ultra-low power 32-bit x86 system on a chip designed by Intel and introduced in mid-2011. The Z670, which is based on the Bonnell microarchitecture (Lincroft core), is fabricated on a 45 nm process. This SoC incorporates a single core operating at 1.5 GHz with a low frequency mode of 600 MHz. The chip has a TDP of 3 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z670 incorporates a GMA 600 IGP operating at 400 MHz.

This chip communicates with the southbridge chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 200 MHz for a 800 MT/s effective rate. This model uses a AGTL+ signaling bus for this.

Cache[edit]

Main article: Bonnell § Cache

[Edit/Modify Cache Info]

hierarchy icon.svg
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory.

The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC.

Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies.

Note: All units are in kibibytes and mebibytes.
L1$56 KiB
0.0547 MiB
57,344 B
5.340576e-5 GiB
L1I$32 KiB
0.0313 MiB
32,768 B
3.051758e-5 GiB
1x32 KiB8-way set associative 
L1D$24 KiB
0.0234 MiB
24,576 B
2.288818e-5 GiB
1x24 KiB6-way set associativewrite-back

L2$512 KiB
0.5 MiB
524,288 B
4.882812e-4 GiB
  1x512 KiB8-way set associative 

Memory controller[edit]

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeDDR-400, DDR2-800
Supports ECCNo
Max Mem2 GiB
Controllers1
Channels1
Width32 bit
Max Bandwidth2.98 GiB/s
Bandwidth
Single 2.98 GiB/s
Physical Address (PAE)32 bit

Expansions[edit]

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0
Ports4
UART

GP I/OYes

Graphics[edit]

This chip incroporates the "GMA 600" integrated graphics which is actually a re-branded licensed Imagination PowerVR SGX 535 IGP.

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR SGX535
DesignerImagination Technologies
Max Displays1
Max Memory256 MiB
262,144 KiB
268,435,456 B
0.25 GiB
Frequency400 MHz
0.4 GHz
400,000 KHz
OutputLVDS

Max Resolution
LVDS1366x768

Standards
Direct3D9.0c
OpenGL2.1
OpenGL ES1.1, 2.0
OpenVG1.1

Additional Features
Intel Clear Video
  • Supports hardware-accelerated HD video decode (MPEG4 part 2, H.264, WMV, and VC1)
  • Supports hardware-accelerated HD video encode (MPEG4 part 2 and H.264)

Features[edit]

[Edit/Modify Supported Features]

Cog-icon-grey.svg
Supported x86 Extensions & Processor Features
MMXMMX Extension
EMMXExtended MMX Extension
SSEStreaming SIMD Extensions
SSE2Streaming SIMD Extensions 2
SSE3Streaming SIMD Extensions 3
SSSE3Supplemental SSE3
x86-1616-bit x86
x86-3232-bit x86
x86-6464-bit x86
RealReal Mode
ProtectedProtected Mode
SMMSystem Management Mode
FPUIntegrated x87 FPU
NXNo-eXecute
HTHyper-Threading
EISTEnhanced SpeedStep Technology

Die Shot[edit]

See also: Bonnell § Lincroft Die

lincroft oak trail die shot.png

Documents[edit]

Datasheet[edit]

Manuals[edit]

Facts about "Atom Z670 - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Atom Z670 - Intel#package +
base frequency1,500 MHz (1.5 GHz, 1,500,000 kHz) +
bus rate400 MT/s (0.4 GT/s, 400,000 kT/s) +
bus speed100 MHz (0.1 GHz, 100,000 kHz) +
bus typecDMI +
chipsetLangwell +
clock multiplier8 +
core count1 +
core family6 +
core model38 +
core nameLincroft +
core stepping1 +
core voltage (max)1.15 V (11.5 dV, 115 cV, 1,150 mV) +
core voltage (min)0.7 V (7 dV, 70 cV, 700 mV) +
cpuid20661 +
designerIntel +
familyAtom +
first announcedApril 11, 2011 +
first launchedApril 11, 2011 +
full page nameintel/atom/z670 +
has ecc memory supportfalse +
has featureHyper-Threading Technology + and Enhanced SpeedStep Technology +
has intel enhanced speedstep technologytrue +
has locked clock multipliertrue +
has simultaneous multithreadingtrue +
instance ofmicroprocessor +
integrated gpuPowerVR SGX535 +
integrated gpu base frequency400 MHz (0.4 GHz, 400,000 KHz) +
integrated gpu designerImagination Technologies +
integrated gpu max memory256 MiB (262,144 KiB, 268,435,456 B, 0.25 GiB) +
isax86-32 +
isa familyx86 +
l1$ size0.0547 MiB (56 KiB, 57,344 B, 5.340576e-5 GiB) +
l1d$ description6-way set associative +
l1d$ size0.0234 MiB (24 KiB, 24,576 B, 2.288818e-5 GiB) +
l1i$ description8-way set associative +
l1i$ size0.0313 MiB (32 KiB, 32,768 B, 3.051758e-5 GiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
last orderMay 31, 2013 +
last shipmentNovember 8, 2013 +
ldateApril 11, 2011 +
main imageFile:lincroft chips.png +
manufacturerIntel +
market segmentMobile +
max case temperature343.15 K (70 °C, 158 °F, 617.67 °R) +
max cpu count1 +
max junction temperature363.15 K (90 °C, 194 °F, 653.67 °R) +
max memory2,048 MiB (2,097,152 KiB, 2,147,483,648 B, 2 GiB, 0.00195 TiB) +
max memory channels1 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureBonnell +
min case temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature218.15 K (-55 °C, -67 °F, 392.67 °R) +
model numberZ670 +
nameAtom Z670 +
packageFCBGA-518 +
part numberAY80609007293AA +
platformOak Trail +
process45 nm (0.045 μm, 4.5e-5 mm) +
release price$ 75.00 (€ 67.50, £ 60.75, ¥ 7,749.75) +
s-specSLC2P +
seriesZ650 +
socketBGA-518 +
supported memory typeDDR-400 + and DDR2-800 +
tdp3 W (3,000 mW, 0.00402 hp, 0.003 kW) +
technologyCMOS +
thread count2 +
word size32 bit (4 octets, 8 nibbles) +