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- ...microprocessors of the [[amd/k6|K6]] family. Other members used the [[amd/packages/super socket 7|CPGA-321]] and {{\\|CBGA-360}} package.2 KB (309 words) - 18:42, 25 July 2020
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2 KB (295 words) - 04:45, 2 December 2016
- ...ned by [[Intel]] for their {{intel|5 Series}} chipset. It's considered a {{packages|Socket-G1}} type although it's not socket-mounted and is instead permanentl2 KB (274 words) - 18:31, 1 December 2016
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2 KB (275 words) - 22:17, 12 April 2017
- |predecessor link=amd/packages/socket fm2+ |predecessor 2 link=amd/packages/socket am3+30 KB (6,098 words) - 01:58, 12 January 2024
- #REDIRECT [[amd/packages/socket am4]]37 bytes (5 words) - 08:59, 21 July 2020
- #REDIRECT [[intel/packages/lga-1567]]37 bytes (4 words) - 02:06, 10 January 2017
- #REDIRECT [[amd/packages/socket am4]]37 bytes (5 words) - 08:59, 21 July 2020
- ...s socket accepts Intel's 1151-pin flip-chip land grid array (FCLGA-1151) [[packages]]. This socket is used for Intel's 6th generation, 7th generation, and 8th2 KB (343 words) - 01:34, 6 September 2019
- |successor link=amd/packages/socket strx4 |successor 2 link=amd/packages/socket swrx886 KB (17,313 words) - 02:48, 13 March 2023
- #REDIRECT [[amd/packages/socket_tr4]]37 bytes (5 words) - 14:52, 11 August 2018
- |predecessor link=amd/packages/socket g34 |successor link=amd/packages/socket sp5110 KB (21,122 words) - 02:46, 13 March 2023
- * Lidded and lidless (mobile processors) packages OPGA-754 lidded package. Pin AG10 MEMRESET_L is NC on lidless packages.5 KB (662 words) - 09:51, 29 January 2020
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4 KB (576 words) - 15:27, 30 January 2020
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4 KB (490 words) - 22:47, 9 February 2020
- #REDIRECT [[amd/packages/socket strx4]]39 bytes (5 words) - 17:07, 15 April 2022
- #REDIRECT [[amd/packages/socket swrx8]]39 bytes (5 words) - 17:08, 15 April 2022
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7 KB (1,029 words) - 18:40, 22 February 2020
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8 KB (1,212 words) - 19:01, 22 February 2020
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12 KB (1,960 words) - 12:23, 18 July 2020
Page text matches
- ...edia Interface}} 1.0. All processors use [[packages/socket-g1|PGA-988]] ([[packages/socket-g1|Socket G1]]) packaging. They all have the following features: ...face}} 1.0 and introduced {{x86|AES}} instructions. These processors use {{packages|Socket-G1}}. They all have the following features:43 KB (5,739 words) - 21:30, 22 April 2024
- ...is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard [[printed circuit board]]s and can be replace ...d, high density ceramic substrates or organic laminate. Additionally fcBGA packages are often offered in bare die, flat lid, and full lid configuration. They a2 KB (239 words) - 07:17, 17 December 2013
- |package module 1={{packages/pdip-28}} |package module 2={{packages/cdip-28}}617 bytes (77 words) - 16:03, 13 December 2017
- ...h the [[Intel 4004]]. The chip came in 16-pin [[Dual in-line package|DIP]] packages. The HD35404 was part of the [[Hitachi HMCS-4]], an [[Intel MCS-4]] clone.1 KB (157 words) - 01:34, 24 December 2015
- ...ters may be formed by powering selected LED elements. SSDs come in various packages and pin arranges.4 KB (490 words) - 09:47, 24 July 2019
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1 KB (209 words) - 20:19, 26 November 2015
- ...packages]]. Most designers are thus restricted to one of those pre-defined packages. Sometimes the device that's designed does not utilize all the pins for var2 KB (238 words) - 20:56, 26 November 2015
- |package module 1={{packages/intel/fcbga-1364}}4 KB (404 words) - 16:22, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}3 KB (401 words) - 14:24, 12 February 2019
- |package module 1={{packages/intel/fcbga-1364}}3 KB (399 words) - 16:22, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}3 KB (400 words) - 16:22, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}3 KB (399 words) - 16:22, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}3 KB (386 words) - 09:14, 26 December 2017
- |package module 1={{packages/intel/fcbga-1364}}3 KB (401 words) - 16:22, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}3 KB (397 words) - 16:22, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}3 KB (398 words) - 16:22, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}4 KB (406 words) - 16:22, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}4 KB (404 words) - 16:19, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}3 KB (401 words) - 16:19, 13 December 2017
- |package module 1={{packages/intel/fcbga-1364}}3 KB (396 words) - 16:22, 13 December 2017