This property describes a integrated circuit package type. Examples are:

• Flip-Chip Organic Land Grid Array (FC-OLGA)
• Organic Micro Ball Grid Array
• Ceramic Pin Grid Array (CPGA)

Only an abbreviation may be specified.

See also

• Property:socket
• Property:package
• Property:package type
• Property:package length
• Property:package width
• Property:package height
• Property:package contacts
• Property:package pitch

Pages using the property "package type"

Showing 25 pages using this property.

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C
Core i7-9850H - Intel#package +	BGA  +
Core i9-8950HK - Intel#package +	BGA  +
Core i9-9880H - Intel#package +	BGA  +
Core i9-9900 - Intel#package +	LGA  +
Core i9-9900K - Intel#package +	LGA  +
Core i9-9900KF - Intel#package +	LGA  +
Core i9-9900KS - Intel#package +	LGA  +
Core i9-9900T - Intel#package +	LGA  +
Core i9-9980HK - Intel#package +	BGA  +
D
Denverton - Cores - Intel#package +	BGA  +
E
eMAG 8180 - Ampere#package +	BGA  +
G
GAP8 - GreenWaves#package +	aQFN  +
Gemini Lake - Cores - Intel#package +	BGA  +
K
K3V1 - HiSilicon#package +	TFBGA  +
K3V2 - HiSilicon#package +	TFBGA  +
K3V2E - HiSilicon#package +	TFBGA  +
Kaby Lake R - Cores - Intel#package +	BGA  +
Kaby Lake U - Cores - Intel#package +	BGA  +
M
Matrix-2000 - NUDT#package +	CLGA  +
P
Package ASB1 - AMD +	Organic Micro Ball Grid Array  +
Package ASB2 - AMD +	Organic Micro Ball Grid Array  +
Package CBGA-360 - AMD +	Ceramic Ball Grid Array  +
Package FP2 - AMD +	Organic Micro Ball Grid Array  +
Package FP3 - AMD +	Organic Micro Ball Grid Array  +
Package FP4 - AMD +	Organic Micro Ball Grid Array  +