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Zen 5 - Microarchitectures - AMD
| Edit Values | |
| Zen 5 µarch | |
| General Info | |
| Arch Type | CPU |
| Designer | AMD |
| Manufacturer | TSMC |
| Introduction | 2024 |
| Process | 4 nm, N4X |
| Core Configs | 256, 224, 192, 144, 128, 96, 72, 64, 56, 48, 32, 28, 36, 24, 18, 16, 8, 6 |
| PE Configs | 512, 448, 384, 288, 256, 192, 144, 128, 112, 96, 64, 56, 60, 40, 30, 20 |
| Pipeline | |
| Type | Superscalar |
| OoOE | Yes |
| Speculative | Yes |
| Reg Renaming | Yes |
| Instructions | |
| ISA | AMD64, x86-64 |
| Extensions | AMX, AVX, AVX2, AVX-512 |
| Cores | |
| Core Names | Turin, Da Vinci, Granite Ridge, Strix Point |
| Succession | |
Zen 5 is a microarchitecture Already released and sold being by AMD as a successor to Zen 4
Contents
History
Zen 5 was first mentioned by lead architect Michael Clark during a discussion on April 9th, 2018 [1]
Codenames
Product Codenames:
| Core | Model | C/T | Target |
|---|---|---|---|
| Turin | EPYC 9005 | Up to 192/384 | High-end EPYC 5th Gen series server multiprocessors |
| Turin Dense | EPYC 9005 | Up to 192/384 | |
| Shimada Peak | Ryzen 9000 | Up to ?/? | Threadripper Workstation & enthusiasts market processors |
| Granite Ridge | Ryzen 9000 | Up to ?/? | Mainstream to high-end desktops & enthusiasts market processors (Gaming Desktop CPU) |
| Fire Range | Ryzen 9000 | Up to ?/? | |
| Strix Point | Ryzen AI 300 | Up to ?/? | Mainstream desktop & mobile processors with GPU (Gaming APU with RDNA3 or RDNA4) |
| Strix Halo | Ryzen AI 300 | Up to ?/? | |
| Krackan Point | Ryzen AI 300 | Up to ?/? | |
| Sonoma Valley | Ryzen APU Family | Up to ?/? | AMD Low-end Ryzen APU Family, Samsung 4 nm (TSMC) (Zen 5c Quad-core CPU, RDNA3 2CU GPU, TDP 35W) |
The Zen 5 microarchitecture powers Ryzen 9000 series desktop processors (codenamed "Granite Ridge"), Epyc 9005 server
- processors (codenamed "Turin"), and Ryzen AI 300 thin and light mobile processors (codenamed "Strix Point").
- Turin • AMD EPYC 9005 Series
- Shimada Peak • AMD Ryzen 9000 Series
- Granite Ridge • AMD Ryzen 9000 Series
- Fire Range • AMD Ryzen 9000 Series
- Strix Halo • AMD Ryzen AI 300 Series
- Strix Point • AMD Ryzen AI 300 Series
- Krackan Point • AMD Ryzen AI 300 Series
- Sonoma Valley • AMD Low-end Ryzen APU Family
Architectural Codenames:
| Arch | Codename |
|---|---|
| Core | Nirvana |
| CCD | Eldora |
- Comparison
| Core | Zen | Zen+ | Zen 2 | Zen 3 | Zen 3+ | Zen 4 | Zen 4c | Zen 5 | Zen 5c | Zen 6 | Zen 6c | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Codename | Core | Valhalla | Cerberus | Persephone | Dionysus | Nirvana | Prometheus | Morpheus | Monarch | |||
| CCD | Aspen Highlands |
Breckenridge | Durango | Vindhya | Eldora | |||||||
| Cores (threads) |
CCD | 8 (16) | 8 (16) | 16 (32) | ||||||||
| CCX | 8 (16) | 8 (16) | 8 (16) | |||||||||
| L3 cache | CCD | 32 MB | 32 MB | 32 MB | 32 MB | |||||||
| CCX | 32 MB | 32 MB | 16 MB | 32 MB | ||||||||
| Die size | CCD area | 44 mm2 | 66.3 mm2 | 72.7 mm2 | 70.6 mm2 | |||||||
| Core area | 7 mm2 (14 nm) |
(12 nm) | (7 nm) | (7 nm) | (7 nm) | 3.84 mm2 (5 nm) |
2.48 mm2 (5 nm) |
(4 nm) | (3 nm) | (2 nm) | (2 nm) | |
Models
- Zen Series
- Zen
- Zen+
- Zen 2 (Valhalla)
Process Technology
Zen 5 is to be produced on a 4nm process,Zen 5c is to be produced on a 3nm process.
Architecture
LITTLE design - Improved 16% IPC and clock speed - possibly more L3 cache per chiplet
Key changes from Zen 4
 |
This section is empty; you can help add the missing info by editing this page. |
Designers
- David Suggs, chief architect
Bibliography
See also
- AMD Zen • Ryzen
- Intel Meteor Lake
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Facts about "Zen 5 - Microarchitectures - AMD"
| codename | Zen 5 + |
| core count | 256 +, 224 +, 192 +, 144 +, 128 +, 96 +, 72 +, 64 +, 56 +, 48 +, 32 +, 28 +, 36 +, 24 +, 18 +, 16 +, 8 + and 6 + |
| designer | AMD + |
| first launched | 2024 + |
| full page name | amd/microarchitectures/zen 5 + |
| instance of | microarchitecture + |
| instruction set architecture | AMD64 + and x86-64 + |
| manufacturer | TSMC + |
| microarchitecture type | CPU + |
| name | Zen 5 + |
| process | 4 nm (0.004 μm, 4.0e-6 mm) + |
| processing element count | 512 +, 448 +, 384 +, 288 +, 256 +, 192 +, 144 +, 128 +, 112 +, 96 +, 64 +, 56 +, 60 +, 40 +, 30 + and 20 + |